Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 12

Results: 27

Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3249, doi. 10.1007/s11664-012-2170-y

By:

Xie, Huxiao;
Chawla, Nikhilesh;
Mirpuri, Kabir

Publication type:

Article

Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3276, doi. 10.1007/s11664-012-2200-9

By:

Ho, C.E.;
Kuo, T.T.;
Gierlotka, W.;
Ma, F.M.

Publication type:

Article

Interfacial Reactions Between Sn-Zn Alloys and Au Substrate.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3284, doi. 10.1007/s11664-012-2208-1

By:

Yen, Yee-wen;
Lin, Ming-chih;
Lin, Cheng-kuan;
Chen, Wan-ching

Publication type:

Article

Liquid-State Interfacial Reactions of Sn-Zn/Co Couples at 250°C.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3259, doi. 10.1007/s11664-012-2190-7

By:

Wang, Chao-hong;
Huang, Sheng-en;
Liu, Jian-lin

Publication type:

Article

Kinetics of Solid-State Reactive Diffusion in the (Ni-Cr)/Sn System.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3292, doi. 10.1007/s11664-012-2217-0

By:

Motojima, K.;
Asano, T.;
Shinmei, W.;
Kajihara, M.

Publication type:

Article

Interfacial Reactions and Mechanical Properties of Bi- x wt.%Sn/Cu Joints ( x = 2, 5, 10).

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3303, doi. 10.1007/s11664-012-2230-3

By:

Wang, Jin-Yi;
Lin, Chih-Fan;
Chen, Chih-Ming

Publication type:

Article

Electrical and Optical Properties of p-Type Li,Cu-Codoped NiO Thin Films.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3382, doi. 10.1007/s11664-012-2213-4

By:

Chen, Xinman;
Zhao, Lingzhi;
Niu, Qiaoli

Publication type:

Article

Microstructural Investigation of Interfacial Features in Al Wire Bonds.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3436, doi. 10.1007/s11664-012-2215-2

By:

Khatibi, G.;
Weiss, B.;
Bernardi, J.;
Schwarz, S.

Publication type:

Article

Effect of Inverse Doped Surface Layer in Schottky Barrier Modification: A Numerical Study.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3387, doi. 10.1007/s11664-012-2234-z

By:

Chand, Subhash;
Kaushal, Priyanka;
Osvald, Jozef

Publication type:

Article

Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3266, doi. 10.1007/s11664-012-2196-1

By:

Ho, C.E.;
Wu, W.H.;
Wang, C.C.;
Lin, Y.C.

Publication type:

Article

Electrode Materials for GeSbTe-Based Memristors.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3417, doi. 10.1007/s11664-012-2256-6

By:

Wang, Q.;
Sun, H.J.;
Zhang, J.J.;
Xu, X.H.;
Miao, X.S.

Publication type:

Article

Highly Textured MnSi Film Obtained by High-Temperature Treatment.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3423, doi. 10.1007/s11664-012-2257-5

By:

Zirmi, R.;
Portavoce, A.;
Delattre, R.;
Thomas, O.;
Belkaid, M.S.;
Record, M.-C.

Publication type:

Article

Effect of a Nanodimensional Polyethylenimine Layer on Current-Voltage Characteristics of Hybrid Structures Based on Single-Crystal Silicon.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3427, doi. 10.1007/s11664-012-2266-4

By:

Malyar, I.V.;
Gorin, D.A.;
Stetsyura, S.V.;
Santer, S.

Publication type:

Article

Rediscovery of the Role of the i-Layer in n-ZnO/SiO/ p-GaN Through Observations from Both the ZnO and GaN Sides.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3453, doi. 10.1007/s11664-012-2242-z

By:

Liu, Yuanda;
Liang, Hongwei;
Xia, Xiaochuan;
Bian, Jiming;
Shen, Rensheng;
Liu, Yang;
Luo, Yingmin;
Du, Guotong

Publication type:

Article

Fabrication of CIGS Films by Electrodeposition Method for Photovoltaic Cells.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3375, doi. 10.1007/s11664-012-2252-x

By:

Lee, Hyunju;
Yoon, Hyukjoo;
Ji, Changwook;
Lee, Dongyun;
Lee, Jae-Ho;
Yun, Jae-Ho;
Kim, Yangdo

Publication type:

Article

Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3447, doi. 10.1007/s11664-012-2260-x

By:

Li, X.;
Liu, L.J.;
Zhang, X.Y.;
Chu, J.P.;
Wang, Q.;
Dong, C.

Publication type:

Article

Thermoelectric Properties of Heavy Rare Earth Filled Skutterudites DyFeCoSb.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3402, doi. 10.1007/s11664-012-2251-y

By:

Luo, Tao;
Liu, Ruiheng;
Qiu, Pengfei;
Zhou, Yanfei;
Lin, Zhiwei;
Lei, Yong;
Shi, Xun;
Zhang, Wenqing;
Chen, Lidong

Publication type:

Article

NiSn Formation in As-Soldered Ni-Sn and ENIG-Sn Couples.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3331, doi. 10.1007/s11664-012-2277-1

By:

Belyakov, S.;
Gourlay, C.

Publication type:

Article

Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3309, doi. 10.1007/s11664-012-2244-x

By:

Hu, Tien-Chen;
Hsu, Feng-chih;
Huang, An-Wen;
Lin, Ming-Tzer

Publication type:

Article

Improved Optoelectronic Properties of Rapid Thermally Annealed Dilute Nitride GaInNAs Photodetectors.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3393, doi. 10.1007/s11664-012-2245-9

By:

Tan, S.L.;
Hunter, C.J.;
Zhang, S.;
Tan, L.J.J.;
Goh, Y.L.;
Ng, J.S.;
Marko, I.P.;
Sweeney, S.J.;
Adams, A.R.;
Allam, J.;
David, J.P.R.

Publication type:

Article

Evaluation of Diffusion Barrier Between Pure Sn and Te.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3320, doi. 10.1007/s11664-012-2269-1

By:

Ko, Chang-Yen;
Wu, Albert

Publication type:

Article

Interfacial Reactions Between Diffusion Barriers and Thermoelectric Materials Under Current Stressing.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3325, doi. 10.1007/s11664-012-2275-3

By:

Lo, Li-Chen;
Wu, Albert

Publication type:

Article

Effects of BiSe Nanoparticle Inclusions on the Microstructure and Thermoelectric Properties of BiTe-Based Nanocomposites.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3411, doi. 10.1007/s11664-012-2255-7

By:

Kim, HeeJin;
Han, Mi-Kyung;
Yo, Chul-Hyun;
Lee, Wooyoung;
Kim, Sung-Jin

Publication type:

Article

Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3368, doi. 10.1007/s11664-012-2293-1

By:

Hsiao, Yu-Hsiang;
Lin, Kwang-Lung;
Lee, Chiu-Wen;
Shao, Yu-Hsiu;
Lai, Yi-Shao

Publication type:

Article

Electromigration Study on Sn(Cu) Solder/Ni(P) Joint Interfaces.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3342, doi. 10.1007/s11664-012-2301-5

By:

Wu, S.H.;
Hu, Y.J.;
Lu, C.T.;
Huang, T.S.;
Chang, Y.H.;
Liu, C.Y.

Publication type:

Article

Atomic Mobilities in the Ag-Cu-Sn Face-Centered Cubic Lattice.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3359, doi. 10.1007/s11664-012-2330-0

By:

Gierlotka, W.;
Chen, Y.H.;
Haque, M.A.;
Rahman, M.A.

Publication type:

Article

Effects of Pd(P) Thickness on the Microstructural Evolution Between Sn-3Ag-0.5Cu and Ni(P)/Pd(P)/Au Surface Finish During the Reflow Process.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3348, doi. 10.1007/s11664-012-2320-2

By:

Chung, Bo-Mook;
Baek, Yong-Ho;
Choi, Jaeho;
Huh, Joo-Youl

Publication type:

Article