Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 4

Results: 25

Simultaneous Increases in Electrical Conductivity and Seebeck Coefficient of PEDOT:PSS Films by Adding Ionic Liquids into a Polymer Solution.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 639, doi. 10.1007/s11664-012-1942-8

By:

Liu, Congcong;
Xu, Jingkun;
Lu, Baoyang;
Yue, Ruirui;
Kong, Fangfang

Publication type:

Article

Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 774, doi. 10.1007/s11664-012-1918-8

By:

Chin, J.W.C.;
Kok, C.K.;
Rajmohan, M.M.;
Yeo, V.S.H.;
Said, M.R.

Publication type:

Article

Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 791, doi. 10.1007/s11664-011-1888-2

By:

Kim, Jae-Myeong;
Jeong, Myeong-Hyeok;
Yoo, Sehoon;
Park, Young-Bae

Publication type:

Article

Observations of IMC Formation for Au Wire Bonds to Al Pads.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 748, doi. 10.1007/s11664-011-1805-8

By:

DeLucca, John;
Osenbach, John;
Baiocchi, Frank

Publication type:

Article

Influence of Substrate Temperature on Structural and Thermoelectric Properties of Antimony Telluride Thin Films Fabricated by RF and DC Cosputtering.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 679, doi. 10.1007/s11664-011-1896-2

By:

Chen, Tianbao;
Fan, Ping;
Zheng, Zhuanghao;
Zhang, Dongping;
Cai, Xingmin;
Liang, Guangxing;
Cai, Zhaokun

Publication type:

Article

Grain Boundary Carrier Scattering in ZnO Thin Films: a Study by Temperature-Dependent Charge Carrier Transport Measurements.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 660, doi. 10.1007/s11664-012-1907-y

By:

Muniswami Naidu, R.V.;
Subrahmanyam, Aryasomayajula;
Verger, Arnaud;
Jain, M.K.;
Bhaskara Rao, S.V.N.;
Jha, S.N.;
Phase, D.M.

Publication type:

Article

Synthesis and Characterization of InS Thin Films Deposited by Chemical Bath Deposition on Polyethylene Naphthalate Substrates.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 695, doi. 10.1007/s11664-011-1865-9

By:

Castelo-González, O.A.;
Santacruz-Ortega, H.C.;
Quevedo-López, M.A.;
Sotelo-Lerma, M.

Publication type:

Article

High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 782, doi. 10.1007/s11664-012-1903-2

By:

Chen, Gang;
Sun, Xiu-Hu;
Nie, Peng;
Mei, Yun-Hui;
Lu, Guo-Quan;
Chen, Xu

Publication type:

Article

Optimization of Phase Formation and Superconducting Properties in MgB2 Prepared by Phase Transformation from MgB4.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 673, doi. 10.1007/s11664-012-1902-3

By:

Tan, K.;
Lim, K.;
Shaari, A.;
Chen, S.

Publication type:

Article

Effects of Zn/Mg Ratio on the Microstructure and Microwave Dielectric Properties of (ZnMg)SiO Ceramics.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 684, doi. 10.1007/s11664-011-1899-z

By:

Li, Lingxia;
Wang, Yucui;
Xia, Wangsuo;
He, Xiaowei;
Zhang, Ping

Publication type:

Article

Structural, Optical, and Electrical Properties of Cobalt-Doped CdS Quantum Dots.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 665, doi. 10.1007/s11664-012-1900-5

By:

Thambidurai, M.;
Muthukumarasamy, N.;
Velauthapillai, Dhayalan;
Agilan, S.;
Balasundaraprabhu, R.

Publication type:

Article

Forming-Free Reversible Bipolar Resistive Switching Behavior in Al-Doped HfO Metal-Insulator-Metal Devices.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 656, doi. 10.1007/s11664-012-1912-1

By:

Mahapatra, R.;
Horsfall, A.;
Wright, N.G.

Publication type:

Article

Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 757, doi. 10.1007/s11664-012-1925-9

By:

Wang, Kai-Jheng;
Duh, Jenq-Gong

Publication type:

Article

Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 741, doi. 10.1007/s11664-012-1932-x

By:

Zhu, Q.;
Liu, H.;
Wang, Z.;
Shang, J.

Publication type:

Article

Microstructure, Phase Transition, and Piezoelectric Properties of Cerium-Substituted Bismuth Titanate Nanofibers.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 651, doi. 10.1007/s11664-012-1934-8

By:

Jiang, Bo;
Tang, Minghua;
Li, Jiancheng;
Xiao, Yongguang;
Tao, Haizheng;
Zhou, Yichun;
He, John

Publication type:

Article

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 712, doi. 10.1007/s11664-012-1943-7

By:

Shin, Hae-A-Seul;
Kim, Byoung-Joon;
Kim, Ju-Heon;
Hwang, Sung-Hwan;
Budiman, Arief;
Son, Ho-Young;
Byun, Kwang-Yoo;
Tamura, Nobumichi;
Kunz, Martin;
Kim, Dong-Ik;
Joo, Young-Chang

Publication type:

Article

Preparation of Ag Nanocomposite Tellurite Glass by Solid-State Field-Assisted Diffusion.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 646, doi. 10.1007/s11664-012-1941-9

By:

Ma, Yan;
Lin, Jian;
Qin, Shuang;
Zhu, Linfeng;
Li, Bofang;
Lei, Shuhua

Publication type:

Article

Low-Temperature Sintering and Electromagnetic Properties of NiCuZn/CaTiO Composites.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 701, doi. 10.1007/s11664-012-1933-9

By:

Yang, Haibo;
Yang, Yanyan;
Lin, Ying;
Zhu, Jianfeng;
Wang, Fen

Publication type:

Article

Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys.

Published in:

2012

By:

Tucker, J.;
Chan, D.;
Subbarayan, G.;
Handwerker, C.

Publication type:

Correction Notice

Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 720, doi. 10.1007/s11664-012-1949-1

By:

Murugesan, M.;
Ohara, Y.;
Fukushima, T.;
Tanaka, T.;
Koyanagi, M.

Publication type:

Article

Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 730, doi. 10.1007/s11664-012-1952-6

By:

Huang, M.;
Zhou, S.;
Chen, L.

Publication type:

Article

Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 763, doi. 10.1007/s11664-012-1921-0

By:

Kim, Young;
Park, Jin-Young;
Kim, Young-Ho

Publication type:

Article

Impedance Spectroscopy of Dielectric BaTi5O11 Film Prepared by Laser Chemical Vapor Deposition Method.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 689, doi. 10.1007/s11664-011-1876-6

By:

Guo, Dongyun;
Goto, Takashi;
Wang, Chuanbin;
Shen, Qiang;
Zhang, Lianmeng

Publication type:

Article

Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 706, doi. 10.1007/s11664-012-1944-6

By:

Lee, K.-O.

Publication type:

Article

Transport Properties of Ni and PbTe Under Pressure.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 4, p. 633, doi. 10.1007/s11664-012-1945-5

By:

Jacobsen, Matthew;
Kumar, Ravhi;
Cornelius, Andrew

Publication type:

Article

Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 4

Simultaneous Increases in Electrical Conductivity and Seebeck Coefficient of PEDOT:PSS Films by Adding Ionic Liquids into a Polymer Solution.

Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method.

Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps.

Observations of IMC Formation for Au Wire Bonds to Al Pads.

Influence of Substrate Temperature on Structural and Thermoelectric Properties of Antimony Telluride Thin Films Fabricated by RF and DC Cosputtering.

Grain Boundary Carrier Scattering in ZnO Thin Films: a Study by Temperature-Dependent Charge Carrier Transport Measurements.

Synthesis and Characterization of InS Thin Films Deposited by Chemical Bath Deposition on Polyethylene Naphthalate Substrates.

High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films.

Optimization of Phase Formation and Superconducting Properties in MgB<sub>2</sub> Prepared by Phase Transformation from MgB<sub>4</sub>.

Effects of Zn/Mg Ratio on the Microstructure and Microwave Dielectric Properties of (ZnMg)SiO Ceramics.

Structural, Optical, and Electrical Properties of Cobalt-Doped CdS Quantum Dots.

Forming-Free Reversible Bipolar Resistive Switching Behavior in Al-Doped HfO Metal-Insulator-Metal Devices.

Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging.

Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading.

Microstructure, Phase Transition, and Piezoelectric Properties of Cerium-Substituted Bismuth Titanate Nanofibers.

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing.

Preparation of Ag Nanocomposite Tellurite Glass by Solid-State Field-Assisted Diffusion.

Low-Temperature Sintering and Electromagnetic Properties of NiCuZn/CaTiO Composites.

Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys.

Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking.

Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects.

Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish.

Impedance Spectroscopy of Dielectric BaTi<sub>5</sub>O<sub>11</sub> Film Prepared by Laser Chemical Vapor Deposition Method.

Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package.

Transport Properties of Ni and PbTe Under Pressure.