Works matching IS 03615235 AND DT 2010 AND VI 39 AND IP 12

Results: 30

Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2553, doi. 10.1007/s11664-010-1373-3

By:

Harcuba, Petr;
Janeček, Miloš

Publication type:

Article

Empirical Study of Hall Bars on Few-Layer Graphene on C-Face 4H-SiC.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2696, doi. 10.1007/s11664-010-1375-1

By:

Bolen, M.;
Shen, T.;
Gu, J.;
Colby, R.;
Stach, E.;
Ye, P.;
Capano, M.

Publication type:

Article

Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2558, doi. 10.1007/s11664-010-1370-6

By:

Wang, Kai-Jheng;
Duh, Jenq-Gong;
Sykes, Bob;
Schade, Dirk

Publication type:

Article

Effects of Ni Additions on the Growth of CuSn in High-Lead Solders.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2636, doi. 10.1007/s11664-010-1317-y

By:

Wang, Y.;
Chang, C.;
Chen, W.;
Kao, C.

Publication type:

Article

Microstructural Variation and Phase Evolution in the Reaction of Sn- xAg-Cu Solders and Cu- yZn Substrates During Reflow.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2627, doi. 10.1007/s11664-010-1349-3

By:

Yu, Chi-Yang;
Duh, Jenq-Gong

Publication type:

Article

Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2618, doi. 10.1007/s11664-010-1354-6

By:

Chen, Chia-Ju;
Chen, Chih-Ming;
Horng, Ray-Hua;
Wuu, Dong-Sing;
Hong, Jhih-Sin

Publication type:

Article

Effect of DC Current on the Creep Deformation of Tin.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2611, doi. 10.1007/s11664-010-1355-5

By:

Chen, Rong;
Yang, Fuqian

Publication type:

Article

Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2605, doi. 10.1007/s11664-010-1341-y

By:

Chen, K.;
Zhu, Y.;
Wu, W.;
Reif, R.

Publication type:

Article

Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2598, doi. 10.1007/s11664-010-1344-8

By:

Sakurai, Hitoshi;
Baated, Alongheng;
Lee, Kiju;
Kim, Seongjun;
Kim, Keun-Soo;
Kukimoto, Youichi;
Kumamoto, Seishi;
Suganuma, Katsuaki

Publication type:

Article

Discussion on the Mechanism of Electromigration from the Perspective of Electromagnetism.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2583, doi. 10.1007/s11664-010-1350-x

By:

Zhou, Peng;
Johnson, William

Publication type:

Article

Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2588, doi. 10.1007/s11664-010-1348-4

By:

Lee, Tae-Kyu;
Zhou, Bite;
Blair, Lauren;
Liu, Kuo-Chuan;
Bieler, Thomas

Publication type:

Article

Formation and Growth of Intermetallic Compound CuSn at Early Stages in Lead-Free Soldering.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2574, doi. 10.1007/s11664-010-1353-7

By:

Park, M.S.;
Arroyave, R.

Publication type:

Article

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2564, doi. 10.1007/s11664-010-1352-8

By:

Lee, Tae-Kyu;
Ma, Hongtao;
Liu, Kuo-Chuan;
Xue, Jie

Publication type:

Article

Morphological Stability of Diffusion Couples Under Electric Current.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2687, doi. 10.1007/s11664-010-1368-0

By:

Leo, Perry;
Rasetti, Ana

Publication type:

Article

Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- xNi/Au/Ni Sandwich Structures.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2544, doi. 10.1007/s11664-010-1372-4

By:

Yu, Chi-Yang;
Lee, Tae-Kyu;
Tsai, Michael;
Liu, Kuo-Chuan;
Duh, Jenq-Gong

Publication type:

Article

Magnetic Silver-Coated Ferrite Nanoparticles and Their Application in Thick Films.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2702, doi. 10.1007/s11664-010-1366-2

By:

Liu, Jianguo;
Huang, Baling;
Li, Xiangyou;
Li, Ping;
Zeng, Xiaoyan

Publication type:

Article

Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2536, doi. 10.1007/s11664-010-1369-z

By:

Zhang, Ning;
Shi, Yaowu;
Guo, Fu;
Yang, Fuqian

Publication type:

Article

Investigation of Trap States in AlInN/AlN/GaN Heterostructures by Frequency-Dependent Admittance Analysis.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2681, doi. 10.1007/s11664-010-1367-1

By:

Arslan, Engin;
Bütün, Serkan;
Şafak, Yasemin;
Ozbay, Ekmel

Publication type:

Article

Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2528, doi. 10.1007/s11664-010-1376-0

By:

Tsai, M.;
Lin, Y.;
Ke, J.;
Kao, C.

Publication type:

Article

Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2522, doi. 10.1007/s11664-010-1371-5

By:

Tseng, Chien-Fu;
Wang, Kai-Jheng;
Duh, Jenq-Gong

Publication type:

Article

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2504, doi. 10.1007/s11664-010-1379-x

By:

Kim, Young;
Roh, Hee-Ra;
Kim, Sungtae;
Kim, Young-Ho

Publication type:

Article

Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2513, doi. 10.1007/s11664-010-1377-z

By:

Zhang, Ruihong;
Xu, Guangchen;
Wang, Xitao;
Guo, Fu;
Lee, Andre;
Subramanian, K.

Publication type:

Article

Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies.

Published in:: Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2503, doi. 10.1007/s11664-010-1389-8
Publication type:: Article

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2669, doi. 10.1007/s11664-010-1380-4

By:

Zhou, Bite;
Bieler, Thomas;
Lee, Tae-kyu;
Liu, Kuo-Chuan

Publication type:

Article

A New Nonlinear Optically Active Donor-Acceptor-Type Conjugated Polymer: Synthesis and Electrochemical and Optical Characterization.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2711, doi. 10.1007/s11664-010-1381-3

By:

Manjunatha, M.;
Adhikari, A.;
Hegde, P.;
Suchand Sandeep, C.;
Philip, Reji

Publication type:

Article

Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2720, doi. 10.1007/s11664-010-1382-2

By:

Kotadia, H.;
Mokhtari, O.;
Bottrill, M.;
Clode, M.;
Green, M.;
Mannan, S.

Publication type:

Article

Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl-NaSO Electroplating Solutions for Pb-Free Solder Packaging.

Published in:

2010

By:

Dalili, Neda;
He, Anqiang;
Liu, Qi;
Ivey, Douglas

Publication type:

Correction Notice

Critical Current Density for Inhibiting (Cu,Ni)Sn Formation on the Ni Side of Cu/Solder/Ni Joints.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2653, doi. 10.1007/s11664-010-1299-9

By:

Wu, W.;
Chung, H.;
Chen, B.;
Ho, C.

Publication type:

Article

Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2662, doi. 10.1007/s11664-010-1272-7

By:

Chang, C.C.;
Chung, H.Y.;
Lai, Y.S.;
Kao, C.R.

Publication type:

Article

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2643, doi. 10.1007/s11664-010-1313-2

By:

Chang, Jaewon;
Seo, Sun-Kyoung;
Lee, Hyuck

Publication type:

Article