Passivation of Interfacial States for GaAs- and InGaAs/InP-Based Regrown Nanostructures.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2023, doi. 10.1007/s11664-009-0887-z
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 10
Results: 20
1
2
Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2132, doi. 10.1007/s11664-009-0872-6
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- Article
3
On the Mechanisms Governing Aluminum-Mediated Solid-Phase Epitaxy of Silicon.
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- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2052, doi. 10.1007/s11664-009-0877-1
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- Article
4
Abnormal Failure Behavior of Sn-3.5Ag Solder Bumps Under Excessive Electric Current Stressing Conditions.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2194, doi. 10.1007/s11664-009-0855-7
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- Publication type:
- Article
5
Study of DC and AC Electromigration Behavior in Eutectic Pb-Sn Solder Joints.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2184, doi. 10.1007/s11664-009-0852-x
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- Publication type:
- Article
6
Thermal Stability of Ge<sub>2</sub>Sb<sub>2</sub>Te<sub>5</sub> in Contact with Ti and TiN.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2063, doi. 10.1007/s11664-009-0856-6
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- Publication type:
- Article
7
Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2106, doi. 10.1007/s11664-009-0861-9
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- Publication type:
- Article
8
Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2148, doi. 10.1007/s11664-009-0863-7
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- Publication type:
- Article
9
Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2170, doi. 10.1007/s11664-009-0868-2
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- Publication type:
- Article
10
Thermodynamic Assessment of the Au-Co-Sn Ternary System.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2158, doi. 10.1007/s11664-009-0874-4
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- Publication type:
- Article
11
A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2122, doi. 10.1007/s11664-009-0878-0
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- Publication type:
- Article
12
Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2179, doi. 10.1007/s11664-009-0858-4
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- Publication type:
- Article
13
In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2085, doi. 10.1007/s11664-009-0885-1
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- Publication type:
- Article
14
Effect of Colloidal Silver on Optical Transmittance Characteristics of Bulk Cadmium Zinc Telluride Crystals.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2046, doi. 10.1007/s11664-009-0865-5
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- Publication type:
- Article
15
Experimental Investigation and Thermodynamic Assessment of Phase Equilibria in the Ag-Au-Sn System.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2096, doi. 10.1007/s11664-009-0859-3
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- Publication type:
- Article
16
Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2112, doi. 10.1007/s11664-009-0884-2
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- Publication type:
- Article
17
Rheological Behavior of Thermal Interface Pastes.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2069, doi. 10.1007/s11664-009-0883-3
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- Publication type:
- Article
18
Thermodynamic Descriptions for the Cd-Te, Pb-Te, Cd-Pb and Cd-Pb-Te Systems.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2033, doi. 10.1007/s11664-009-0875-3
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- Publication type:
- Article
19
Water-Induced Degradation in (Bi<sub>1/2</sub>Na<sub>1/2</sub>)TiO<sub>3</sub> Lead-Free Ceramics.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2207, doi. 10.1007/s11664-009-0892-2
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- Publication type:
- Article
20
A Numerical Simulation of Nanostructure Formation Utilizing Electromigration.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2201, doi. 10.1007/s11664-009-0853-9
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- Publication type:
- Article