Works matching IS 03615235 AND DT 2013 AND VI 42 AND IP 8
Results: 40
Synthesis, Structural and Optical Characterization of Sol-Gel-Derived Y-Doped Mesoporous CeO.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2549, doi. 10.1007/s11664-013-2622-z
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A Facile Synthesis of a Palladium-Doped Polyaniline-Modified Carbon Nanotube Composites for Supercapacitors.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2595, doi. 10.1007/s11664-013-2562-7
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Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2658, doi. 10.1007/s11664-013-2612-1
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Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2641, doi. 10.1007/s11664-013-2603-2
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Improvement in the Bias Stability of Zinc-Tin Oxide Thin-Film Transistors by Hafnium Doping.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2470, doi. 10.1007/s11664-013-2618-8
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Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid-Liquid Interdiffusion (SLID) Bonding.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2677, doi. 10.1007/s11664-013-2614-z
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Investigation of Characteristics of AlO/ n-InGaAs ( x = 0.53, 0.7, and 1) Metal-Oxide-Semiconductor Structures.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2439, doi. 10.1007/s11664-013-2616-x
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Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2606, doi. 10.1007/s11664-013-2575-2
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Thermoelectric Properties of CaDyCoO with x = 0.00, 0.02, 0.05, and 0.10.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2582, doi. 10.1007/s11664-013-2634-8
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Thermal Decomposition of Thermoelectric Material CoSb: A Thermogravimetry Kinetic Analysis.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2574, doi. 10.1007/s11664-013-2633-9
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Copper Wire Bonding Concerns and Best Practices.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2415, doi. 10.1007/s11664-013-2576-1
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Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2708, doi. 10.1007/s11664-013-2620-1
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Comparison of Phase Shifting Techniques for Measuring In-Plane Residual Stress in Thin, Flat Silicon Wafers.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2478, doi. 10.1007/s11664-013-2630-z
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Thick InGaN Films Prepared by Reactive Sputtering with Single Cermet Targets.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2445, doi. 10.1007/s11664-013-2635-7
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Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2648, doi. 10.1007/s11664-013-2609-9
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Influence of Interference on Extraction Efficiency of Ultraviolet Vertical Light-Emitting Diodes.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2435, doi. 10.1007/s11664-013-2611-2
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Ultrafast UV-Curable Adhesives for Optical Pick-Ups.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2525, doi. 10.1007/s11664-013-2610-3
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Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally Stable Contacts to InSb.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2615, doi. 10.1007/s11664-013-2599-7
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Heraclenin: A Potential Optoelectronic Device Material from Prangos pabularia.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2498, doi. 10.1007/s11664-013-2596-x
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Mixed-Alkali Effect in LiO-NaO-KO-BO Glasses: Infrared and Optical Absorption Studies.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2516, doi. 10.1007/s11664-013-2605-0
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Thermoelectric Properties of YAgBaCoO Ceramics.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2570, doi. 10.1007/s11664-013-2631-y
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Theoretical Study on Structural Stability of Fully Filled p-Type Skutterudites RETMSb ( RE = Rare Earth; TM = Fe, Ru).
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2492, doi. 10.1007/s11664-013-2594-z
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Quantum Theory of the Burns Temperature in Barium Titanate.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2560, doi. 10.1007/s11664-013-2626-8
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Dielectric and Pyroelectric Properties of La- and Pr-Modified Tungsten-Bronze Ferroelectrics.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2587, doi. 10.1007/s11664-013-2637-5
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A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2686, doi. 10.1007/s11664-013-2615-y
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Temperature Stability of VO-Doped KNN-LS-BF Lead-Free Piezoelectric Ceramics.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2556, doi. 10.1007/s11664-013-2624-x
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Structural and Carrier Dynamics of GaN and AlGaN-Based Double Heterostructures in the UV Region.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2486, doi. 10.1007/s11664-013-2632-x
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PIN-PMN-PT Single-Crystal-Based 1-3 Piezoelectric Composites for Ultrasonic Transducer Applications.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2564, doi. 10.1007/s11664-013-2627-7
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Dynamical X-ray Diffraction from InGaAs Heterostructures with Dislocations.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2450, doi. 10.1007/s11664-013-2595-y
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A Feature-Scale Greenwood-Williamson Model for Metal Chemical Mechanical Planarization.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2630, doi. 10.1007/s11664-013-2601-4
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Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2667, doi. 10.1007/s11664-013-2613-0
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Atomistic Simulation of Strain-Induced Domain Evolution in a Uniaxially Compressed BaTiO Single-Crystal Nanofilm.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2504, doi. 10.1007/s11664-013-2597-9
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Resistive Switching Properties of Sol-Gel-Derived V-Doped SrTiO Thin Films.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2510, doi. 10.1007/s11664-013-2600-5
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Improvement of the Crystallinity of Silicon Films Deposited by Hot-Wire Chemical Vapor Deposition with Negative Substrate Bias.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2464, doi. 10.1007/s11664-013-2608-x
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Effects of Growth Temperature and Annealing on Properties of ZnSnO Thin Films and Application in TFTs.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2459, doi. 10.1007/s11664-013-2589-9
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Structure and Optical Properties of CeO Nanoparticles Synthesized by Precipitation.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2536, doi. 10.1007/s11664-013-2617-9
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Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2696, doi. 10.1007/s11664-013-2619-7
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Effect of Ti Concentration on the Growth of NbSn Between Solid Nb(Ti) and Liquid Sn.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2716, doi. 10.1007/s11664-013-2629-5
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Low-Temperature Sintering of BaSrTiO-SrMoO Dielectric Tunable Composite Ceramics for LTCC Applications.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2542, doi. 10.1007/s11664-013-2621-0
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Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2724, doi. 10.1007/s11664-013-2639-3
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