Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1377, doi. 10.1007/s11664-011-1520-5
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2011 AND VI 40 AND IP 6
Results: 19
1
2
Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1403, doi. 10.1007/s11664-010-1496-6
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- Publication type:
- Article
3
A Study of Difference in Reflow Characteristics Between Electroplated and Sputtered Cu in a Dual-Damascene Fabrication Process for Silicon Semiconductor Devices.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1384, doi. 10.1007/s11664-011-1521-4
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- Publication type:
- Article
4
Improved Electrical Performance and Reliability of Poly-Si TFTs Fabricated by Drive-In Nickel-Induced Crystallization with Chemical Oxide Layer.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1470, doi. 10.1007/s11664-011-1522-3
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- Publication type:
- Article
5
Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1409, doi. 10.1007/s11664-011-1534-z
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- Publication type:
- Article
6
Study of Synthesis and Temperature Dependence of DC Conductivity in the Low Temperature Range for Poly( N-Methylaniline).
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1364, doi. 10.1007/s11664-011-1526-z
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- Publication type:
- Article
7
Cr-Doped III-V Nitrides: Potential Candidates for Spintronics.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1428, doi. 10.1007/s11664-011-1539-7
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- Publication type:
- Article
8
Characterization and Properties of Nickel Aluminide Nanocrystals in an Alumina Layer for Nonvolatile Memory Applications.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1345, doi. 10.1007/s11664-011-1576-2
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- Publication type:
- Article
9
The Effect of Doping with the Polymer Metallic Complex Poly Zinc Acrylate on Superconducting Bulk MgB.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1369, doi. 10.1007/s11664-011-1535-y
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- Publication type:
- Article
10
Interpretation of Absolute Laser Reflectance During Optical Monitoring of Polycrystalline GaAs Deposition on Quartz Using Metalorganic Chemical Vapor Deposition.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1437, doi. 10.1007/s11664-011-1540-1
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- Publication type:
- Article
11
Effects of Processing and Amount of Co Addition on Shear Strength and Microstructual Development in the Sn-3.0Ag-0.5Cu Solder Joint.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1416, doi. 10.1007/s11664-011-1577-1
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- Publication type:
- Article
12
Silver Nanoparticle Paste for Low-Temperature Bonding of Copper.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1394, doi. 10.1007/s11664-011-1594-0
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- Publication type:
- Article
13
Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1422, doi. 10.1007/s11664-011-1592-2
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- Publication type:
- Article
14
Stabilization of the Thermal Decomposition of Poly(Propylene Carbonate) Through Copper Ion Incorporation and Use in Self-Patterning.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1350, doi. 10.1007/s11664-011-1518-z
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- Publication type:
- Article
15
Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1444, doi. 10.1007/s11664-011-1597-x
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- Publication type:
- Article
16
Effects of Annealing on Structural and Electrical Properties of CuInSe Thin Films Prepared by Hybrid Sputtering/Evaporation Processes.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1452, doi. 10.1007/s11664-011-1604-2
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- Publication type:
- Article
17
Gettered GaP Substrates for Improved Multijunction Solar Cell Devices.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1457, doi. 10.1007/s11664-011-1605-1
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- Publication type:
- Article
18
Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1335, doi. 10.1007/s11664-011-1613-1
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- Publication type:
- Article
19
Effect of Sputtered ZnO Layers on Behavior of Thin-Film Transistors Deposited at Room Temperature in a Nonreactive Atmosphere.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1461, doi. 10.1007/s11664-011-1608-y
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- Publication type:
- Article