Works matching IS 03615235 AND DT 2013 AND VI 42 AND IP 8

Results: 40

A Facile Synthesis of a Palladium-Doped Polyaniline-Modified Carbon Nanotube Composites for Supercapacitors.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2595, doi. 10.1007/s11664-013-2562-7

By:

Giri, Soumen;
Ghosh, Debasis;
Malas, Asish;
Das, Chapal

Publication type:

Article

Synthesis, Structural and Optical Characterization of Sol-Gel-Derived Y-Doped Mesoporous CeO.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2549, doi. 10.1007/s11664-013-2622-z

By:

Lee, Ying;
Li, Kun-Dar;
Lu, Cheng-Hsueh;
Shen, Jung-Hsiung;
Teoh, Lay;
Chiang, Ghi

Publication type:

Article

Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2658, doi. 10.1007/s11664-013-2612-1

By:

Schmitz, G.J.;
Zhou, B.;
Böttger, B.;
Klima, S.;
Villain, J.

Publication type:

Article

Microstructure Evolution of Cu-Cored Sn Solder Joints Under High Temperature and High Current Density.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2641, doi. 10.1007/s11664-013-2603-2

By:

Sa, Xianzhang;
Wu, Ping

Publication type:

Article

Improvement in the Bias Stability of Zinc-Tin Oxide Thin-Film Transistors by Hafnium Doping.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2470, doi. 10.1007/s11664-013-2618-8

By:

Han, Dong-Suk;
Park, Jae-Hyung;
Kang, Yu-Jin;
Park, Jong-Wan

Publication type:

Article

Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid-Liquid Interdiffusion (SLID) Bonding.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2677, doi. 10.1007/s11664-013-2614-z

By:

Rodriguez, Rogie;
Ibitayo, Dimeji;
Quintero, Pedro

Publication type:

Article

Investigation of Characteristics of AlO/ n-InGaAs ( x = 0.53, 0.7, and 1) Metal-Oxide-Semiconductor Structures.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2439, doi. 10.1007/s11664-013-2616-x

By:

Trinh, Hai-Dang;
Lin, Yueh-Chin;
Kuo, Chien-I;
Chang, Edward;
Nguyen, Hong-Quan;
Wong, Yuen-Yee;
Yu, Chih-Chieh;
Chen, Chi-Ming;
Chang, Chia-Yuan;
Wu, Jyun-Yi;
Chiu, Han-Chin;
Yu, Terrence;
Chang, Hui-Cheng;
Tsai, Joseph;
Hwang, David

Publication type:

Article

Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2606, doi. 10.1007/s11664-013-2575-2

By:

Srinivas, Vikram;
Menon, Sandeep;
Osterman, Michael;
Pecht, Michael

Publication type:

Article

Thermoelectric Properties of CaDyCoO with x = 0.00, 0.02, 0.05, and 0.10.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2582, doi. 10.1007/s11664-013-2634-8

By:

Bhaskar, Ankam;
Jhang, C.-S.;
Liu, Chia-Jyi

Publication type:

Article

Thermal Decomposition of Thermoelectric Material CoSb: A Thermogravimetry Kinetic Analysis.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2574, doi. 10.1007/s11664-013-2633-9

By:

Wu, Fang;
He, Qingli;
Hu, Dinxu;
Gao, Feng;
Song, Hongzhang;
Jia, Jianfeng;
Hu, Xing

Publication type:

Article

Copper Wire Bonding Concerns and Best Practices.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2415, doi. 10.1007/s11664-013-2576-1

By:

Chauhan, Preeti;
Zhong, Z.;
Pecht, Michael

Publication type:

Article

Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2708, doi. 10.1007/s11664-013-2620-1

By:

Chen, Xu;
Xue, Feng;
Zhou, Jian;
Liu, Sidong;
Qian, Guotong

Publication type:

Article

Comparison of Phase Shifting Techniques for Measuring In-Plane Residual Stress in Thin, Flat Silicon Wafers.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2478, doi. 10.1007/s11664-013-2630-z

By:

Prasath, R.;
Skenes, K.;
Danyluk, S.

Publication type:

Article

Thick InGaN Films Prepared by Reactive Sputtering with Single Cermet Targets.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2445, doi. 10.1007/s11664-013-2635-7

By:

Li, Cheng-Che;
Kuo, Dong-Hau;
Hsieh, Pin-Wei;
Huang, Ying-Sheng

Publication type:

Article

Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2648, doi. 10.1007/s11664-013-2609-9

By:

Huang, Chih-Kai;
Lin, Keh-Wen;
Huang, Yu-Ming;
Caparanga, Alvin;
Leron, Rhoda;
Li, Meng-Hui

Publication type:

Article

Influence of Interference on Extraction Efficiency of Ultraviolet Vertical Light-Emitting Diodes.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2435, doi. 10.1007/s11664-013-2611-2

By:

Kim, Seung;
Song, Young;
Jeon, Seong;
Yang, Gye;
Ha, Jun;
Lee, Sang;
Baek, Jong;
Park, Hyung

Publication type:

Article

Ultrafast UV-Curable Adhesives for Optical Pick-Ups.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2525, doi. 10.1007/s11664-013-2610-3

By:

Chung, Chang-Kyu;
Jang, Kyung-Woon;
Choi, Hyoung;
Jang, Jiyoung;
Moon, Youngjun;
Jeon, Chulho

Publication type:

Article

Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally Stable Contacts to InSb.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2615, doi. 10.1007/s11664-013-2599-7

By:

Cao, Zhanmin;
Xie, Wei;
Wang, Kunpeng;
Du, Guangwei;
Qiao, Zhiyu

Publication type:

Article

Heraclenin: A Potential Optoelectronic Device Material from Prangos pabularia.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2498, doi. 10.1007/s11664-013-2596-x

By:

Banday, Javid;
Bhat, Ghulam;
Mir, Feroz;
Qurishi, Mushtaq;
Koul, Surinder;
Razdan, Tej

Publication type:

Article

Mixed-Alkali Effect in LiO-NaO-KO-BO Glasses: Infrared and Optical Absorption Studies.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2516, doi. 10.1007/s11664-013-2605-0

By:

Samee, M.A.;
Edukondalu, A.;
Ahmmad, Shaik;
Taqiullah, Sair;
Rahman, Syed

Publication type:

Article

Thermoelectric Properties of YAgBaCoO Ceramics.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2570, doi. 10.1007/s11664-013-2631-y

By:

He, Q.;
Zhang, J.;
Gao, F.;
Wu, F.;
Hu, X.;
Song, H.

Publication type:

Article

Theoretical Study on Structural Stability of Fully Filled p-Type Skutterudites RETMSb ( RE = Rare Earth; TM = Fe, Ru).

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2492, doi. 10.1007/s11664-013-2594-z

By:

Chen, Zhuo;
Yang, Jiong;
Liu, Ruiheng;
Xi, Lili;
Zhang, Wenqing;
Yang, Jihui

Publication type:

Article

Quantum Theory of the Burns Temperature in Barium Titanate.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2560, doi. 10.1007/s11664-013-2626-8

By:

Mahan, G.D.

Publication type:

Article

Dielectric and Pyroelectric Properties of La- and Pr-Modified Tungsten-Bronze Ferroelectrics.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2587, doi. 10.1007/s11664-013-2637-5

By:

Parida, B.;
Das, Piyush;
Padhee, R.;
Choudhary, R.

Publication type:

Article

A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2686, doi. 10.1007/s11664-013-2615-y

By:

Ma, Hai-Tao;
Wang, Jie;
Qu, Lin;
Zhao, Ning;
Kunwar, A.

Publication type:

Article

Temperature Stability of VO-Doped KNN-LS-BF Lead-Free Piezoelectric Ceramics.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2556, doi. 10.1007/s11664-013-2624-x

By:

Wang, Hua;
Zhai, Xia;
Xu, Ji-Wen;
Yuan, Chang-Lai;
Yang, Ling

Publication type:

Article

Structural and Carrier Dynamics of GaN and AlGaN-Based Double Heterostructures in the UV Region.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2486, doi. 10.1007/s11664-013-2632-x

By:

Arivazhagan, Ponnusamy;
Ramesh, Raju;
Jayasakthi, Mathaiyan;
Loganathan, Ravi;
Balaji, Manavaimaran;
Baskar, Krishnan

Publication type:

Article

PIN-PMN-PT Single-Crystal-Based 1-3 Piezoelectric Composites for Ultrasonic Transducer Applications.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2564, doi. 10.1007/s11664-013-2627-7

By:

Li, Lili;
Xu, Zhuo;
Xia, Song;
Li, Zhengrong;
Ji, Xuanrong;
Long, Shaojun

Publication type:

Article

Dynamical X-ray Diffraction from InGaAs Heterostructures with Dislocations.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2450, doi. 10.1007/s11664-013-2595-y

By:

Rago, P.;
Ayers, J.

Publication type:

Article

A Feature-Scale Greenwood-Williamson Model for Metal Chemical Mechanical Planarization.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2630, doi. 10.1007/s11664-013-2601-4

By:

Xu, Qinzhi;
Chen, Lan

Publication type:

Article

Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2667, doi. 10.1007/s11664-013-2613-0

By:

Sharif, Ahmed;
Lim, Jun;
Made, Riko;
Lau, Fu;
Phua, Eric;
Lim, Ju;
Wong, Chee;
Gan, Chee;
Chen, Zhong

Publication type:

Article

Atomistic Simulation of Strain-Induced Domain Evolution in a Uniaxially Compressed BaTiO Single-Crystal Nanofilm.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2504, doi. 10.1007/s11664-013-2597-9

By:

Tian, Xiao;
Yang, Xin;
Cao, Wei

Publication type:

Article

Resistive Switching Properties of Sol-Gel-Derived V-Doped SrTiO Thin Films.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2510, doi. 10.1007/s11664-013-2600-5

By:

Tang, Zhen;
Xiong, Ying;
Xu, Ding;
Tang, Ming;
Wang, Zi;
Xiao, Yong;
Zeng, Bo;
Gu, Xiao;
Li, Jian;
Wang, Long

Publication type:

Article

Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2724, doi. 10.1007/s11664-013-2639-3

By:

Tian, Ye;
Liu, Xi;
Chow, Justin;
Wu, Yi;
Sitaraman, Suresh

Publication type:

Article

Improvement of the Crystallinity of Silicon Films Deposited by Hot-Wire Chemical Vapor Deposition with Negative Substrate Bias.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2464, doi. 10.1007/s11664-013-2608-x

By:

Zhang, Lei;
Shen, Honglie;
You, Jiayi

Publication type:

Article

Structure and Optical Properties of CeO Nanoparticles Synthesized by Precipitation.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2536, doi. 10.1007/s11664-013-2617-9

By:

Liu, I-Tsan;
Hon, Min-Hsiung;
Teoh, Lay

Publication type:

Article

Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2696, doi. 10.1007/s11664-013-2619-7

By:

Satyanarayan;
Prabhu, K.

Publication type:

Article

Effect of Ti Concentration on the Growth of NbSn Between Solid Nb(Ti) and Liquid Sn.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2716, doi. 10.1007/s11664-013-2629-5

By:

Santra, Sangeeta;
Paul, Aloke

Publication type:

Article

Low-Temperature Sintering of BaSrTiO-SrMoO Dielectric Tunable Composite Ceramics for LTCC Applications.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2542, doi. 10.1007/s11664-013-2621-0

By:

Tang, Linjiang;
Wang, Jinwen;
Zhai, Jiwei

Publication type:

Article

Effects of Growth Temperature and Annealing on Properties of ZnSnO Thin Films and Application in TFTs.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2459, doi. 10.1007/s11664-013-2589-9

By:

Chen, Yong-Yue;
Cai, Xi-Kun;
Ye, Zhen-Yu;
Wang, Xiong;
Zhang, Bing-Po;
Wu, Hui-Zhen

Publication type:

Article