Works matching IS 03615235 AND DT 2013 AND VI 42 AND IP 5
1
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 815, doi. 10.1007/s11664-012-2342-9
- Bryan, Zachary;
- Hoffmann, Marc;
- Tweedie, James;
- Kirste, Ronny;
- Callsen, Gordon;
- Bryan, Isaac;
- Rice, Anthony;
- Bobea, Milena;
- Mita, Seiji;
- Xie, Jinqiao;
- Sitar, Zlatko;
- Collazo, Ramón
- Article
2
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 894, doi. 10.1007/s11664-012-2444-4
- Rivera, Abdiel;
- Zeller, John;
- Sood, Ashok;
- Anwar, Mehdi
- Article
3
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 889, doi. 10.1007/s11664-013-2526-y
- Tong, Chong;
- Yun, Juhyung;
- Kozarsky, Eric;
- Anderson, Wayne
- Article
4
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 918, doi. 10.1007/s11664-013-2528-9
- Lin, Youxi;
- Wang, Ding;
- Donetsky, Dmitry;
- Shterengas, Leon;
- Kipshidze, Gela;
- Belenky, Gregory;
- Svensson, Stefan;
- Sarney, Wendy;
- Hier, Harry
- Article
5
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 794, doi. 10.1007/s11664-013-2527-x
- Wang, Huanhuan;
- Sun, Shun;
- Dudley, Michael;
- Byrappa, Shayan;
- Wu, Fangzhen;
- Raghothamachar, Balaji;
- Chung, Gil;
- Sanchez, Edward;
- Mueller, Stephan;
- Hansen, Darren;
- Loboda, Mark
- Article
6
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 863, doi. 10.1007/s11664-013-2544-9
- Laskar, Masihhur;
- Carnevale, Santino;
- Sarwar, A.;
- Phillips, Patrick;
- Mills, Michael;
- Myers, Roberto
- Article
7
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 927, doi. 10.1007/s11664-013-2559-2
- Choi, Pu-Reun;
- Park, Hyung-Ho;
- Koo, Eunhae
- Article
8
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 833, doi. 10.1007/s11664-013-2491-5
- Leathersich, Jeffrey;
- Tungare, Mihir;
- Weng, Xiaojun;
- Suvarna, Puneet;
- Agnihotri, Pratik;
- Evans, Morgan;
- Redwing, Joan;
- Shahedipour-Sandvik, F.
- Article
9
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 809, doi. 10.1007/s11664-012-2371-4
- Atewologun, Ayomide;
- Ge, Wangyao;
- Stiff-Roberts, Adrienne
- Article
10
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 820, doi. 10.1007/s11664-012-2373-2
- Richter, E.;
- Stoica, T.;
- Zeimer, U.;
- Netzel, C.;
- Weyers, M.;
- Tränkle, G.
- Article
11
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 859, doi. 10.1007/s11664-012-2461-3
- Uruno, Aya;
- Kobayashi, Masakazu
- Article
12
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 799, doi. 10.1007/s11664-012-2421-y
- Gorzkowski, E.;
- Qadri, S.;
- Rath, B.;
- Goswami, R.;
- Caldwell, J.
- Article
13
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 906, doi. 10.1007/s11664-012-2426-6
- Article
14
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 854, doi. 10.1007/s11664-013-2537-8
- Suvarna, Puneet;
- Tungare, Mihir;
- Leathersich, Jeffrey;
- Agnihotri, Pratik;
- Shahedipour-Sandvik, F.;
- Douglas Bell, L.;
- Nikzad, Shouleh
- Article
15
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 844, doi. 10.1007/s11664-013-2493-3
- Tanaka, H.;
- Jadwisienczak, W.;
- Kaya, S.;
- Chen, G.;
- Wan, C.;
- Kordesch, M.
- Article
16
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 868, doi. 10.1007/s11664-013-2498-y
- Brubaker, Matt;
- Blanchard, Paul;
- Schlager, John;
- Sanders, Aric;
- Herrero, Andrew;
- Roshko, Alexana;
- Duff, Shannon;
- Harvey, Todd;
- Bright, Victor;
- Sanford, Norman;
- Bertness, Kris
- Article
17
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 826, doi. 10.1007/s11664-013-2473-7
- Reuters, Benjamin;
- Wille, A.;
- Ketteniss, N.;
- Hahn, H.;
- Holländer, B.;
- Heuken, M.;
- Kalisch, H.;
- Vescan, A.
- Article
18
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 838, doi. 10.1007/s11664-013-2558-3
- Wadekar, P.;
- Chen, Q.;
- Huang, H.;
- Lin, Y.;
- Chang, C.;
- Seo, H.;
- Dung, T.;
- Chou, M.;
- Feng, S.;
- Ho, N.;
- Wijesundera, D.;
- Chu, W.;
- Tu, L.
- Article
19
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 912, doi. 10.1007/s11664-012-2375-0
- Samberg, J.;
- Carlin, C.;
- Bradshaw, G.;
- Colter, P.;
- Bedair, S.
- Article
20
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 849, doi. 10.1007/s11664-013-2499-x
- Kraus, Andreas;
- Bremers, Heiko;
- Rossow, Uwe;
- Hangleiter, Andreas
- Article
21
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 787, doi. 10.1007/s11664-012-2379-9
- Wu, Fangzhen;
- Wang, Huanhuan;
- Byrappa, Shayan;
- Raghothamachar, Balaji;
- Dudley, Michael;
- Wu, Ping;
- Xu, Xueping;
- Zwieback, Ilya
- Article
22
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 901, doi. 10.1007/s11664-012-2326-9
- Ozcelik, Adem;
- Cabarcos, Orlando;
- Allara, David;
- Horn, Mark
- Article
23
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 882, doi. 10.1007/s11664-013-2548-5
- Chou, Hung;
- Mazady, Anas;
- Zeller, John;
- Manzur, Tariq;
- Anwar, Mehdi
- Article
24
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 805, doi. 10.1007/s11664-013-2547-6
- Liu, Jie;
- Zhang, Fan;
- You, Guanjun;
- Zhang, Yu;
- Wei, Lai;
- Zhao, Feng;
- Wang, Yongqiang;
- Henderson, Ron;
- Xu, Jian
- Article
25
- Journal of Electronic Materials, 2013, v. 42, n. 5, p. 875, doi. 10.1007/s11664-013-2550-y
- Imai, D.;
- Ishitani, Y.;
- Fujiwara, M.;
- Wang, X.;
- Kusakabe, K.;
- Yoshikawa, A.
- Article