Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1895, doi. 10.1007/s11664-011-1654-5
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2011 AND VI 40 AND IP 9
Results: 22
1
2
Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb-Sn Solders.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1903, doi. 10.1007/s11664-011-1668-z
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- Publication type:
- Article
3
Hybrid Inorganic-Organic Heterojunction Solar Cell.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 2033, doi. 10.1007/s11664-011-1671-4
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- Publication type:
- Article
4
Electron Emission Properties of Surface-Conduction Electron Emitters With a PdO-C-PdO Multilayer Conductive Film Deposited by Magnetron Sputtering.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 2020, doi. 10.1007/s11664-011-1683-0
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- Publication type:
- Article
5
Calculation of the Thermoelectric Power of Vanadium, Niobium, and Tantalum.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1984, doi. 10.1007/s11664-011-1687-9
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- Publication type:
- Article
6
Photoluminescence and Raman Spectroscopy of Polycrystalline ZnO Nanofibers Deposited by Electrospinning.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 2015, doi. 10.1007/s11664-011-1688-8
- By:
- Publication type:
- Article
7
Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1921, doi. 10.1007/s11664-011-1672-3
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- Publication type:
- Article
8
Synthesis and Characterization of Polythiophene/BiTe Nanocomposite Thermoelectric Material.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 2027, doi. 10.1007/s11664-011-1664-3
- By:
- Publication type:
- Article
9
Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1912, doi. 10.1007/s11664-011-1666-1
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- Publication type:
- Article
10
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1950, doi. 10.1007/s11664-011-1686-x
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- Publication type:
- Article
11
Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1943, doi. 10.1007/s11664-011-1684-z
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- Publication type:
- Article
12
Enhancement of the Stability of Ti and Ni Ohmic Contacts to 4H-SiC with a Stable Protective Coating for Harsh Environment Applications.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1990, doi. 10.1007/s11664-011-1681-2
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- Publication type:
- Article
13
Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1937, doi. 10.1007/s11664-011-1682-1
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- Publication type:
- Article
14
Tin Whisker Growth on NdSn Powder.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1962, doi. 10.1007/s11664-011-1701-2
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- Publication type:
- Article
15
Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1956, doi. 10.1007/s11664-011-1700-3
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- Publication type:
- Article
16
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1967, doi. 10.1007/s11664-011-1702-1
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- Publication type:
- Article
17
Synthesis and Characterization of SrFeZnO Nanoparticles for Enhanced Microwave Absorption.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 2004, doi. 10.1007/s11664-011-1693-y
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- Publication type:
- Article
18
Effects of Thermal Annealing on the Formation of Buried β-SiC by Ion Implantation.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1998, doi. 10.1007/s11664-011-1695-9
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- Publication type:
- Article
19
A Sharp Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1876, doi. 10.1007/s11664-011-1696-8
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- Publication type:
- Article
20
A Diffuse Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1867, doi. 10.1007/s11664-011-1689-7
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- Publication type:
- Article
21
Characterization and Electrochemical Mechanism for Bromide-Containing Conductive Anodic Filament (CAF) Failure.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1884, doi. 10.1007/s11664-011-1694-x
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- Publication type:
- Article
22
Effects of Solvent Type on Low-Temperature Sintering of Silver Oxide Paste to Form Electrically Conductive Silver Film.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1977, doi. 10.1007/s11664-011-1698-6
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- Publication type:
- Article