Works matching IS 03615235 AND DT 2010 AND VI 39 AND IP 12
Results: 30
Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2553, doi. 10.1007/s11664-010-1373-3
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- Article
Empirical Study of Hall Bars on Few-Layer Graphene on C-Face 4H-SiC.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2696, doi. 10.1007/s11664-010-1375-1
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- Article
Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2558, doi. 10.1007/s11664-010-1370-6
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- Article
Effects of Ni Additions on the Growth of CuSn in High-Lead Solders.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2636, doi. 10.1007/s11664-010-1317-y
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- Article
Microstructural Variation and Phase Evolution in the Reaction of Sn- xAg-Cu Solders and Cu- yZn Substrates During Reflow.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2627, doi. 10.1007/s11664-010-1349-3
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- Article
Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2618, doi. 10.1007/s11664-010-1354-6
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- Article
Effect of DC Current on the Creep Deformation of Tin.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2611, doi. 10.1007/s11664-010-1355-5
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- Article
Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2605, doi. 10.1007/s11664-010-1341-y
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- Article
Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2598, doi. 10.1007/s11664-010-1344-8
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- Article
Discussion on the Mechanism of Electromigration from the Perspective of Electromagnetism.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2583, doi. 10.1007/s11664-010-1350-x
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- Article
Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2588, doi. 10.1007/s11664-010-1348-4
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- Article
Formation and Growth of Intermetallic Compound CuSn at Early Stages in Lead-Free Soldering.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2574, doi. 10.1007/s11664-010-1353-7
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- Article
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2564, doi. 10.1007/s11664-010-1352-8
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- Article
Morphological Stability of Diffusion Couples Under Electric Current.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2687, doi. 10.1007/s11664-010-1368-0
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- Article
Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- xNi/Au/Ni Sandwich Structures.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2544, doi. 10.1007/s11664-010-1372-4
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- Article
Magnetic Silver-Coated Ferrite Nanoparticles and Their Application in Thick Films.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2702, doi. 10.1007/s11664-010-1366-2
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- Article
Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2536, doi. 10.1007/s11664-010-1369-z
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- Article
Investigation of Trap States in AlInN/AlN/GaN Heterostructures by Frequency-Dependent Admittance Analysis.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2681, doi. 10.1007/s11664-010-1367-1
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- Article
Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2528, doi. 10.1007/s11664-010-1376-0
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- Article
Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2522, doi. 10.1007/s11664-010-1371-5
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- Article
Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2504, doi. 10.1007/s11664-010-1379-x
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- Article
Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2513, doi. 10.1007/s11664-010-1377-z
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- Article
Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2503, doi. 10.1007/s11664-010-1389-8
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- Article
Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2669, doi. 10.1007/s11664-010-1380-4
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- Article
A New Nonlinear Optically Active Donor-Acceptor-Type Conjugated Polymer: Synthesis and Electrochemical and Optical Characterization.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2711, doi. 10.1007/s11664-010-1381-3
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- Article
Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2720, doi. 10.1007/s11664-010-1382-2
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- Article
Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl-NaSO Electroplating Solutions for Pb-Free Solder Packaging.
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- 2010
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- Correction Notice
Critical Current Density for Inhibiting (Cu,Ni)Sn Formation on the Ni Side of Cu/Solder/Ni Joints.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2653, doi. 10.1007/s11664-010-1299-9
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- Article
Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2662, doi. 10.1007/s11664-010-1272-7
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- Article
Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2643, doi. 10.1007/s11664-010-1313-2
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- Article