Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 7
Results: 23
Influence of Dopants on Electrical Properties of ZnO-VO Varistors Deduced from AC Impedance and Variable-Temperature Dielectric Spectroscopy.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1970, doi. 10.1007/s11664-012-1935-7
- By:
- Publication type:
- Article
Electron-Beam Sensitivity and Patterning of an Aqueous-Develop, Epoxy-Based Polynorbornene Dielectric Material.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1982, doi. 10.1007/s11664-012-1961-5
- By:
- Publication type:
- Article
Shear Strength and Failure Modes of As-Bonded Gold and Copper Ball Bonds on Aluminum Metallization.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 2018, doi. 10.1007/s11664-012-1923-y
- By:
- Publication type:
- Article
Demonstrating Valence Band-Edge Effective Work Function by Aluminum Implantation in High- k/Metal Gate p-MOSFET with Incorporated Fluorine.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1936, doi. 10.1007/s11664-012-1957-1
- By:
- Publication type:
- Article
Growth of CdS Nanoneedles by Pulsed Laser Deposition.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1941, doi. 10.1007/s11664-012-1980-2
- By:
- Publication type:
- Article
New Method for Evaluating the Peltier Coefficient Based on Temperature Measurements in a Thermoelectric Module.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1990, doi. 10.1007/s11664-012-1966-0
- By:
- Publication type:
- Article
Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1859, doi. 10.1007/s11664-012-1962-4
- By:
- Publication type:
- Article
Half-Metallic Ferromagnetism in the TiCoGe Heusler Compound.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1978, doi. 10.1007/s11664-012-1968-y
- By:
- Publication type:
- Article
Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1924, doi. 10.1007/s11664-012-1965-1
- By:
- Publication type:
- Article
Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1907, doi. 10.1007/s11664-012-1976-y
- By:
- Publication type:
- Article
Influence of Substrate Temperature on Structural Properties and Deposition Rate of AlN Thin Film Deposited by Reactive Magnetron Sputtering.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1948, doi. 10.1007/s11664-012-1999-4
- By:
- Publication type:
- Article
Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1886, doi. 10.1007/s11664-012-2008-7
- By:
- Publication type:
- Article
Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1868, doi. 10.1007/s11664-012-1979-8
- By:
- Publication type:
- Article
Influence of 0.03 wt.% Carbon Black Addition on the Performance of Sn-3.5Ag Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1893, doi. 10.1007/s11664-012-2023-8
- By:
- Publication type:
- Article
Phase Equilibria and Thermodynamic Basis for the Cd-Se and Pb-Se Binary Systems.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1915, doi. 10.1007/s11664-012-2016-7
- By:
- Publication type:
- Article
Fabrication of Transparent BaNaBO Glass-Microcrystal Composites.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1996, doi. 10.1007/s11664-012-2026-5
- By:
- Publication type:
- Article
Mechanical Properties of Anisotropic Conductive Adhesive Film Under Hygrothermal Aging and Thermal Cycling.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 2001, doi. 10.1007/s11664-012-2014-9
- By:
- Publication type:
- Article
Dislocation Reduction by Glide in Epitaxial IV-VI Layers on Si Substrates.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1931, doi. 10.1007/s11664-012-2031-8
- By:
- Publication type:
- Article
Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1898, doi. 10.1007/s11664-012-2017-6
- By:
- Publication type:
- Article
Unusual Rectifying Response of Nanojunctions Using Randomly Oriented Nanorods (RON) of ZnO Irradiated with 80-MeV Oxygen Ions.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1955, doi. 10.1007/s11664-012-1995-8
- By:
- Publication type:
- Article
RF Power Effect on the Properties of Sputtered ZnO Films for Channel Layer Applications in Thin-Film Transistors.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1962, doi. 10.1007/s11664-012-1994-9
- By:
- Publication type:
- Article
Effect of Multiwall Carbon Nanotubes on Electrical and Structural Properties of Polyaniline.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 1882, doi. 10.1007/s11664-012-2004-y
- By:
- Publication type:
- Article
Long-Term Stability of Mold Compounds and the Influence on Semiconductor Device Reliability.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 7, p. 2010, doi. 10.1007/s11664-012-2030-9
- By:
- Publication type:
- Article