Works matching IS 03615235 AND DT 2011 AND VI 40 AND IP 10
Results: 16
Synthesis and Dielectric Properties of Hyperbranched CuPc Based on Biphenyl Segments.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2166, doi. 10.1007/s11664-011-1699-5
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On the Role of Boron in CdTe and CdZnTe Crystals.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2043, doi. 10.1007/s11664-011-1706-x
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Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2111, doi. 10.1007/s11664-011-1705-y
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Optical and Dielectric Properties and Microstructures of rf-Magnetron Sputtered ZnO-Doped ZrSnTiO Films on Indium Tin Oxide/Glass Substrates.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2159, doi. 10.1007/s11664-011-1709-7
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Effects of Sm Doping on Dielectric Properties of Anatase TiO Nanoparticles Synthesized by a Low-Temperature Hydrothermal Method.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2152, doi. 10.1007/s11664-011-1707-9
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Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Optimization of Mechanical and Electrical Properties.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2126, doi. 10.1007/s11664-011-1704-z
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Optimum Thickness of Sn Film for Whisker Growth.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2069, doi. 10.1007/s11664-011-1708-8
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Influence of Surface Ligand on Ultraviolet Photodetection Property of TiO Nanocrystal/Polymer Hybrids.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2147, doi. 10.1007/s11664-011-1713-y
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Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2119, doi. 10.1007/s11664-011-1716-8
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Reduction of Copper Oxide Induced by 172 nm Vacuum Ultraviolet Radiation at Ambient Temperature.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2105, doi. 10.1007/s11664-011-1714-x
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Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2093, doi. 10.1007/s11664-011-1725-7
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Preparation and Characterization of Ultralow-Dielectric-Constant Porous SiCOH Thin Films Using 1,2-Bis(triethoxysilyl)ethane, Triethoxymethylsilane, and a Copolymer Template.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2139, doi. 10.1007/s11664-011-1721-y
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Effect of Ce-Doping on Thermoelectric Properties in PbTe Alloys Prepared by Spark Plasma Sintering.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2063, doi. 10.1007/s11664-011-1715-9
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On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2081, doi. 10.1007/s11664-011-1718-6
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Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2076, doi. 10.1007/s11664-011-1719-5
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Electrical, Thermal, and Mechanical Characterization of Novel Segmented-Leg Thermoelectric Modules.
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- Journal of Electronic Materials, 2011, v. 40, n. 10, p. 2051, doi. 10.1007/s11664-011-1717-7
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