Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 1

Results: 26

Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 39, doi. 10.1007/s11664-008-0529-x

By:

Kim, Dong;
Cho, Moon;
Seo, Sun-Kyoung;
Lee, Hyuck

Publication type:

Article

Thermal Stability Study of Cu(MoN x ) Seed Layer on Barrierless Si.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 100, doi. 10.1007/s11664-008-0523-3

By:

Chu, J.P.;
Lin, C.H.;
Leau, W.K.;
John, V.S.

Publication type:

Article

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 78, doi. 10.1007/s11664-008-0565-6

By:

Kumar, Aditya;
Yang, Ying;
Wong, Chee;
Kripesh, Vaidhyanathan;
Chen, Zhong

Publication type:

Article

Phase Transitions in the BiVO4- nPbO ( n = 1, 2) System: Structural–Electrical Properties Relationships.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 113, doi. 10.1007/s11664-008-0588-z

By:

Wignacourt, Jean-Pierre;
Drache, Michel;
Labidi, Olfa;
Roussel, Pascal

Publication type:

Article

Simulation, Modeling, and Crystal Growth of Cd0.9Zn0.1Te for Nuclear Spectrometers.

Published in:

2009

By:

Mandal, Krishna;
Kang, Sung;
Choi, Michael;
Bello, Job;
Zheng, Lili;
Zhang, Hui;
Groza, Michael;
Roy, Utpal;
Burger, Arnold;
Jellison, Gerald;
Holcomb, David;
Wright, Gomez;
Williams, Joseph

Publication type:

Correction Notice

Ceramic Substrates for High-temperature Electronic Integration.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 164, doi. 10.1007/s11664-008-0571-8

By:

Chasserio, N.;
Guillemet-Fritsch, S.;
Lebey, T.;
Dagdag, S.

Publication type:

Article

Foreword.

Published in:

2009

By:

Chen, Sinn-wen;
Chada, Srinivas;
Chen, Chih-ming;
Flandorfer, Hans;
Greer, A. Lindsay;
Lee, Jae-Ho;
Zeng, Kejun;
Suganuma, Katsuaki

Publication type:

Editorial

Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 33, doi. 10.1007/s11664-008-0560-y

By:

Terashima, S.;
Kohno, T.;
Mizusawa, A.;
Arai, K.;
Okada, O.;
Wakabayashi, T.;
Tanaka, M.;
Tatsumi, K.

Publication type:

Article

Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 61, doi. 10.1007/s11664-008-0554-9

By:

Chen, Chih-hao;
Lin, Chi-pu;
Chen, Chih-ming

Publication type:

Article

Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al x Ga1− x N with High Aluminum Mole Fraction.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 153, doi. 10.1007/s11664-008-0553-x

By:

Moore, E. A.;
Yeo, Y. K.;
Ryu, Mee-Yi;
Hengehold, R. L.

Publication type:

Article

Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 193, doi. 10.1007/s11664-008-0564-7

By:

Chen, Chih-ming;
Shih, Po-yuan;
Lin, Yi-wei

Publication type:

Article

Multiple-Scale Analysis of Charge Transport in Semiconductor Radiation Detectors: Application to Semi-Insulating CdZnTe.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 126, doi. 10.1007/s11664-008-0556-7

By:

Bale, Derek;
Szeles, Csaba

Publication type:

Article

Factors That Govern the Performance of Thermal Interface Materials.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 175, doi. 10.1007/s11664-008-0563-8

By:

Saeed Abadi, Parisa Pour Shahid;
Leong, Chia-Ken;
Chung, D.D.L.

Publication type:

Article

A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 200, doi. 10.1007/s11664-008-0561-x

By:

Yan, Li-ling;
Lee, Cheng-kuo;
Yu, Da-quan;
Yu, Ai-bin;
Choi, Won-Kyoung;
Lau, John-H;
Yoon, Seung-Uk

Publication type:

Article

A Study on a Surface Preparation Method for Single-Crystal SiC Using an Fe Catalyst.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 159, doi. 10.1007/s11664-008-0583-4

By:

Kubota, Akihisa;
Yagi, Keita;
Murata, Junji;
Yasui, Heiji;
Miyamoto, Shiro;
Hara, Hideyuki;
Sano, Yasuhisa;
Yamauchi, Kazuto

Publication type:

Article

Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 54, doi. 10.1007/s11664-008-0528-y

By:

Takaku, Yoshikazu;
Makino, Komei;
Watanabe, Keita;
Ohnuma, Ikuo;
Kainuma, Ryosuke;
Yamada, Yasushi;
Yagi, Yuji;
Nakagawa, Ikuo;
Atsumi, Takashi;
Ishida, Kiyohito

Publication type:

Article

Reflectivity and Abnormal Absorption at ITO/Al Interface.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 108, doi. 10.1007/s11664-008-0578-1

By:

Lin, Y.H.;
Liu, C.Y.

Publication type:

Article

Optical Characteristics of ZnTeO Thin Films Synthesized by Pulsed Laser Deposition and Molecular Beam Epitaxy.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 119, doi. 10.1007/s11664-008-0577-2

By:

Wang, W.;
Bowen, W.;
Spanninga, S.;
Lin, S.;
Phillips, J.

Publication type:

Article

Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0

By:

Lai, R.;
Lin, K.;
Salam, B.

Publication type:

Article

Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 70, doi. 10.1007/s11664-008-0574-5

By:

Ha, Sang-Su;
Kim, Jong-Woong;
Yoon, Jeong-Won;
Ha, Sang-Ok;
Jung, Seung-Boo

Publication type:

Article

Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 93, doi. 10.1007/s11664-008-0575-4

By:

Yen, Yee-Wen;
Liou, Wei-Kai;
Wei, Hong-Yao;
Lee, Chiapyng

Publication type:

Article

Fabrication of Mesa Shaped InGaN-Based Light-Emitting Diodes Through a Photoelectrochemical Process.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 145, doi. 10.1007/s11664-008-0581-6

By:

Yang, Chung-Chieh;
Lin, Chia-Feng;
Chiang, Jen-Hao;
Liu, Hsun-Chih;
Lin, Chun-Min;
Fan, Feng-Hsu;
Chang, Chung-Ying

Publication type:

Article

Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 2, doi. 10.1007/s11664-008-0537-x

By:

Ohnuma, I.;
Saegusa, T.;
Takaku, Y.;
Wang, C.P.;
Liu, X.J.;
Kainuma, R.;
Ishida, K.

Publication type:

Article

Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 25, doi. 10.1007/s11664-008-0541-1

By:

Yang, S. C.;
Chang, W. C.;
Wang, Y. W.;
Kao, C. R.

Publication type:

Article

Cu-Ni-Sn: A Key System for Lead-Free Soldering.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 10, doi. 10.1007/s11664-008-0522-4

By:

Schmetterer, C.;
Flandorfer, H.;
Luef, Ch.;
Kodentsov, A.;
Ipser, H.

Publication type:

Article

Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 46, doi. 10.1007/s11664-008-0543-z

By:

Noh, Bo-In;
Jung, Seung-Boo

Publication type:

Article

Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 1

Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM.

Thermal Stability Study of Cu(MoN<sub> x </sub>) Seed Layer on Barrierless Si.

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.

Phase Transitions in the BiVO<sub>4</sub>- nPbO ( n = 1, 2) System: Structural–Electrical Properties Relationships.

Simulation, Modeling, and Crystal Growth of Cd<sub>0.9</sub>Zn<sub>0.1</sub>Te for Nuclear Spectrometers.

Ceramic Substrates for High-temperature Electronic Integration.

Foreword.

Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character.

Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow.

Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al<sub> x </sub>Ga<sub>1− x </sub>N with High Aluminum Mole Fraction.

Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source.

Multiple-Scale Analysis of Charge Transport in Semiconductor Radiation Detectors: Application to Semi-Insulating CdZnTe.

Factors That Govern the Performance of Thermal Interface Materials.

A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu.

A Study on a Surface Preparation Method for Single-Crystal SiC Using an Fe Catalyst.

Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate.

Reflectivity and Abnormal Absorption at ITO/Al Interface.

Optical Characteristics of ZnTeO Thin Films Synthesized by Pulsed Laser Deposition and Molecular Beam Epitaxy.

Suppressing Growth of the Cu<sub>5</sub>Zn<sub>8</sub> Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.

Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density.

Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates.

Fabrication of Mesa Shaped InGaN-Based Light-Emitting Diodes Through a Photoelectrochemical Process.

Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap.

Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder.

Cu-Ni-Sn: A Key System for Lead-Free Soldering.

Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate.