Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 1
Results: 20
Interfacial Reactions in Sn/Fe- xNi Couples.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 144, doi. 10.1007/s11664-011-1727-5
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Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu- xPd System.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 2, doi. 10.1007/s11664-011-1710-1
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Solid-Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 11, doi. 10.1007/s11664-011-1722-x
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Phase Equilibria of the Sn-Bi-Te Ternary System.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 22, doi. 10.1007/s11664-011-1730-x
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Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 32, doi. 10.1007/s11664-011-1733-7
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Fast Concurrent Growth of NiSn and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 44, doi. 10.1007/s11664-011-1736-4
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Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 153, doi. 10.1007/s11664-011-1740-8
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A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 115, doi. 10.1007/s11664-011-1761-3
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A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 60, doi. 10.1007/s11664-011-1751-5
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Optical Properties and Durability of AlO-NiP/Al Solar Absorbers Prepared by Electroless Nickel Composite Plating.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 53, doi. 10.1007/s11664-011-1746-2
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The Transparent Conductive Properties of Manganese-Doped Zinc Oxide Films Deposited by Chemical Bath Deposition.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 122, doi. 10.1007/s11664-011-1770-2
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Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 130, doi. 10.1007/s11664-011-1772-0
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Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 86, doi. 10.1007/s11664-011-1757-z
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Foreword.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 1, doi. 10.1007/s11664-011-1777-8
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- Article
A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 109, doi. 10.1007/s11664-011-1759-x
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The Effect of Sb Addition on Sn-Based Alloys for High-Temperature Lead-Free Solders: an Investigation of the Ag-Sb-Sn System.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 67, doi. 10.1007/s11664-011-1752-4
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Elucidating the Metal-Induced Crystallization and Diffusion Behavior of Al/a-Ge Thin Films.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 159, doi. 10.1007/s11664-011-1796-5
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Low-Resistivity Ru-Ta-C Barriers for Cu Interconnects.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 138, doi. 10.1007/s11664-011-1797-4
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Ni Interdiffusion Coefficient and Activation Energy in CuSn.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 172, doi. 10.1007/s11664-011-1821-8
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Conductor Formation Through Phase Transformation in Ti-Oxide Thin Films.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 166, doi. 10.1007/s11664-011-1822-7
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