Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 42, doi. 10.1007/s11664-010-1384-0
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2011 AND VI 40 AND IP 1
Results: 14
1
2
Investigation of a Biocompatible Polyurethane-Based Isotropically Conductive Adhesive for UHF RFID Tag Antennas.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 78, doi. 10.1007/s11664-010-1392-0
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- Article
3
Electrical Activation Studies of Silicon-Implanted AlGaN with Aluminum Mole Fraction of 11% to 51%.
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- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 11, doi. 10.1007/s11664-010-1394-y
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- Publication type:
- Article
4
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints.
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- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 71, doi. 10.1007/s11664-010-1385-z
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- Publication type:
- Article
5
Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 wt.%Bi-(Co)/Cu Couples.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 62, doi. 10.1007/s11664-010-1386-y
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- Publication type:
- Article
6
High Power Factor of HPHT-Sintered GeTe-AgSbTe Alloys.
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- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 17, doi. 10.1007/s11664-010-1383-1
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- Publication type:
- Article
7
Study of Spectroscopy and Microstructure in Nanocrystalline Cr-Doped Fibers Grown by the Drawing-Tower Technique.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 97, doi. 10.1007/s11664-010-1387-x
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- Publication type:
- Article
8
Complete Set of Material Constants of 〈011〉-Poled Rhombohedral Single-Crystal 0.25Pb(InNb)O-0.47Pb(MgNb)O-0.28PbTiO.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 92, doi. 10.1007/s11664-010-1390-2
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- Publication type:
- Article
9
Thermal Conductivity of Indium-Graphene and Indium-Gallium-Graphene Composites.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 25, doi. 10.1007/s11664-010-1391-1
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- Publication type:
- Article
10
Fabrication and Characterization of Pb(Zr,Ti)O-Pb(Nb,Zn)O Thin Films on Cantilever Stacks.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 85, doi. 10.1007/s11664-010-1407-x
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- Publication type:
- Article
11
Low-Temperature III-V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 1, doi. 10.1007/s11664-010-1397-8
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- Publication type:
- Article
12
Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 51, doi. 10.1007/s11664-010-1401-3
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- Publication type:
- Article
13
Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 35, doi. 10.1007/s11664-010-1408-9
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- Publication type:
- Article
14
Molecular Beam Epitaxial Regrowth of Antimonide-Based Semiconductors.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 6, doi. 10.1007/s11664-010-1399-6
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- Publication type:
- Article