Creep and Mechanical Properties of CuSn and (Cu,Ni)Sn at Elevated Temperatures.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 304, doi. 10.1007/s11664-012-2227-y
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2013 AND VI 42 AND IP 2
Results: 17
1
2
Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 263, doi. 10.1007/s11664-012-2201-8
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- Publication type:
- Article
3
Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 319, doi. 10.1007/s11664-012-2307-z
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- Publication type:
- Article
4
Influence of Composition on the Morphology of Primary CuSn in Sn-4Cu Alloys.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 256, doi. 10.1007/s11664-012-2222-3
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- Publication type:
- Article
5
An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 240, doi. 10.1007/s11664-012-2341-x
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- Publication type:
- Article
6
Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 230, doi. 10.1007/s11664-012-2302-4
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- Publication type:
- Article
7
Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 280, doi. 10.1007/s11664-012-2310-4
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- Publication type:
- Article
8
Physicochemical Properties of Sn-Zn and SAC + Bi Alloys.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 288, doi. 10.1007/s11664-012-2336-7
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- Publication type:
- Article
9
Characterization of Stress-Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 294, doi. 10.1007/s11664-012-2276-2
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- Publication type:
- Article
10
The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 215, doi. 10.1007/s11664-012-2340-y
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- Publication type:
- Article
11
Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 312, doi. 10.1007/s11664-012-2267-3
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- Publication type:
- Article
12
Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 201, doi. 10.1007/s11664-012-2339-4
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- Publication type:
- Article
13
Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM).
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 224, doi. 10.1007/s11664-012-2209-0
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- Publication type:
- Article
14
Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 348, doi. 10.1007/s11664-012-2274-4
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- Publication type:
- Article
15
Micro- and Nanostructure of Zn Whiskers and Their Coating.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 272, doi. 10.1007/s11664-012-2185-4
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- Publication type:
- Article
16
Effect of Alloying Elements on the Electrification-Fusion Phenomenon in Sn-Based Eutectic Alloys.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 249, doi. 10.1007/s11664-012-2247-7
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- Publication type:
- Article
17
Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 2, p. 332, doi. 10.1007/s11664-012-2308-y
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- Publication type:
- Article