Works matching IS 03615235 AND DT 2013 AND VI 42 AND IP 7
1
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1737, doi. 10.1007/s11664-012-2407-9
- Wu, Hongfei;
- Sun, Kai;
- Zhang, Junjun;
- Xing, Yan
- Article
2
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1499, doi. 10.1007/s11664-012-2298-9
- Martínez, A.;
- Astrain, D.;
- Rodríguez, A.;
- Pérez, G.
- Article
3
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1358, doi. 10.1007/s11664-012-2212-5
- Article
4
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1745, doi. 10.1007/s11664-012-2408-8
- Article
5
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1864, doi. 10.1007/s11664-012-2451-5
- Navrátil, J.;
- Plecháček, T.;
- Drašar, Č.;
- Laufek, F.
- Article
6
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2287, doi. 10.1007/s11664-013-2644-6
- Gallo, A.;
- Arana, A.;
- Oyanguren, A.;
- García, G.;
- Barbero, A.;
- Larrañaga, J.;
- Ulacia, I.
- Article
7
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1900, doi. 10.1007/s11664-012-2460-4
- Phillip, Navneesh;
- Maganga, Othman;
- Burnham, Keith;
- Ellis, Mark;
- Robinson, Simon;
- Dunn, Julian;
- Rouaud, Cedric
- Article
8
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1449, doi. 10.1007/s11664-012-2287-z
- Samarelli, A.;
- Llin, L.;
- Zhang, Y.;
- Weaver, J.;
- Dobson, P.;
- Cecchi, S.;
- Chrastina, D.;
- Isella, G.;
- Etzelstorfer, T.;
- Stangl, J.;
- Gubler, E.;
- Paul, D.J.
- Article
9
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1771, doi. 10.1007/s11664-012-2423-9
- Nashchekina, O.;
- Rogacheva, E.;
- Vodorez, O.
- Article
10
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2257, doi. 10.1007/s11664-013-2607-y
- Kitte, J.;
- Beck, F.;
- Jänsch, D.
- Article
11
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1641, doi. 10.1007/s11664-012-2360-7
- Bauknecht, Andreas;
- Steinert, Torsten;
- Spengler, Carsten;
- Suck, Gerrit
- Article
12
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2239, doi. 10.1007/s11664-013-2591-2
- Article
13
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1604, doi. 10.1007/s11664-012-2331-z
- Kyratsi, Theodora;
- Ioannou, Maria
- Article
14
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1582, doi. 10.1007/s11664-012-2327-8
- Crane, Doug;
- LaGrandeur, John;
- Jovovic, Vladimir;
- Ranalli, Marco;
- Adldinger, Martin;
- Poliquin, Eric;
- Dean, Joe;
- Kossakovski, Dmitri;
- Mazar, Boris;
- Maranville, Clay
- Article
15
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1324, doi. 10.1007/s11664-012-2439-1
- Budnik, A.;
- Rogacheva, E.;
- Pinegin, V.;
- Sipatov, A.;
- Fedorov, A.
- Article
16
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2371, doi. 10.1007/s11664-012-2457-z
- Demmel, P.;
- Pazureck, A.;
- Golle, R.;
- Volk, W.;
- Hoffmann, H.
- Article
17
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1389, doi. 10.1007/s11664-012-2261-9
- Salvador, James;
- Cho, Jung;
- Ye, Zuxin;
- Moczygemba, Joshua;
- Thompson, Alan;
- Sharp, Jeffrey;
- König, Jan;
- Maloney, Ryan;
- Thompson, Travis;
- Sakamoto, Jeffrey;
- Wang, Hsin;
- Wereszczak, Andrew;
- Meisner, Gregory
- Article
18
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1669, doi. 10.1007/s11664-012-2364-3
- Morschel, Marlis;
- Bastian, Georg
- Article
19
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1369, doi. 10.1007/s11664-012-2241-0
- García-Cañadas, Jorge;
- Powell, Anthony;
- Kaltzoglou, Andreas;
- Vaqueiro, Paz;
- Min, Gao
- Article
20
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2343, doi. 10.1007/s11664-012-2435-5
- Picard, M.;
- Turenne, S.;
- Vasilevskiy, D.;
- Masut, R.
- Article
21
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1458, doi. 10.1007/s11664-012-2289-x
- Yu, Rui;
- Yang, Shuyong;
- Zhai, Pengcheng;
- Liu, Lisheng
- Article
22
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2301, doi. 10.1007/s11664-012-2411-0
- Elefsiniotis, A.;
- Samson, D.;
- Becker, Th.;
- Schmid, U.
- Article
23
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2198, doi. 10.1007/s11664-013-2570-7
- Brazdil, Marian;
- Pospisil, Jiri
- Article
24
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2274, doi. 10.1007/s11664-013-2642-8
- Tatarinov, Dimitri;
- Koppers, M.;
- Bastian, G.;
- Schramm, D.
- Article
25
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1436, doi. 10.1007/s11664-012-2285-1
- Zhou, Hong-Yu;
- Zhao, Wen-Yu;
- Liu, Gang;
- Cheng, Hong;
- Zhang, Qing-Jie
- Article
26
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1926, doi. 10.1007/s11664-013-2476-4
- Sadia, Yatir;
- Dinnerman, Liron;
- Gelbstein, Yaniv
- Article
27
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1796, doi. 10.1007/s11664-012-2432-8
- Lukyanova, L.;
- Boikov, Yu.;
- Danilov, V.;
- Volkov, M.;
- Kutasov, V.
- Article
28
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1335, doi. 10.1007/s11664-012-2443-5
- Miyazaki, Yuzuru;
- Ogawa, Hidenori;
- Nakajo, Takaki;
- Kikuchii, Yuta;
- Hayashi, Kei
- Article
29
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2110, doi. 10.1007/s11664-013-2536-9
- Bulat, L.;
- Drabkin, I.;
- Karatayev, V.;
- Osvenskii, V.;
- Parkhomenko, Yu.;
- Lavrentev, M.;
- Sorokin, A.;
- Pshenai-Severin, D.;
- Blank, V.;
- Pivovarov, G.;
- Bublik, V.;
- Tabachkova, N.
- Article
30
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1400, doi. 10.1007/s11664-012-2265-5
- Yu, Jian;
- Zhao, Wen-Yu;
- Lei, Bing;
- Tang, Ding-Guo;
- Zhang, Qing-Jie
- Article
31
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2020, doi. 10.1007/s11664-013-2507-1
- Famengo, A.;
- Battiston, S.;
- Saleemi, M.;
- Boldrini, S.;
- Fiameni, S.;
- Agresti, F.;
- Toprak, M.;
- Barison, S.;
- Fabrizio, M.
- Article
32
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2178, doi. 10.1007/s11664-013-2565-4
- Yim, Ju-Hyuk;
- Baek, Seung-Hyub;
- Shin, Hyun-Yong;
- Hyun, Dow;
- Kim, Jin-Sang
- Article
33
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1617, doi. 10.1007/s11664-012-2356-3
- Lee, Kyu-Hyoung;
- Hwang, Sungwoo;
- Ryu, Byungki;
- Ahn, Kyunghan;
- Roh, Jongwook;
- Yang, Daejin;
- Lee, Sang-Mock;
- Kim, Hyunsik;
- Kim, Sang-Il
- Article
34
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1974, doi. 10.1007/s11664-013-2485-3
- Article
35
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1814, doi. 10.1007/s11664-012-2438-2
- Uchino, M.;
- Kato, K.;
- Hagino, H.;
- Miyazaki, K.
- Article
36
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1918, doi. 10.1007/s11664-013-2470-x
- Dávila, Diana;
- Tarancón, Albert;
- Calaza, Carlos;
- Salleras, Marc;
- Fernández-Regúlez, Marta;
- Paulo, Alvaro;
- Fonseca, Luis
- Article
37
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1469, doi. 10.1007/s11664-012-2291-3
- Quan, Rui;
- Tang, Xinfeng;
- Quan, Shuhai;
- Huang, Liang
- Article
38
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2157, doi. 10.1007/s11664-013-2557-4
- Sun, Kai;
- Ni, Longxian;
- Chen, Min;
- Wu, Hongfei;
- Xing, Yan;
- Rosendahl, Lasse
- Article
39
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2084, doi. 10.1007/s11664-013-2532-0
- Takeuchi, Tsunehiro;
- Terazawa, Yuichi;
- Furuta, Yukihiro;
- Yamamoto, Akio;
- Mikami, Masashi
- Article
40
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1846, doi. 10.1007/s11664-012-2449-z
- Juanicó, Luis;
- Rinalde, Fabián;
- Taglialavore, Eduardo;
- Molina, Marcelo
- Article
41
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2172, doi. 10.1007/s11664-013-2564-5
- Nabatame, Yuta;
- Matsumoto, Tsuyoshi;
- Ichige, Yuki;
- Komine, Takashi;
- Sugita, Ryuji;
- Murata, Masayuki;
- Hasegawa, Yasuhiro
- Article
42
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1411, doi. 10.1007/s11664-012-2280-6
- Hwang, Sungwoo;
- Kim, Sang-Il;
- Ahn, Kyunghan;
- Roh, Jong;
- Yang, Dae-Jin;
- Lee, Sang-Mock;
- Lee, Kyu-Hyoung
- Article
43
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2388, doi. 10.1007/s11664-013-2606-z
- Kim, Donghun;
- Kurosaki, Ken;
- Ohishi, Yuji;
- Muta, Hiroaki;
- Yamanaka, Shinsuke
- Article
44
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2221, doi. 10.1007/s11664-013-2585-0
- Obata, Kohei;
- Chonan, Yasunori;
- Komiyama, Takao;
- Aoyama, Takashi;
- Yamaguchi, Hiroyuki;
- Sugiyama, Shigeaki
- Article
45
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1855, doi. 10.1007/s11664-012-2450-6
- Kajitani, T.;
- Kubouchi, M.;
- Kikuchi, S.;
- Hayashi, K.;
- Ueno, T.;
- Miyazaki, Y.;
- Yubuta, K.
- Article
46
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1573, doi. 10.1007/s11664-012-2325-x
- Han, Li;
- Hung, Le;
- Nong, Ngo;
- Pryds, Nini;
- Linderoth, Søren
- Article
47
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1319, doi. 10.1007/s11664-012-2437-3
- Boldrini, S.;
- Famengo, A.;
- Montagner, F.;
- Battiston, S.;
- Fiameni, S.;
- Fabrizio, M.;
- Barison, S.
- Article
48
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 1988, doi. 10.1007/s11664-013-2490-6
- Dasgupta, T.;
- Yin, H.;
- Boor, J.;
- Stiewe, C.;
- Iversen, B.;
- Müller, E.
- Article
49
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2214, doi. 10.1007/s11664-013-2584-1
- Buckle, J.;
- Knox, A.;
- Siviter, J.;
- Montecucco, A.
- Article
50
- Journal of Electronic Materials, 2013, v. 42, n. 7, p. 2025, doi. 10.1007/s11664-013-2509-z
- Xu, Jingtao;
- Wu, Jiazhen;
- Tanabe, Yoichi;
- Heguri, Satoshi;
- Mu, Gang;
- Shimotani, Hidekazu;
- Tanigaki, Katsumi
- Article