Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 2

Results: 21

Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 231, doi. 10.1007/s11664-008-0595-0

By:

Zamiri, A.;
Bieler, T. R.;
Pourboghrat, F.

Publication type:

Article

Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 241, doi. 10.1007/s11664-008-0582-5

By:

Ruihong Zhang;
Fu Guo;
Jianping Liu;
Hao Shen;
Feng Tai

Publication type:

Article

Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 345, doi. 10.1007/s11664-008-0586-1

By:

Chen Wei;
Yongchang Liu;
Zhiming Gao;
Jingbo Wan;
Changsheng Ma

Publication type:

Article

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 351, doi. 10.1007/s11664-008-0591-4

By:

Chang Dong Zou;
Yu Lai Gao;
Bin Yang;
Xin Zhi Xia;
Qi Jie Zhai;
Andersson, Cristina;
Liu, Johan

Publication type:

Article

Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 356, doi. 10.1007/s11664-008-0587-0

By:

Wei Zhou;
Lijuan Liu;
Baoling Li;
Qinggong Song;
Ping Wu

Publication type:

Article

Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 372, doi. 10.1007/s11664-008-0585-2

By:

Xi Chen;
Anmin Hu;
Ming Li;
Dali Mao

Publication type:

Article

Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 227, doi. 10.1007/s11664-008-0589-y

By:

Wu, Y.K.;
Lin, K.L.;
Salam, B.

Publication type:

Article

Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 284, doi. 10.1007/s11664-008-0590-5

By:

Hui Zhao;
Nalagatla, Dinesh;
Sekulic, Dusan

Publication type:

Article

Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 292, doi. 10.1007/s11664-008-0592-3

By:

Snugovsky, Polina;
McCormick, Heather;
Bagheri, Simin;
Bagheri, Zohreh;
Hamilton, Craig;
Romansky, Marianne

Publication type:

Article

Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 266, doi. 10.1007/s11664-008-0550-0

By:

Kim, Seongjun;
Kim, Keun-Soo;
Kim, Sun-Sik;
Suganuma, Katsuaki

Publication type:

Article

Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 303, doi. 10.1007/s11664-008-0599-9

By:

Osenbach, J.;
Amin, A.;
Bachman, M.;
Baiocchi, F.;
Bitting, D.;
Crouthamel, D.;
DeLucca, J.;
Gerlach, D.;
Goodell, J.;
Peridier, C.;
Stahley, M.;
Weachock, R.

Publication type:

Article

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 210, doi. 10.1007/s11664-008-0544-y

By:

Dudek, M.A.;
Chawla, N.

Publication type:

Article

Temperature-Dependent Phase Segregation in Cu/42Sn-58Bi/Cu Reaction Couples under High Current Density.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 273, doi. 10.1007/s11664-008-0562-9

By:

Guangchen Xu;
Hongwen He;
Fu Guo

Publication type:

Article

The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 252, doi. 10.1007/s11664-008-0567-4

By:

Wu, Albert T.;
Ming-Hsun Chen;
Ciou-Nan Siao

Publication type:

Article

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 365, doi. 10.1007/s11664-008-0555-8

By:

Made, Riko I.;
Gan, Chee Lip;
Yan, Li Ling;
Aibin Yu;
Yoon, Seung Wook;
Lau, John H.;
Chengkuo Lee

Publication type:

Article

Nature of Growth Pits in Lead Salt Epilayers Grown by Molecular Beam Epitaxy.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 325, doi. 10.1007/s11664-008-0566-5

By:

Jiangang Ma;
Donghui Li;
Gang Bi;
Fanghai Zhao;
Elizondo, Shelly;
Mukherjee, Shaibal;
Zhisheng Shi

Publication type:

Article

The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 221, doi. 10.1007/s11664-008-0568-3

By:

Kinney, Christopher;
Morris, J. W.;
Tae-Kyu Lee;
Kuo-Chuan Liu;
Jie ,1Xue;
Towne, Dave

Publication type:

Article

Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 330, doi. 10.1007/s11664-008-0576-3

By:

Mahmudi, R.;
Geranmayeh, A.R.;
Noori, H.;
Taghaddosi, M.

Publication type:

Article

Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 338, doi. 10.1007/s11664-008-0580-7

By:

Hsiao-Yun Chen;
Chih Chen

Publication type:

Article

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 257, doi. 10.1007/s11664-008-0545-x

By:

Sun-Kyoung Seo;
Sung Kang;
Da-Yuan Shih;
Hyuck Lee

Publication type:

Article

Foreword.

Published in:

2009

By:

Fu Guo;
Handwerker, Carol;
Chada, Srinivas;
Hua, Fay;
Zeng, Kejun

Publication type:

Editorial