Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 5
Results: 13
Low-Dimensional Waveguide Grating Fabrication in GaN with Use of SiCl<sub>4</sub>/Cl<sub>2</sub>/Ar-Based Inductively Coupled Plasma Dry Etching.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 635, doi. 10.1007/s11664-009-0731-5
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In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 647, doi. 10.1007/s11664-009-0732-4
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High-Temperature Capacitor Materials Based on Modified BaTiO<sub>3</sub>.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 706, doi. 10.1007/s11664-009-0729-z
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Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 670, doi. 10.1007/s11664-009-0689-3
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Peltier Effect on Sn/Co Interfacial Reactions.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 655, doi. 10.1007/s11664-009-0720-8
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- Article
The Potential of the Perturbed Angular Correlation Technique in Characterizing Semiconductors.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 623, doi. 10.1007/s11664-009-0658-x
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Thermomechanical Stress and Strain in Solder Joints During Electromigration.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 678, doi. 10.1007/s11664-009-0685-7
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- Article
Evolution of Luminescence from Doped Gallium Phosphide over 40 Years.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 640, doi. 10.1007/s11664-009-0678-6
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- Article
Lead-Free Bumping Using an Alternating Electromagnetic Field.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 663, doi. 10.1007/s11664-009-0722-6
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Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na<sub>2</sub>SO<sub>4</sub> Solutions.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 691, doi. 10.1007/s11664-008-0636-8
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Interdiffusion and Growth of the Superconductor Nb<sub>3</sub>Sn in Nb/Cu(Sn) Diffusion Couples.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 700, doi. 10.1007/s11664-008-0632-z
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- Article
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 685, doi. 10.1007/s11664-008-0646-6
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- Article
Microwave Dielectric Properties of ZnO-2TiO<sub>2</sub>-Nb<sub>2</sub>O<sub>5</sub> Ceramics with BaCu (B<sub>2</sub>O<sub>5</sub>) Addition.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 711, doi. 10.1007/s11664-009-0721-7
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