Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 11

Results: 27

Interfacial Reactions of Sn-9Zn- xCu ( x = 1, 4, 7, 10) Solders with Ni Substrates.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2222, doi. 10.1007/s11664-009-0880-6

By:

Liou, Wei-kai;
Yen, Yee-Wen;
Jao, Chien-Chung

Publication type:

Article

Fifteen-Nanometer Ru Diffusion Barrier on NiSi/Si for a sub-45 nm Cu Contact Plug.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2251, doi. 10.1007/s11664-009-0899-8

By:

Lin, Jia-Huei;
Lee, Jiing-Herng;
Hsu, Chen-Sheng;
Fang, Jau-Shiung

Publication type:

Article

Performance Comparison of Top- and Bottom-emitting Long Wave Infrared Light Emitting Diode Devices.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2329, doi. 10.1007/s11664-009-0905-1

By:

Das, Naresh C.

Publication type:

Article

The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2275, doi. 10.1007/s11664-009-0854-8

By:

Schmetterer, C.;
Vizdal, J.;
Kroupa, A.;
Kodentsov, A.;
Ipser, H.

Publication type:

Article

Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2301, doi. 10.1007/s11664-009-0860-x

By:

Jung, Inyu;
Cho, Moon Gi;
Lee, Hyuck Mo

Publication type:

Article

Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2234, doi. 10.1007/s11664-009-0866-4

By:

Chang, C. C.;
Lin, Y. W.;
Lai, Y. S.;
Kao, C. R.

Publication type:

Article

Interfacial Reactions and Microstructures of Sn-0.7Cu- xZn Solders with Ni-P UBM During Thermal Aging.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2242, doi. 10.1007/s11664-009-0867-3

By:

Cho, Moon;
Kang, Sung K.;
Seo, Sun-Kyoung;
Shih, Da-Yuan;
Lee, Hyuck Mo

Publication type:

Article

Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2368, doi. 10.1007/s11664-009-0891-3

By:

Cheng, Yung-Chi;
Hsu, Chin-Hao;
Lan, Kuo-Hsing;
Muñoz, Jose C.;
Caparanga, Alvin R.;
Soriano, Allan N.;
Li, Meng-Hui

Publication type:

Article

Impact of Reaction Shrinkage on Stress in Semiconductor Packages.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2362, doi. 10.1007/s11664-009-0886-0

By:

Mengel, Manfred;
Mahler, Joachim

Publication type:

Article

Controlled Growth of Non-Uniform Arsenic Profiles in Silicon Reduced-Pressure Chemical Vapor Deposition Epitaxial Layers.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2323, doi. 10.1007/s11664-009-0897-x

By:

Popadić, M.;
Scholtes, T. L. M.;
De Boer, W.;
Sarubbi, F.;
Nanver, L. K.

Publication type:

Article

Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2415, doi. 10.1007/s11664-009-0893-1

By:

Mei, Yunhui;
Chen, Xu;
Gao, Hong

Publication type:

Article

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2405, doi. 10.1007/s11664-009-0888-y

By:

Garcia, Leonardo R.;
Osório, Wislei R.;
Peixoto, Leandro C.;
Garcia, Amauri

Publication type:

Article

Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2264, doi. 10.1007/s11664-009-0900-6

By:

Luo, Wei-Hsiang;
Tsai, Ting-Kan;
Yang, Jen-Chieh;
Hsieh, Wei-Ming;
Hsu, Chia-His;
Fang, Jau-Shiung

Publication type:

Article

Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2270, doi. 10.1007/s11664-009-0903-3

By:

Huang, Kuan-Chih;
Shieu, Fuh-Sheng;
Hsiao, Y. H.;
Liu, C. Y.

Publication type:

Article

Copper-Silver Alloy for Advanced Barrierless Metallization.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2212, doi. 10.1007/s11664-009-0904-2

By:

Lin, C. H.;
Leau, W. K.

Publication type:

Article

Analysis of Dislocation Density in Pb(1− x)Sn xSe Grown on ZnTe/Si by MBE.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2343, doi. 10.1007/s11664-009-0907-z

By:

Taylor, P. J.;
Dhar, N. K.;
Harris, E.;
Swaminathan, V.;
Chen, Y.;
Jesser, W. A.

Publication type:

Article

N Doping and Al-N Co-doping in Sol–Gel ZnO Films: Studies of Their Structural, Electrical, Optical, and Photoconductive Properties.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2335, doi. 10.1007/s11664-009-0908-y

By:

Dutta, M.;
Ghosh, T.;
Basak, D.

Publication type:

Article

Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2398, doi. 10.1007/s11664-009-0917-x

By:

Du, X. N.;
Guo, J. D.;
Shang, J. K.

Publication type:

Article

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2228, doi. 10.1007/s11664-009-0922-0

By:

Lim, Gi-Tae;
Kim, Byoung-Joon;
Lee, Kiwook;
Kim, Jaedong;
Joo, Young-Chang;
Park, Young-Bae

Publication type:

Article

Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2257, doi. 10.1007/s11664-009-0920-2

By:

Yen, Yee-Wen;
Tseng, H. W.;
Zeng, K.;
Wang, S. J.;
Liu, C. Y.

Publication type:

Article

Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2353, doi. 10.1007/s11664-009-0926-9

By:

Liu, Meng;
Xian, Ai-Ping

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2211, doi. 10.1007/s11664-009-0935-8

By:

Chen, Chih-ming;
Chada, Srinivas;
Chen, Sinn-wen;
Flandorfer, Hans;
Lindsay Greer, A.;
Lee, Jae-ho;
Zeng, Kejun;
Yen, Yee-wen;
Gierlotka, Wojciech;
Wang, Chao-hong

Publication type:

Article

In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2308, doi. 10.1007/s11664-009-0934-9

By:

Wu, Albert T.;
Tsai, Chun-Yang;
Kao, Chin-Li;
Shih, Meng-Kai;
Lai, Yi-Shao;
Lee, Hsin-Yi;
Ku, Ching-Shun

Publication type:

Article

Ohmic Contact to High-Aluminum-Content AlGaN Epilayers.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2348, doi. 10.1007/s11664-009-0924-y

By:

Srivastava, Surendra;
Hwang, Seong Mo;
Islam, Md.;
Balakrishnan, K.;
Adivarahan, Vinod;
Khan, Asif

Publication type:

Article

Primary Creep in Sn-3.8Ag-0.7Cu Solder, Part II: Constitutive Creep Model Development and Finite Element Analysis.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2388, doi. 10.1007/s11664-009-0906-0

By:

Shirley, D. R.;
Spelt, J. K.

Publication type:

Article

Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2376, doi. 10.1007/s11664-009-0901-5

By:

Shirley, D. R.;
Spelt, J. K.

Publication type:

Article

Investigation of the Interfaces in Ni-FUSI/Hf-Based/Si and Ni-FUSI/SiO2/Si Stacks by Physical and Electrical Characterization Techniques.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2314, doi. 10.1007/s11664-009-0955-4

By:

Tan, S. Y.

Publication type:

Article

Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 11

Interfacial Reactions of Sn-9Zn- xCu ( x = 1, 4, 7, 10) Solders with Ni Substrates.

Fifteen-Nanometer Ru Diffusion Barrier on NiSi/Si for a sub-45 nm Cu Contact Plug.

Performance Comparison of Top- and Bottom-emitting Long Wave Infrared Light Emitting Diode Devices.

The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections.

Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu<sub>5</sub>Zn<sub>8</sub>-Bearing Pb-Free Solders on a Copper Substrate.

Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates.

Interfacial Reactions and Microstructures of Sn-0.7Cu- xZn Solders with Ni-P UBM During Thermal Aging.

Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller.

Impact of Reaction Shrinkage on Stress in Semiconductor Packages.

Controlled Growth of Non-Uniform Arsenic Profiles in Silicon Reduced-Pressure Chemical Vapor Deposition Epitaxial Layers.

Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films.

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys.

Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition.

Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process.

Copper-Silver Alloy for Advanced Barrierless Metallization.

Analysis of Dislocation Density in Pb<sub>(1− x)</sub>Sn<sub> x</sub>Se Grown on ZnTe/Si by MBE.

N Doping and Al-N Co-doping in Sol–Gel ZnO Films: Studies of Their Structural, Electrical, Optical, and Photoconductive Properties.

Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints.

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps.

Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions.

Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition.

Foreword.

In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays.

Ohmic Contact to High-Aluminum-Content AlGaN Epilayers.

Primary Creep in Sn-3.8Ag-0.7Cu Solder, Part II: Constitutive Creep Model Development and Finite Element Analysis.

Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction.

Investigation of the Interfaces in Ni-FUSI/Hf-Based/Si and Ni-FUSI/SiO<sub>2</sub>/Si Stacks by Physical and Electrical Characterization Techniques.