Works matching IS 03615235 AND DT 2011 AND VI 40 AND IP 11

Results: 20

Low-Complexity Full-Melt Laser-Anneal Process for Fabrication of Low-Leakage Implanted Ultrashallow Junctions.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2187, doi. 10.1007/s11664-011-1734-6

By:

Biasotto, Cleber;
Gonda, Viktor;
Nanver, Lis;
Scholtes, Tom;
Cingel, Johan;
Vidal, Daniel;
Jovanović, Vladimir

Publication type:

Article

Beam-Mode Piezoelectric Properties of Ternary Pb(InNb)O-Pb(MgNb)O-PbTiO Single Crystals for Medical Linear Array Applications.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2228, doi. 10.1007/s11664-011-1724-8

By:

Wang, Wei;
Wang, Sheng;
Zhang, Yaoyao;
Zhao, Xiangyong;
Luo, Haosu

Publication type:

Article

Grain Size and Texture of CuZnSnS Thin Films Synthesized by Cosputtering Binary Sulfides and Annealing: Effects of Processing Conditions and Sodium.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2214, doi. 10.1007/s11664-011-1729-3

By:

HLAING Oo, W.M.;
Johnson, J.L.;
Bhatia, A.;
Lund, E.A.;
Nowell, M.M.;
Scarpulla, M.A.

Publication type:

Article

Imaging Dislocations in Single-Crystal SrTiO Substrates by Electron Channeling.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2222, doi. 10.1007/s11664-011-1723-9

By:

Kamaladasa, Ranga;
Jiang, Wenkan;
Picard, Yoosuf

Publication type:

Article

Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2278, doi. 10.1007/s11664-011-1712-z

By:

Baated, Alongheng;
Hamasaki, Kyoko;
Kim, Sun;
Kim, Keun-Soo;
Suganuma, Katsuaki

Publication type:

Article

Traps in 4H-SiC Field-Effect Transistors Characterized by Capacitance- and Current-Mode Deep-Level Transient Spectroscopy.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2179, doi. 10.1007/s11664-011-1741-7

By:

Fang, Z.-Q.;
Claflin, B.;
Look, D.;
Chai, F.;
Odekirk, B.

Publication type:

Article

Fabrication of Source/Drain Electrodes for a-Si:H Thin-Film Transistors Using a Single Cu Alloy Target.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2209, doi. 10.1007/s11664-011-1728-4

By:

Lee, J.;
Lee, C.;
Nam, H.;
Yang, H.;
Ho, W.;
Jeong, J.;
Koo, D.

Publication type:

Article

Sintering of Inkjet-Printed Silver Nanoparticles at Room Temperature Using Intense Pulsed Light.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2268, doi. 10.1007/s11664-011-1711-0

By:

Kang, J.;
Ryu, J.;
Kim, H.;
Hahn, H.

Publication type:

Article

Effects of Ca and Mn Additions on the Microstructure and Dielectric Properties of (BiNa)TiO Ceramics.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2234, doi. 10.1007/s11664-011-1731-9

By:

Yuan, Y.;
Li, E.Z.;
Li, B.;
Tang, B.;
Zhou, X.H.

Publication type:

Article

A New Measurement System to Determine Material Properties of Polishing Pads.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2264, doi. 10.1007/s11664-011-1735-5

By:

Ludwig, Christian;
Chaves, Humberto

Publication type:

Article

Phase Equilibria in the Ni-Sn-Zn System at 500°C.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2290, doi. 10.1007/s11664-011-1720-z

By:

Liang, Jian-lie;
Du, Yong;
Tang, Yi-yuan;
Xie, Shi-biao;
Xu, Hong-hui;
Zeng, Ling-min;
Liu, Yong;
Zhu, Qi-ming;
Nong, Liang-qin

Publication type:

Article

Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2300, doi. 10.1007/s11664-011-1737-3

By:

Sobiech, M.;
Teufel, J.;
Welzel, U.;
Mittemeijer, E.;
Hügel, W.

Publication type:

Article

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2314, doi. 10.1007/s11664-011-1738-2

By:

Wei, Helin;
Wang, Kuisheng

Publication type:

Article

Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2320, doi. 10.1007/s11664-011-1742-6

By:

Zhang, Q.;
Zou, H.;
Zhang, Z.

Publication type:

Article

Fabrication and Properties of Novel Polyetheretherketone/Barium Titanate Composites with Low Dielectric Loss.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2240, doi. 10.1007/s11664-011-1743-5

By:

Goyal, R.;
Madav, V.;
Pakankar, P.;
Butee, S.

Publication type:

Article

Electronic and Optical Modeling of Solar Cell Compounds CuGaSe and CuInSe.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2197, doi. 10.1007/s11664-011-1739-1

By:

Soni, Amit;
Dashora, Alpa;
Gupta, Vikas;
Arora, C.;
Rérat, M.;
Ahuja, B.;
Pandey, Ravindra

Publication type:

Article

Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2329, doi. 10.1007/s11664-011-1747-1

By:

Sasangka, Wardhana;
Gan, Chee;
Thompson, Carl;
Choi, Won;
Wei, Jun

Publication type:

Article

Improved Light Output of GaN-Based Light-Emitting Diodes by Using AgNi Reflective Contacts.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2173, doi. 10.1007/s11664-011-1745-3

By:

Jung, Se-Yeon;
Lee, Sang;
Song, June-O;
Jin, Sungho;
Seong, Tae-Yeon

Publication type:

Article

Studies on Conducting Polypyrrole/Graphene Oxide Composites as Supercapacitor Electrode.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2248, doi. 10.1007/s11664-011-1749-z

By:

Konwer, Surajit;
Boruah, Ratan;
Dolui, Swapan

Publication type:

Article

Radiofrequency Shielding by Polypyrrole-Coated Nano and Regular Fibrous Mats.

Published in:

Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2256, doi. 10.1007/s11664-011-1754-2

By:

Oroumei, Azam;
Tavanai, Hossein;
Morshed, Mohammad

Publication type:

Article