Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 2
Results: 21
Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 231, doi. 10.1007/s11664-008-0595-0
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- Publication type:
- Article
Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 241, doi. 10.1007/s11664-008-0582-5
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- Publication type:
- Article
Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 345, doi. 10.1007/s11664-008-0586-1
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- Publication type:
- Article
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 351, doi. 10.1007/s11664-008-0591-4
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- Publication type:
- Article
Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 356, doi. 10.1007/s11664-008-0587-0
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- Publication type:
- Article
Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 372, doi. 10.1007/s11664-008-0585-2
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- Publication type:
- Article
Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 227, doi. 10.1007/s11664-008-0589-y
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- Publication type:
- Article
Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 284, doi. 10.1007/s11664-008-0590-5
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- Publication type:
- Article
Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 292, doi. 10.1007/s11664-008-0592-3
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- Publication type:
- Article
Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 266, doi. 10.1007/s11664-008-0550-0
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- Publication type:
- Article
Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 303, doi. 10.1007/s11664-008-0599-9
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- Publication type:
- Article
The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 221, doi. 10.1007/s11664-008-0568-3
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- Publication type:
- Article
Temperature-Dependent Phase Segregation in Cu/42Sn-58Bi/Cu Reaction Couples under High Current Density.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 273, doi. 10.1007/s11664-008-0562-9
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- Publication type:
- Article
The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 252, doi. 10.1007/s11664-008-0567-4
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- Publication type:
- Article
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 365, doi. 10.1007/s11664-008-0555-8
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- Publication type:
- Article
Nature of Growth Pits in Lead Salt Epilayers Grown by Molecular Beam Epitaxy.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 325, doi. 10.1007/s11664-008-0566-5
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- Publication type:
- Article
Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 210, doi. 10.1007/s11664-008-0544-y
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- Publication type:
- Article
Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 330, doi. 10.1007/s11664-008-0576-3
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- Publication type:
- Article
Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 338, doi. 10.1007/s11664-008-0580-7
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- Publication type:
- Article
An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 257, doi. 10.1007/s11664-008-0545-x
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- Publication type:
- Article
Foreword.
- Published in:
- 2009
- By:
- Publication type:
- Editorial