Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 4
Results: 25
Simultaneous Increases in Electrical Conductivity and Seebeck Coefficient of PEDOT:PSS Films by Adding Ionic Liquids into a Polymer Solution.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 639, doi. 10.1007/s11664-012-1942-8
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- Article
Synthesis and Characterization of InS Thin Films Deposited by Chemical Bath Deposition on Polyethylene Naphthalate Substrates.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 695, doi. 10.1007/s11664-011-1865-9
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- Article
Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 791, doi. 10.1007/s11664-011-1888-2
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- Article
Observations of IMC Formation for Au Wire Bonds to Al Pads.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 748, doi. 10.1007/s11664-011-1805-8
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- Article
Influence of Substrate Temperature on Structural and Thermoelectric Properties of Antimony Telluride Thin Films Fabricated by RF and DC Cosputtering.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 679, doi. 10.1007/s11664-011-1896-2
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- Article
Grain Boundary Carrier Scattering in ZnO Thin Films: a Study by Temperature-Dependent Charge Carrier Transport Measurements.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 660, doi. 10.1007/s11664-012-1907-y
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- Article
Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 774, doi. 10.1007/s11664-012-1918-8
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- Article
High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 782, doi. 10.1007/s11664-012-1903-2
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- Article
Optimization of Phase Formation and Superconducting Properties in MgB<sub>2</sub> Prepared by Phase Transformation from MgB<sub>4</sub>.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 673, doi. 10.1007/s11664-012-1902-3
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- Article
Effects of Zn/Mg Ratio on the Microstructure and Microwave Dielectric Properties of (ZnMg)SiO Ceramics.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 684, doi. 10.1007/s11664-011-1899-z
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- Article
Structural, Optical, and Electrical Properties of Cobalt-Doped CdS Quantum Dots.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 665, doi. 10.1007/s11664-012-1900-5
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- Article
Forming-Free Reversible Bipolar Resistive Switching Behavior in Al-Doped HfO Metal-Insulator-Metal Devices.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 656, doi. 10.1007/s11664-012-1912-1
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- Article
Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 757, doi. 10.1007/s11664-012-1925-9
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- Article
Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 741, doi. 10.1007/s11664-012-1932-x
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- Article
Microstructure, Phase Transition, and Piezoelectric Properties of Cerium-Substituted Bismuth Titanate Nanofibers.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 651, doi. 10.1007/s11664-012-1934-8
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- Article
Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 712, doi. 10.1007/s11664-012-1943-7
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- Article
Preparation of Ag Nanocomposite Tellurite Glass by Solid-State Field-Assisted Diffusion.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 646, doi. 10.1007/s11664-012-1941-9
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- Article
Low-Temperature Sintering and Electromagnetic Properties of NiCuZn/CaTiO Composites.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 701, doi. 10.1007/s11664-012-1933-9
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- Article
Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys.
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- 2012
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- Correction Notice
Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 720, doi. 10.1007/s11664-012-1949-1
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- Article
Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 730, doi. 10.1007/s11664-012-1952-6
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- Article
Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 763, doi. 10.1007/s11664-012-1921-0
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Impedance Spectroscopy of Dielectric BaTi<sub>5</sub>O<sub>11</sub> Film Prepared by Laser Chemical Vapor Deposition Method.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 689, doi. 10.1007/s11664-011-1876-6
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- Article
Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 706, doi. 10.1007/s11664-012-1944-6
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Transport Properties of Ni and PbTe Under Pressure.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 633, doi. 10.1007/s11664-012-1945-5
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- Article