Thermoelectric Figure of Merit Enhancement in BiTe-Coated Bi Composites.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2326, doi. 10.1007/s11664-012-2154-y
- By:
- Publication type:
- Article
Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 9
Results: 45
1
2
HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2588, doi. 10.1007/s11664-012-2033-6
- By:
- Publication type:
- Article
3
Creep-Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2463, doi. 10.1007/s11664-012-2061-2
- By:
- Publication type:
- Article
4
Intermetallic Compound Formation Mechanisms for Cu-Sn Solid-Liquid Interdiffusion Bonding.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2453, doi. 10.1007/s11664-012-2060-3
- By:
- Publication type:
- Article
5
Interfacial Reaction of Molten Sn on a Strained Cu Electroplated Layer.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2470, doi. 10.1007/s11664-012-2072-z
- By:
- Publication type:
- Article
6
Size-Quantization Semimetal-Semiconductor Transition in BiSb Nanowires: Thermoelectric Properties.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2313, doi. 10.1007/s11664-012-2090-x
- By:
- Publication type:
- Article
7
Preparation and Characterization of New SrLaNbTiO Microwave Dielectric Ceramics.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2393, doi. 10.1007/s11664-012-2080-z
- By:
- Publication type:
- Article
8
Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2599, doi. 10.1007/s11664-012-2105-7
- By:
- Publication type:
- Article
9
Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2527, doi. 10.1007/s11664-012-2102-x
- By:
- Publication type:
- Article
10
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2533, doi. 10.1007/s11664-012-2117-3
- By:
- Publication type:
- Article
11
Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2543, doi. 10.1007/s11664-012-2134-2
- By:
- Publication type:
- Article
12
Active Layer Thickness Effects on the On-State Current and Pulse Measurement at Room Temperature on Deposited Zinc Oxide Thin-Film Transistors.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2362, doi. 10.1007/s11664-012-2132-4
- By:
- Publication type:
- Article
13
Ohmic Curing of Printed Silver Conductive Traces.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2553, doi. 10.1007/s11664-012-2140-4
- By:
- Publication type:
- Article
14
Preparation and Transport Properties of BiOSe Single Crystals.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2317, doi. 10.1007/s11664-012-2143-1
- By:
- Publication type:
- Article
15
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2478, doi. 10.1007/s11664-012-2142-2
- By:
- Publication type:
- Article
16
Anodized Macroporous Silicon Anode for Integration of Lithium-Ion Batteries on Chips.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2369, doi. 10.1007/s11664-012-2147-x
- By:
- Publication type:
- Article
17
Thermal Conductivity of InAs/GaSb Type II Superlattice.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2322, doi. 10.1007/s11664-012-2146-y
- By:
- Publication type:
- Article
18
Failure Causes of a Polymer Resettable Circuit Protection Device.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2419, doi. 10.1007/s11664-012-2148-9
- By:
- Publication type:
- Article
19
Effect of Prebonding Anneal on the Microstructure Evolution and Cu-Cu Diffusion Bonding Quality for Three-Dimensional Integration.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2567, doi. 10.1007/s11664-012-2153-z
- By:
- Publication type:
- Article
20
Effect of Target Density on Microstructural, Electrical, and Optical Properties of Indium Tin Oxide Thin Films.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2376, doi. 10.1007/s11664-012-2155-x
- By:
- Publication type:
- Article
21
An Analytical Approach to Determine the Pressure Distribution During Chemical Mechanical Polishing.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2606, doi. 10.1007/s11664-012-2151-1
- By:
- Publication type:
- Article
22
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2487, doi. 10.1007/s11664-012-2156-9
- By:
- Publication type:
- Article
23
Phosphorus Doping Effect in a Zinc Oxide Channel Layer to Improve the Performance of Oxide Thin-Film Transistors.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2380, doi. 10.1007/s11664-012-2166-7
- By:
- Publication type:
- Article
24
Effects of Au and Pd Additions on Joint Strength, Electrical Resistivity, and Ion-Migration Tolerance in Low-Temperature Sintering Bonding Using AgO Paste.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2573, doi. 10.1007/s11664-012-2167-6
- By:
- Publication type:
- Article
25
Electrical and Dielectric Properties of Exfoliated Graphite/Polyimide Composite Films with Low Percolation Threshold.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2439, doi. 10.1007/s11664-012-2163-x
- By:
- Publication type:
- Article
26
Interfacial Reactions in SnZn(Liquid)/Ni(Solid) Couples at 873 K.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2495, doi. 10.1007/s11664-012-2157-8
- By:
- Publication type:
- Article
27
Direct Electrosynthesis and Characterization of a New Soluble Polythiophene Derivative Containing Carboxyl Groups in Boron Trifluoride Diethyl Etherate.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2411, doi. 10.1007/s11664-012-2123-5
- By:
- Publication type:
- Article
28
Thermoelectric and Magnetic Properties of CaREMnO (RE = Sm, Gd, and Dy).
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2338, doi. 10.1007/s11664-012-2159-6
- By:
- Publication type:
- Article
29
Effect of the Surface Morphology of Seed and Mask Layers on InP Grown on Si by Epitaxial Lateral Overgrowth.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2345, doi. 10.1007/s11664-012-2164-9
- By:
- Publication type:
- Article
30
Electrical and Optical Investigations on Tungsten-Incorporated CdO Thin Films.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2405, doi. 10.1007/s11664-012-2160-0
- By:
- Publication type:
- Article
31
An Investigation of Electrical Contacts for Higher Manganese Silicide.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2331, doi. 10.1007/s11664-012-2149-8
- By:
- Publication type:
- Article
32
Energy Relaxation Rates in AlInN/AlN/GaN Heterostructures.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2350, doi. 10.1007/s11664-012-2158-7
- By:
- Publication type:
- Article
33
AC Conductivity and Diffuse Reflectance Studies of Ag-TiO Nanoparticles.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2387, doi. 10.1007/s11664-012-2174-7
- By:
- Publication type:
- Article
34
Synthesis, Characterization, and Electroluminescent Properties of Pyridinylene Vinylene-Modified Phenylene Vinylene Copolymers.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2447, doi. 10.1007/s11664-012-2173-8
- By:
- Publication type:
- Article
35
High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2631, doi. 10.1007/s11664-012-2145-z
- By:
- Publication type:
- Article
36
Switching Phenomena of Amorphous GaGeTe Chalcogenide Thin Films for Phase-Change Memories.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2399, doi. 10.1007/s11664-012-2152-0
- By:
- Publication type:
- Article
37
Enhancement of the Bondability and Die-Shear Force of Chip-Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2621, doi. 10.1007/s11664-012-2172-9
- By:
- Publication type:
- Article
38
Performance of Isotropic and Anisotropic Heat Spreaders.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2580, doi. 10.1007/s11664-012-2177-4
- By:
- Publication type:
- Article
39
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2502, doi. 10.1007/s11664-012-2175-6
- By:
- Publication type:
- Article
40
Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2613, doi. 10.1007/s11664-012-2165-8
- By:
- Publication type:
- Article
41
Thermoelectric Performance Enhancement of Poly(3,4-ethylenedioxythiophene):Poly(styrenesulfonate) Composite Films by Addition of Dimethyl Sulfoxide and Urea.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2431, doi. 10.1007/s11664-012-2162-y
- By:
- Publication type:
- Article
42
Retraction Note: Single-Phase β-ZnSb Prepared by a Mechanical Grinding Method.
- Published in:
- 2012
- By:
- Publication type:
- Correction Notice
43
Measurement of Thermal Conductivity Using Steady-State Isothermal Conditions and Validation by Comparison with Thermoelectric Device Performance.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2307, doi. 10.1007/s11664-012-2178-3
- By:
- Publication type:
- Article
44
Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2508, doi. 10.1007/s11664-012-2179-2
- By:
- Publication type:
- Article
45
Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2519, doi. 10.1007/s11664-012-2180-9
- By:
- Publication type:
- Article