Works matching IS 03615235 AND DT 2013 AND VI 42 AND IP 6
Results: 50
Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1171, doi. 10.1007/s11664-013-2551-x
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Electrical Properties and Scaling Behavior of MWCNT-Soda Lime Silica Glass.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1047, doi. 10.1007/s11664-013-2512-4
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Erratum to: Study of Structural, Electrical, and Magnetic Properties of Layered Perovskite Oxides LnSrTiFeO (Ln = Nd, Gd).
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- 2013
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- Correction Notice
Resistive Switching in a Printed Nanolayer of Poly(4-vinylphenol).
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1202, doi. 10.1007/s11664-013-2560-9
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The Stressing Effect of Electromigration from the Maxwell Stress and a Preliminary Mean-Time-to-Failure Analysis.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 956, doi. 10.1007/s11664-013-2474-6
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Flexible Transparent ZnO:Al/ZnO/CuAlO:Ca Heterojunction Diodes on Polyethylene Terephthalate Substrates.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1242, doi. 10.1007/s11664-013-2573-4
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Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1024, doi. 10.1007/s11664-013-2497-z
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In Situ Characterization of Triboelectrochemical Effects on Topography of Patterned Copper Surfaces.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 979, doi. 10.1007/s11664-013-2486-2
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Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 963, doi. 10.1007/s11664-013-2475-5
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Synthesis, Structure, and Electrochemistry of Sm-Modified LiMnO Cathode Materials for Lithium-Ion Batteries.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1275, doi. 10.1007/s11664-013-2588-x
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Modeling the Electrical Conduction in Epoxy-BaTiO Nanocomposites.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1101, doi. 10.1007/s11664-013-2523-1
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Thermoelectric Generators for Automotive Waste Heat Recovery Systems Part II: Parametric Evaluation and Topological Studies.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 944, doi. 10.1007/s11664-013-2472-8
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Effect of Se Substitution on Structural and Electrical Transport Properties of BiSbSeTe Hexagonal Rods.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1017, doi. 10.1007/s11664-013-2496-0
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Analysis of SiC Deposition Rate in a Tubular Hot-Wall Reactor with Polymeric Source Using the DoE Method.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 931, doi. 10.1007/s11664-012-2463-1
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Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1085, doi. 10.1007/s11664-013-2517-z
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Hydrothermal Synthesis of Anatase TiO Nanoflowers on a Nanobelt Framework for Photocatalytic Applications.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1290, doi. 10.1007/s11664-013-2593-0
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Computational Investigation of the Evolution of Intermetallic Compounds Affected by Microvoids During the Solid-State Aging Process in the Cu-Sn System.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 999, doi. 10.1007/s11664-013-2494-2
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Illumination Effects on the Capacitance Spectra and Signal Quality Factor of Al/InSe/C Microwave Sensors.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1033, doi. 10.1007/s11664-013-2502-6
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Interface Electron Traps as a Source of Anomalous Capacitance in AlGaN/GaN Heterostructures.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1184, doi. 10.1007/s11664-013-2553-8
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Effects of Different Morphologies of BiTe Nanopowders on Thermoelectric Properties.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1140, doi. 10.1007/s11664-013-2541-z
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Structural and Magnetic Study of CuFeCrO Oxides Under High External Magnetic Fields.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1055, doi. 10.1007/s11664-013-2513-3
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Reactions of Sn-4.0Ag-0.5Cu on Cu and Electroless Ni Substrate in Premelting Soldering Process.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1254, doi. 10.1007/s11664-013-2582-3
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Transport Properties of Bulk Thermoelectrics: An International Round-Robin Study, Part II: Thermal Diffusivity, Specific Heat, and Thermal Conductivity.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1073, doi. 10.1007/s11664-013-2516-0
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Erratum to: Highly Textured MnSi Film Obtained by High-Temperature Treatment.
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- 2013
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- Correction Notice
Interface Microstructure and Performance of Sb Contacts in Bismuth Telluride-Based Thermoelectric Elements.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1219, doi. 10.1007/s11664-013-2566-3
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Investigation of the Properties of Ba-Substituted LaSrBaMnO Perovskite Manganite Films for Resistive Switching Applications.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1196, doi. 10.1007/s11664-013-2556-5
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Analysis of the Temperature Dependence of the Capacitance-Voltage and Conductance-Voltage Characteristics of Au/TiO(rutile)/ n-Si Structures.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1108, doi. 10.1007/s11664-013-2524-0
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Investigations on Magnetoelectric and Magnetodielectric Properties of CMFO-PBT Composites.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1122, doi. 10.1007/s11664-013-2529-8
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Diffusivities and Atomic Mobilities of Sn-Bi and Sn-Pb Melts.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1158, doi. 10.1007/s11664-013-2549-4
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Thermoelectric Generators Using p-PbYbTe:Te and n-PbYbSeTe Thin Films Prepared by the Thermal Evaporation Method.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1146, doi. 10.1007/s11664-013-2542-y
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Selective CdTe Nanoheteroepitaxial Growth on Si(100) Substrates Using the Close-Spaced Sublimation Technique Without the Use of a Mask.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1092, doi. 10.1007/s11664-013-2519-x
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A Kinetics Study on Electrical Resistivity Transition of In Situ Polymer Aging Sensors Based on Carbon-Black-Filled Epoxy Conductive Polymeric Composites (CPCs).
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1114, doi. 10.1007/s11664-013-2525-z
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Study of Nitrogen Concentration in Silicon Carbide.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1037, doi. 10.1007/s11664-013-2503-5
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Comparison of Microwave Dielectric Properties of BaSrTiO Thin Films Grown on (100) LaAlO and (100) MgO Single-Crystal Substrates.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 988, doi. 10.1007/s11664-013-2489-z
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Effect of Sintering Temperature on Microstructure, Electrical Properties, and Thermal Expansion of Perovskite-Type LaCaCrO Complex Oxides Synthesized by a Combustion Method.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 939, doi. 10.1007/s11664-012-2464-0
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Effect of Applied Load in the Nanoindentation of Gold Ball Bonds.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1063, doi. 10.1007/s11664-013-2515-1
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Effect of Composition on Thermoelectric Properties of Polycrystalline CrSi.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1042, doi. 10.1007/s11664-013-2510-6
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Model of V Incorporation in Arsenic-Doped HgCdTe: First-Principles Calculations.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1010, doi. 10.1007/s11664-013-2495-1
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MnO-Modified Ba(Ti,Zr)O Ceramics with High Q and Good Thermal Stability.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1154, doi. 10.1007/s11664-013-2543-x
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First-Principles Study of Electronic, Elastic, and Lattice Vibrational Properties of Pbnm Orthorhombic SrHfO.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 993, doi. 10.1007/s11664-013-2492-4
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Synthesis, Characterization, and Electroluminescent Characteristics of Mixed-Ligand Zinc(II) Complexes.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 973, doi. 10.1007/s11664-013-2477-3
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Thermoelectric Properties of BiTeSe Compensated by Native Defects and Sn Doping.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1246, doi. 10.1007/s11664-013-2577-0
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Comparative Studies of the Growth and Characterization of Germanium Epitaxial Film on Silicon (001) with 0° and 6° Offcut.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1133, doi. 10.1007/s11664-013-2538-7
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ZnO/PPy Hybrid Heterojunction as an Ultraviolet Photosensor.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1235, doi. 10.1007/s11664-013-2572-5
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Dielectric and Impedance Spectroscopy of Barium Orthoniobate Ceramic.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1225, doi. 10.1007/s11664-013-2567-2
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Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1260, doi. 10.1007/s11664-013-2583-2
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Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1209, doi. 10.1007/s11664-013-2561-8
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Influence of Annealing on Electrical Properties of an Organic Thin Layer-Based n-Type InP Schottky Barrier Diode.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1282, doi. 10.1007/s11664-013-2592-1
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Improved Thermoelectric Performance of Free-Standing PEDOT:PSS/BiTe Films with Low Thermal Conductivity.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1268, doi. 10.1007/s11664-013-2587-y
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CuZnSnSe Solar Cells with Absorbers Prepared by the Metallic Ink-Printing Method Using Nanosized Cu-Zn-Sn Pastes and Selenization.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1190, doi. 10.1007/s11664-013-2554-7
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- Article