Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 12
Results: 43
The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2563, doi. 10.1007/s11664-009-0876-2
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- Article
Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2470, doi. 10.1007/s11664-009-0857-5
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- Article
Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2429, doi. 10.1007/s11664-009-0871-7
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- Article
Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2573, doi. 10.1007/s11664-009-0914-0
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- Article
Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2489, doi. 10.1007/s11664-009-0916-y
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- Publication type:
- Article
Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2694, doi. 10.1007/s11664-009-0909-x
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- Article
The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2726, doi. 10.1007/s11664-009-0915-z
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- Publication type:
- Article
Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2600, doi. 10.1007/s11664-009-0881-5
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- Publication type:
- Article
Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2610, doi. 10.1007/s11664-009-0921-1
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- Publication type:
- Article
Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2712, doi. 10.1007/s11664-009-0919-8
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- Publication type:
- Article
Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2506, doi. 10.1007/s11664-009-0896-y
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- Publication type:
- Article
Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2479, doi. 10.1007/s11664-009-0925-x
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- Publication type:
- Article
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2579, doi. 10.1007/s11664-009-0894-0
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- Publication type:
- Article
Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2659, doi. 10.1007/s11664-009-0890-4
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- Publication type:
- Article
Mechanical Shock Behavior of Bulk Pure Sn Solder.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2746, doi. 10.1007/s11664-009-0889-x
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- Publication type:
- Article
Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2628, doi. 10.1007/s11664-009-0923-z
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- Publication type:
- Article
Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2762, doi. 10.1007/s11664-009-0912-2
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- Publication type:
- Article
Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2735, doi. 10.1007/s11664-009-0898-9
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- Publication type:
- Article
Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2554, doi. 10.1007/s11664-009-0848-6
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- Article
Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu<sub>6</sub>Sn<sub>5</sub> Intermetallic Compound.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2676, doi. 10.1007/s11664-009-0911-3
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- Article
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2443, doi. 10.1007/s11664-009-0913-1
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- Publication type:
- Article
Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2647, doi. 10.1007/s11664-009-0910-4
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- Publication type:
- Article
The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2461, doi. 10.1007/s11664-009-0902-4
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- Publication type:
- Article
Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2534, doi. 10.1007/s11664-009-0933-x
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- Publication type:
- Article
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2685, doi. 10.1007/s11664-009-0873-5
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- Publication type:
- Article
Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2720, doi. 10.1007/s11664-009-0918-9
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- Article
Foreword.
- Published in:
- 2009
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- Publication type:
- Editorial
Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2516, doi. 10.1007/s11664-009-0930-0
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- Publication type:
- Article
Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2780, doi. 10.1007/s11664-009-0931-z
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- Publication type:
- Article
Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2702, doi. 10.1007/s11664-009-0929-6
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- Publication type:
- Article
Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2668, doi. 10.1007/s11664-009-0928-7
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- Publication type:
- Article
Multiphase Field Simulations of Intermetallic Compound Growth During Lead-Free Soldering.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2525, doi. 10.1007/s11664-009-0849-5
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- Publication type:
- Article
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2585, doi. 10.1007/s11664-009-0851-y
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- Publication type:
- Article
Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2770, doi. 10.1007/s11664-009-0936-7
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- Publication type:
- Article
Interfacial Adhesion Characteristics Between Electroless-Plated Ni and Polyimide Films Modified by Alkali Surface Pretreatment.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2455, doi. 10.1007/s11664-009-0937-6
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- Publication type:
- Article
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2436, doi. 10.1007/s11664-009-0941-x
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- Publication type:
- Article
Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni- xCu/Ti Underbump Metallization After Various Reflows.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2543, doi. 10.1007/s11664-009-0943-8
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- Publication type:
- Article
ENIG Corrosion Induced by Second-Phase Precipitation.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2592, doi. 10.1007/s11664-009-0938-5
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- Publication type:
- Article
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2756, doi. 10.1007/s11664-009-0944-7
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- Publication type:
- Article
Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2617, doi. 10.1007/s11664-009-0932-y
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- Publication type:
- Article
Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2449, doi. 10.1007/s11664-009-0942-9
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- Publication type:
- Article
Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2496, doi. 10.1007/s11664-009-0940-y
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- Publication type:
- Article
Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays.
- Published in:
- 2009
- By:
- Publication type:
- Correction Notice