Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 1
Results: 26
Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 39, doi. 10.1007/s11664-008-0529-x
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- Article
Thermal Stability Study of Cu(MoN<sub> x </sub>) Seed Layer on Barrierless Si.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 100, doi. 10.1007/s11664-008-0523-3
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- Article
Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 78, doi. 10.1007/s11664-008-0565-6
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- Article
Phase Transitions in the BiVO<sub>4</sub>- nPbO ( n = 1, 2) System: Structural–Electrical Properties Relationships.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 113, doi. 10.1007/s11664-008-0588-z
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- Article
Simulation, Modeling, and Crystal Growth of Cd<sub>0.9</sub>Zn<sub>0.1</sub>Te for Nuclear Spectrometers.
- Published in:
- 2009
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- Publication type:
- Correction Notice
Ceramic Substrates for High-temperature Electronic Integration.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 164, doi. 10.1007/s11664-008-0571-8
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- Article
Foreword.
- Published in:
- 2009
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- Publication type:
- Editorial
Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 33, doi. 10.1007/s11664-008-0560-y
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- Publication type:
- Article
Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 61, doi. 10.1007/s11664-008-0554-9
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- Publication type:
- Article
Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al<sub> x </sub>Ga<sub>1− x </sub>N with High Aluminum Mole Fraction.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 153, doi. 10.1007/s11664-008-0553-x
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- Article
Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 193, doi. 10.1007/s11664-008-0564-7
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- Publication type:
- Article
Multiple-Scale Analysis of Charge Transport in Semiconductor Radiation Detectors: Application to Semi-Insulating CdZnTe.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 126, doi. 10.1007/s11664-008-0556-7
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- Publication type:
- Article
Factors That Govern the Performance of Thermal Interface Materials.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 175, doi. 10.1007/s11664-008-0563-8
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- Publication type:
- Article
A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 200, doi. 10.1007/s11664-008-0561-x
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- Publication type:
- Article
A Study on a Surface Preparation Method for Single-Crystal SiC Using an Fe Catalyst.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 159, doi. 10.1007/s11664-008-0583-4
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- Publication type:
- Article
Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 54, doi. 10.1007/s11664-008-0528-y
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- Publication type:
- Article
Reflectivity and Abnormal Absorption at ITO/Al Interface.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 108, doi. 10.1007/s11664-008-0578-1
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- Publication type:
- Article
Optical Characteristics of ZnTeO Thin Films Synthesized by Pulsed Laser Deposition and Molecular Beam Epitaxy.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 119, doi. 10.1007/s11664-008-0577-2
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- Publication type:
- Article
Suppressing Growth of the Cu<sub>5</sub>Zn<sub>8</sub> Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0
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- Publication type:
- Article
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 70, doi. 10.1007/s11664-008-0574-5
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- Publication type:
- Article
Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 93, doi. 10.1007/s11664-008-0575-4
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- Publication type:
- Article
Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 2, doi. 10.1007/s11664-008-0537-x
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- Publication type:
- Article
Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 25, doi. 10.1007/s11664-008-0541-1
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- Publication type:
- Article
Cu-Ni-Sn: A Key System for Lead-Free Soldering.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 10, doi. 10.1007/s11664-008-0522-4
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- Publication type:
- Article
Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 46, doi. 10.1007/s11664-008-0543-z
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- Publication type:
- Article
Fabrication of Mesa Shaped InGaN-Based Light-Emitting Diodes Through a Photoelectrochemical Process.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 145, doi. 10.1007/s11664-008-0581-6
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- Publication type:
- Article