Works matching IS 03615235 AND DT 2011 AND VI 40 AND IP 2
Results: 17
Interdependent Intermetallic Compound Growth in an Electroless Ni-P/Sn-3.5Ag Reaction Couple.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 213, doi. 10.1007/s11664-010-1447-2
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Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 195, doi. 10.1007/s11664-010-1425-8
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Flexible Polyarylene Ether Nitrile/BaTiO Nanocomposites with High Energy Density for Film Capacitor Applications.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 141, doi. 10.1007/s11664-010-1417-8
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Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 189, doi. 10.1007/s11664-010-1433-8
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Molecular Dynamics Simulation of MBE Growth of CdTe/ZnTe/Si.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 109, doi. 10.1007/s11664-010-1422-y
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The Difference Between Thermo- and Pyroelectric Co-Based Rare-Earth (Nd, Y, Gd, Ce) Oxide Composites Measured Using a High Temperature Gradient.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 127, doi. 10.1007/s11664-010-1420-0
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Electrical Resistance and Microstructural Changes of Silver-Epoxy Isotropic Conductive Adhesive Joints Under High Humidity and Heat.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 232, doi. 10.1007/s11664-010-1421-z
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Effects of Different Kinds of Underfills and Temperature-Humidity Treatments on Drop Reliability of Board-Level Packages.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 224, doi. 10.1007/s11664-010-1423-x
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Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 239, doi. 10.1007/s11664-010-1439-2
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CuSn Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 176, doi. 10.1007/s11664-010-1430-y
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Cu(In,Ga)Se Thin Film Preparation from a Cu(In,Ga) Metallic Alloy and Se Nanoparticles by an Intense Pulsed Light Technique.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 122, doi. 10.1007/s11664-010-1431-x
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Electrical and Optical Characterization of Melt-Grown Bulk InAsP Crystals.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 103, doi. 10.1007/s11664-010-1432-9
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- Article
Transformable Oxidation of Tantalum in Electrochemical Mechanical Polishing (ECMP).
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 134, doi. 10.1007/s11664-010-1443-6
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Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 165, doi. 10.1007/s11664-010-1441-8
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Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 201, doi. 10.1007/s11664-010-1438-3
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Anomalous Peak in the Forward-Bias C- V Plot and Temperature-Dependent Behavior of Au/PVA (Ni,Zn-doped)/ n-Si(111) Structures.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 157, doi. 10.1007/s11664-010-1440-9
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Synthesis, Characterization, and Photovoltaic Properties of Poly(3-Phenyl Azomethine Alkylthiophene) Polymers.
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- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 149, doi. 10.1007/s11664-010-1448-1
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- Article