Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 9
Results: 45
Thermoelectric Figure of Merit Enhancement in BiTe-Coated Bi Composites.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2326, doi. 10.1007/s11664-012-2154-y
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- Article
HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2588, doi. 10.1007/s11664-012-2033-6
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- Article
Creep-Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2463, doi. 10.1007/s11664-012-2061-2
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- Article
Intermetallic Compound Formation Mechanisms for Cu-Sn Solid-Liquid Interdiffusion Bonding.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2453, doi. 10.1007/s11664-012-2060-3
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- Article
Interfacial Reaction of Molten Sn on a Strained Cu Electroplated Layer.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2470, doi. 10.1007/s11664-012-2072-z
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- Article
Size-Quantization Semimetal-Semiconductor Transition in BiSb Nanowires: Thermoelectric Properties.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2313, doi. 10.1007/s11664-012-2090-x
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- Article
Preparation and Characterization of New SrLaNbTiO Microwave Dielectric Ceramics.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2393, doi. 10.1007/s11664-012-2080-z
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- Article
Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2599, doi. 10.1007/s11664-012-2105-7
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- Article
Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2527, doi. 10.1007/s11664-012-2102-x
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- Article
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2533, doi. 10.1007/s11664-012-2117-3
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- Article
Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2543, doi. 10.1007/s11664-012-2134-2
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- Article
Active Layer Thickness Effects on the On-State Current and Pulse Measurement at Room Temperature on Deposited Zinc Oxide Thin-Film Transistors.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2362, doi. 10.1007/s11664-012-2132-4
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- Article
Ohmic Curing of Printed Silver Conductive Traces.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2553, doi. 10.1007/s11664-012-2140-4
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- Article
Preparation and Transport Properties of BiOSe Single Crystals.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2317, doi. 10.1007/s11664-012-2143-1
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- Article
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2478, doi. 10.1007/s11664-012-2142-2
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- Article
Anodized Macroporous Silicon Anode for Integration of Lithium-Ion Batteries on Chips.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2369, doi. 10.1007/s11664-012-2147-x
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- Article
Thermal Conductivity of InAs/GaSb Type II Superlattice.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2322, doi. 10.1007/s11664-012-2146-y
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- Article
Failure Causes of a Polymer Resettable Circuit Protection Device.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2419, doi. 10.1007/s11664-012-2148-9
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- Article
Effect of Prebonding Anneal on the Microstructure Evolution and Cu-Cu Diffusion Bonding Quality for Three-Dimensional Integration.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2567, doi. 10.1007/s11664-012-2153-z
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- Article
Effect of Target Density on Microstructural, Electrical, and Optical Properties of Indium Tin Oxide Thin Films.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2376, doi. 10.1007/s11664-012-2155-x
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- Article
An Analytical Approach to Determine the Pressure Distribution During Chemical Mechanical Polishing.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2606, doi. 10.1007/s11664-012-2151-1
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- Article
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2487, doi. 10.1007/s11664-012-2156-9
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- Article
Phosphorus Doping Effect in a Zinc Oxide Channel Layer to Improve the Performance of Oxide Thin-Film Transistors.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2380, doi. 10.1007/s11664-012-2166-7
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- Article
Effects of Au and Pd Additions on Joint Strength, Electrical Resistivity, and Ion-Migration Tolerance in Low-Temperature Sintering Bonding Using AgO Paste.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2573, doi. 10.1007/s11664-012-2167-6
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- Article
Electrical and Dielectric Properties of Exfoliated Graphite/Polyimide Composite Films with Low Percolation Threshold.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2439, doi. 10.1007/s11664-012-2163-x
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- Article
Interfacial Reactions in SnZn(Liquid)/Ni(Solid) Couples at 873 K.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2495, doi. 10.1007/s11664-012-2157-8
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- Article
Direct Electrosynthesis and Characterization of a New Soluble Polythiophene Derivative Containing Carboxyl Groups in Boron Trifluoride Diethyl Etherate.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2411, doi. 10.1007/s11664-012-2123-5
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- Article
Thermoelectric and Magnetic Properties of CaREMnO (RE = Sm, Gd, and Dy).
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2338, doi. 10.1007/s11664-012-2159-6
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- Article
Effect of the Surface Morphology of Seed and Mask Layers on InP Grown on Si by Epitaxial Lateral Overgrowth.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2345, doi. 10.1007/s11664-012-2164-9
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- Article
Electrical and Optical Investigations on Tungsten-Incorporated CdO Thin Films.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2405, doi. 10.1007/s11664-012-2160-0
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- Article
An Investigation of Electrical Contacts for Higher Manganese Silicide.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2331, doi. 10.1007/s11664-012-2149-8
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- Article
Energy Relaxation Rates in AlInN/AlN/GaN Heterostructures.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2350, doi. 10.1007/s11664-012-2158-7
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- Article
AC Conductivity and Diffuse Reflectance Studies of Ag-TiO Nanoparticles.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2387, doi. 10.1007/s11664-012-2174-7
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- Article
Synthesis, Characterization, and Electroluminescent Properties of Pyridinylene Vinylene-Modified Phenylene Vinylene Copolymers.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2447, doi. 10.1007/s11664-012-2173-8
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- Article
High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2631, doi. 10.1007/s11664-012-2145-z
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- Article
Switching Phenomena of Amorphous GaGeTe Chalcogenide Thin Films for Phase-Change Memories.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2399, doi. 10.1007/s11664-012-2152-0
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- Article
Enhancement of the Bondability and Die-Shear Force of Chip-Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2621, doi. 10.1007/s11664-012-2172-9
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- Article
Performance of Isotropic and Anisotropic Heat Spreaders.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2580, doi. 10.1007/s11664-012-2177-4
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- Article
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2502, doi. 10.1007/s11664-012-2175-6
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- Article
Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2613, doi. 10.1007/s11664-012-2165-8
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- Article
Thermoelectric Performance Enhancement of Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate) Composite Films by Addition of Dimethyl Sulfoxide and Urea.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2431, doi. 10.1007/s11664-012-2162-y
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- Article
Retraction Note: Single-Phase β-ZnSb Prepared by a Mechanical Grinding Method.
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- 2012
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- Correction Notice
Measurement of Thermal Conductivity Using Steady-State Isothermal Conditions and Validation by Comparison with Thermoelectric Device Performance.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2307, doi. 10.1007/s11664-012-2178-3
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- Article
Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2508, doi. 10.1007/s11664-012-2179-2
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- Article
Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2519, doi. 10.1007/s11664-012-2180-9
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- Article