High-Vacuum Evaporation of n-CuInSe Photoabsorber Films for Hybrid PV Structures.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2374, doi. 10.1007/s11664-011-1753-3
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2011 AND VI 40 AND IP 12
Results: 20
1
2
Microvoid Formation at Solder-Copper Interfaces During Annealing: a Systematic Study of the Root Cause.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2415, doi. 10.1007/s11664-011-1768-9
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- Publication type:
- Article
3
Metal-Assisted Chemical Etching Using Tollen's Reagent to Deposit Silver Nanoparticle Catalysts for Fabrication of Quasi-ordered Silicon Micro/Nanostructures.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2480, doi. 10.1007/s11664-011-1771-1
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- Publication type:
- Article
4
Study of 4H-SiC JBS Diodes Fabricated with Tungsten Schottky Barrier.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2355, doi. 10.1007/s11664-011-1774-y
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- Publication type:
- Article
5
Uniaxial Ratchetting Behavior of Solder Alloys and Its Simulation by an Elasto-Plastic-Creep Constitutive Model.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2403, doi. 10.1007/s11664-011-1773-z
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- Publication type:
- Article
6
Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2363, doi. 10.1007/s11664-011-1758-y
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- Publication type:
- Article
7
S-Graded Buffer Layers for Lattice-Mismatched Heteroepitaxial Devices.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2348, doi. 10.1007/s11664-011-1781-z
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- Publication type:
- Article
8
A Low-Temperature Pressureless Bonding Process Using a Trimodal Mixture System of Ag Nanoparticles.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2398, doi. 10.1007/s11664-011-1750-6
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- Publication type:
- Article
9
Grain Orientation Evolution and Deformation Behaviors in Pb-Free Solder Interconnects Under Mechanical Stresses.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2445, doi. 10.1007/s11664-011-1776-9
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- Publication type:
- Article
10
Structural, Optical, and Electrical Properties of Nb-Doped ZnO Thin Films Prepared by Spray Pyrolysis Method.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2382, doi. 10.1007/s11664-011-1755-1
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- Publication type:
- Article
11
Localized Recrystallization Induced by Subgrain Rotation in Sn-3.0Ag-0.5Cu Ball Grid Array Solder Interconnects During Thermal Cycling.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2470, doi. 10.1007/s11664-011-1782-y
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- Publication type:
- Article
12
Surface Tension, Density, and Thermal Expansion of (Bi-Ag)-Zn Alloys.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2465, doi. 10.1007/s11664-011-1780-0
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- Publication type:
- Article
13
Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2425, doi. 10.1007/s11664-011-1760-4
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- Publication type:
- Article
14
Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2436, doi. 10.1007/s11664-011-1766-y
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- Publication type:
- Article
15
Deep Traps in AlGaN/GaN Heterostructure Field-Effect Transistors Studied by Current-Mode Deep-Level Transient Spectroscopy: Influence of Device Location.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2337, doi. 10.1007/s11664-011-1787-6
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- Publication type:
- Article
16
Elevated-Temperature Annealing Effects on AlGaN/GaN Heterostructures.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2344, doi. 10.1007/s11664-011-1791-x
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- Publication type:
- Article
17
Self-Assembly, Optical, and Electrical Properties of a Novel Water-Soluble Perylene Bisimide.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2392, doi. 10.1007/s11664-011-1784-9
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- Publication type:
- Article
18
Increase in the Thermoelectric Efficiency of the Disordered Phase of Layered Antiferromagnetic CuCrS.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2368, doi. 10.1007/s11664-011-1789-4
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- Publication type:
- Article
19
One-Step Fabrication of Al/Sn-Bi Core-Shell Spheres via Phase Separation.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2458, doi. 10.1007/s11664-011-1779-6
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- Publication type:
- Article
20
Luminescence of 2,6-Distyrylpyridine-Doped Titania Nanostructured Monoliths.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2388, doi. 10.1007/s11664-011-1778-7
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- Publication type:
- Article