A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 295, doi. 10.1007/s11664-009-1016-8
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2010 AND VI 39 AND IP 3
Results: 12
1
2
Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 283, doi. 10.1007/s11664-009-1014-x
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- Publication type:
- Article
3
Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 312, doi. 10.1007/s11664-009-1070-2
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- Publication type:
- Article
4
Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 333, doi. 10.1007/s11664-009-1026-6
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- Publication type:
- Article
5
Enhanced Temperature Stability of (1 − x)(K<sub>0.5</sub>Na<sub>0.5</sub>)<sub>0.94</sub>Li<sub>0.06</sub>NbO<sub>3</sub>- x(Bi<sub>0.5</sub>Na<sub>0.5</sub>)TiO<sub>3</sub> Lead-Free Piezoelectric Ceramics.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 347, doi. 10.1007/s11664-009-1030-x
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- Publication type:
- Article
6
Modeling of Thermal Conductivity of Graphite Nanosheet Composites.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 268, doi. 10.1007/s11664-009-1062-2
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- Publication type:
- Article
7
Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP).
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 338, doi. 10.1007/s11664-009-1064-0
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- Publication type:
- Article
8
Etching of <sup>10</sup>Boron with SF<sub>6</sub>-based Electron Cyclotron Resonance Plasmas for Pillar-Structured Thermal Neutron Detectors.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 263, doi. 10.1007/s11664-009-1068-9
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- Publication type:
- Article
9
Measurements of Microhardness and Thermal and Electrical Properties of the Binary Zn-0.7wt.%Cu Hypoperitectic Alloy.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 303, doi. 10.1007/s11664-009-1061-3
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- Publication type:
- Article
10
Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 273, doi. 10.1007/s11664-010-1080-0
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- Publication type:
- Article
11
Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 318, doi. 10.1007/s11664-010-1081-z
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- Publication type:
- Article
12
Effects of Solder Ball Geometry on Lap Shear Creep Rate.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 3, p. 326, doi. 10.1007/s11664-010-1072-0
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- Publication type:
- Article