Foreword.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2367, doi. 10.1007/s11664-010-1362-6
- Publication type:
- Article
Works matching IS 03615235 AND DT 2010 AND VI 39 AND IP 11
Results: 22
1
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The Application of Barrierless Metallization in Making Copper Alloy, Cu(RuHfN), Films for Fine Interconnects.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2441, doi. 10.1007/s11664-010-1300-7
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- Article
3
Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2412, doi. 10.1007/s11664-010-1336-8
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- Article
4
Control of Interface Traps in HfO Gate Dielectric on Silicon.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2435, doi. 10.1007/s11664-010-1323-0
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- Article
5
Optimal Electrical Conductivity for Maximum Thermoelectric Figure of Merit.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2459, doi. 10.1007/s11664-010-1364-4
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- Article
6
Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2483, doi. 10.1007/s11664-010-1356-4
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- Article
7
Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2495, doi. 10.1007/s11664-010-1359-1
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- Article
8
Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2368, doi. 10.1007/s11664-010-1345-7
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- Publication type:
- Article
9
Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2489, doi. 10.1007/s11664-010-1361-7
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- Article
10
Chalcopyrite/Si Heterojunctions for Photovoltaic Applications.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2462, doi. 10.1007/s11664-010-1365-3
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- Article
11
Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2375, doi. 10.1007/s11664-010-1358-2
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- Article
12
Electrical and Optical Characterization of AlGaN/GaN HEMTs with In Situ and Ex Situ Deposited SiN Layers.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2452, doi. 10.1007/s11664-010-1343-9
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- Article
13
Light-Harvesting in n-ZnO/ p-Silicon Heterojunctions.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2467, doi. 10.1007/s11664-010-1363-5
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- Article
14
Recrystallization of Electrodeposited Copper Thin Films During Annealing.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2476, doi. 10.1007/s11664-010-1342-x
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- Article
15
Growth Mechanism of a Ternary (Cu,Ni)Sn Compound at the Sn(Cu)/Ni(P) Interface.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2382, doi. 10.1007/s11664-010-1339-5
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- Article
16
Elastic Moduli of (Ni,Cu)Sn Ternary Alloys from First-Principles Calculations.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2429, doi. 10.1007/s11664-010-1338-6
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- Article
17
Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2418, doi. 10.1007/s11664-010-1337-7
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- Publication type:
- Article
18
In Situ Temperature Measurement of GaN-Based Ultraviolet Light-Emitting Diodes by Micro-Raman Spectroscopy.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2448, doi. 10.1007/s11664-010-1360-8
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- Article
19
High-Temperature Capacitor Based on Ca-Doped BiNaTiO-BaTiO Ceramics.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2471, doi. 10.1007/s11664-010-1246-9
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- Article
20
Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2403, doi. 10.1007/s11664-010-1346-6
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- Publication type:
- Article
21
Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2397, doi. 10.1007/s11664-010-1347-5
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- Article
22
Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2387, doi. 10.1007/s11664-010-1351-9
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- Article