Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 12

Results: 43

The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2563, doi. 10.1007/s11664-009-0876-2

By:

Wu, W. H.;
Chung, H. L.;
Chen, C. N.;
Ho, C. E.

Publication type:

Article

Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2429, doi. 10.1007/s11664-009-0871-7

By:

Jicheng Gong;
Conway, Paul P.;
Changqing Liu;
Silberschmidt, Vadim V.

Publication type:

Article

Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2470, doi. 10.1007/s11664-009-0857-5

By:

Guo, H. Y.;
Guo, J. D.;
Shang, J. K.

Publication type:

Article

Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2573, doi. 10.1007/s11664-009-0914-0

By:

Hsiao, Y. H.;
Tseng, H. W.;
Liu, C. Y.

Publication type:

Article

Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2489, doi. 10.1007/s11664-009-0916-y

By:

Sang-Su Ha;
Jin-Kyu Jang;
Sang-Ok Ha;
Jong-Woong Kim;
Jeong-Won Yoon;
Byung-Woo Kim;
Sun-Kyu Park;
Seung-Boo Jung

Publication type:

Article

Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2694, doi. 10.1007/s11664-009-0909-x

By:

Bieler, Thomas R.;
Telang, Adwait U.

Publication type:

Article

The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2726, doi. 10.1007/s11664-009-0915-z

By:

Dimitrovska, Aleksandra;
Kovacevic, Radovan

Publication type:

Article

Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2600, doi. 10.1007/s11664-009-0881-5

By:

Wagner, John L.;
Ladwig, Peter F.;
Riemer, Doug P.;
Houk, Galen

Publication type:

Article

Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2610, doi. 10.1007/s11664-009-0921-1

By:

Nishikawa, Hiroshi;
Hamada, Yoshihito;
Takemoto, Tadashi

Publication type:

Article

Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2712, doi. 10.1007/s11664-009-0919-8

By:

Bieler, Thomas R.;
Tae-kyu Lee;
Kuo-Chuan Liu

Publication type:

Article

Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2628, doi. 10.1007/s11664-009-0923-z

By:

Snugovsky, Polina;
Bagheri, Zohreh;
Hamilton, Craig

Publication type:

Article

Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2479, doi. 10.1007/s11664-009-0925-x

By:

Alam, M. E.;
Nai, S. M. L.;
Gupta, M.

Publication type:

Article

TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2579, doi. 10.1007/s11664-009-0894-0

By:

Shang, P. J.;
Liu, Z. Q.;
Li, D. X.;
Shang, J. K.

Publication type:

Article

Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2659, doi. 10.1007/s11664-009-0890-4

By:

Kobayashi, Takayuki;
Lee, Andre;
Subramanian, K. N.

Publication type:

Article

Mechanical Shock Behavior of Bulk Pure Sn Solder.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2746, doi. 10.1007/s11664-009-0889-x

By:

Yazzie, K. E.;
Fei, H.;
Williams, J. J.;
Jiang, H.;
Chawla, N.

Publication type:

Article

Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2735, doi. 10.1007/s11664-009-0898-9

By:

Dutta, I.;
Raj, R.;
Kumar, P.;
Chen, T.;
Nagaraj, C. M.;
Liu, J.;
Renavikar, M.;
Wakharkar, V.

Publication type:

Article

Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2443, doi. 10.1007/s11664-009-0913-1

By:

Liang, S. W.;
Hsiang-Yao Hsiao;
Chih Chen;
Luhua Xu;
Tu, K. N.;
Yi-Shao Lai

Publication type:

Article

The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2461, doi. 10.1007/s11664-009-0902-4

By:

Sun-Kyoung Seo;
Sung Kang;
Moon Cho;
Da-Yuan Shih;
Hyuck Lee

Publication type:

Article

Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2506, doi. 10.1007/s11664-009-0896-y

By:

Daghfal, John P.;
Shang, P. J.;
Liu, Z. Q.;
Shang, J. K.

Publication type:

Article

Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu<sub>6</sub>Sn<sub>5</sub> Intermetallic Compound.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2676, doi. 10.1007/s11664-009-0911-3

By:

Buchovecky, Eric;
Jadhav, Nitin;
Bower, Allan F.;
Chason, Eric

Publication type:

Article

Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2554, doi. 10.1007/s11664-009-0848-6

By:

Yong-Jun Oh;
Sung-Yong Oh

Publication type:

Article

Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2762, doi. 10.1007/s11664-009-0912-2

By:

Tung-Han Chuang;
Chih-Yuan Cheng;
Tao-Chih Chang

Publication type:

Article

Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2647, doi. 10.1007/s11664-009-0910-4

By:

Fu Guo;
Guangchen Xu;
Hongwen He;
Mengke Zhao;
Jia Sun;
Wang, C. Henry

Publication type:

Article

Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2720, doi. 10.1007/s11664-009-0918-9

By:

Bakhishev, Teymur;
Subramanian, Vivek

Publication type:

Article

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2702, doi. 10.1007/s11664-009-0929-6

By:

Bite Zhou;
Bieler, Thomas R.;
Tae-Kyu Lee;
Kuo-Chuan Liu

Publication type:

Article

Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2668, doi. 10.1007/s11664-009-0928-7

By:

Seongjun Kim;
Keun-Soo Kim;
Sun-Sik Kim;
Suganuma, Katsuaki;
Izuta, Goro

Publication type:

Article

Foreword.

Published in:

2009

By:

Kang, Sung K.;
Anderson, Iver;
Chada, Srini;
Jeng-Gong Duh;
Turbini, Laura J.;
Wu, Albert;
Kao, C. Robert;
Fay Hua;
Subramanian, K. N.;
Frear, Darrel;
Handwerker, Carol;
Fu Guo;
Chawla, Nik;
Kejun Zeng

Publication type:

Editorial

Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2516, doi. 10.1007/s11664-009-0930-0

By:

Dimitrovska, Aleksandra;
Kovacevic, Radovan

Publication type:

Article

Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2780, doi. 10.1007/s11664-009-0931-z

By:

Wu, Albert T.;
Sun, K. H.

Publication type:

Article

Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2534, doi. 10.1007/s11664-009-0933-x

By:

Kai-Jheng Wang;
Jenq-Gong Duh

Publication type:

Article

Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2685, doi. 10.1007/s11664-009-0873-5

By:

Tae-Kyu Lee;
Kuo-Chuan Liu;
Bieler, Thomas R.

Publication type:

Article

Multiphase Field Simulations of Intermetallic Compound Growth During Lead-Free Soldering.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2525, doi. 10.1007/s11664-009-0849-5

By:

Park, M. S.;
Arróyave, R.

Publication type:

Article

The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2585, doi. 10.1007/s11664-009-0851-y

By:

Kinney, Christopher;
Tae-Kyu Lee;
Kuo-Chuan Liu;
Morris, J. W.

Publication type:

Article

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2770, doi. 10.1007/s11664-009-0936-7

By:

Anderson, Iver E.;
Walleser, Jason W.;
Harringa, Joel L.;
Laabs, Fran;
Kracher, Alfred

Publication type:

Article

Interfacial Adhesion Characteristics Between Electroless-Plated Ni and Polyimide Films Modified by Alkali Surface Pretreatment.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2455, doi. 10.1007/s11664-009-0937-6

By:

Kyoung-Jin Min;
Sung-Cheol Park;
Kyu Hwang Lee;
Yongsoo Jeong;
Young-Bae Park

Publication type:

Article

Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2436, doi. 10.1007/s11664-009-0941-x

By:

Mittal, Jagjiwan;
Shih-Ming Kuo;
Yu-Wei Lin;
Kwang-Lung Lin

Publication type:

Article

Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni- xCu/Ti Underbump Metallization After Various Reflows.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2543, doi. 10.1007/s11664-009-0943-8

By:

Chung-Nan Peng;
Jenq-Gong Duh

Publication type:

Article

ENIG Corrosion Induced by Second-Phase Precipitation.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2592, doi. 10.1007/s11664-009-0938-5

By:

Osenbach, John;
Amin, Ahmed;
Baiocchi, Frank;
DeLucca, John

Publication type:

Article

Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2617, doi. 10.1007/s11664-009-0932-y

By:

Arfaei, Babak;
Cotts, Eric

Publication type:

Article

Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2449, doi. 10.1007/s11664-009-0942-9

By:

Eun-Jung Jang;
Seungmin Hyun;
Hak-Joo Lee;
Young-Bae Park

Publication type:

Article

Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2496, doi. 10.1007/s11664-009-0940-y

By:

Chia-Yen Tan;
Jenq-Gong Duh

Publication type:

Article

Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays.

Published in:

2009

By:

Wu, Albert T.;
Chun-Yang Tsai;
Chin-Li Kao;
Meng-Kai Shih;
Yi-Shao Lai;
Hsin-Yi Lee;
Ching-Shun Ku

Publication type:

Correction Notice

Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2756, doi. 10.1007/s11664-009-0944-7

By:

Fu Guo;
Guangchen Xu;
Jia Sun;
Zhidong Xia;
Yongping Lei;
Yaowu Shi;
Xiaoyan Li

Publication type:

Article