Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 9
2
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1480, doi. 10.1007/s11664-008-0519-z
- JACOBS, R. N.;
- ALMEIDA, L. A.;
- MARKUNAS, J.;
- PELLEGRINO, J.;
- GROENERT, M.;
- JAIME-VASQUEZ, M.;
- MAHADIK, N.;
- ANDREWS, C.;
- QADRI, S. B.;
- LEE, T.;
- KIM, M.
- Article
3
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1488, doi. 10.1007/s11664-008-0518-0
- MALLICK, SHUBHRANGSHU;
- BANERJEE, KOUSHIK;
- VELICU, SILVIU;
- GREIN, CHRISTOPH;
- GHOSH, SIDDHARTHA;
- ZHAO, JUN
- Article
4
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1165, doi. 10.1007/s11664-008-0505-5
- Sivananthan, S.;
- Anter, Y.;
- Dhar, N. K.
- Article
5
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1471, doi. 10.1007/s11664-008-0494-4
- KIRAN, R.;
- SPORKEN, R.;
- CASSELMAN, T. N.;
- EMELIE, P. Y.;
- KODAMA, R.;
- CHANG, Y.;
- AQARIDEN, F.;
- VELICU, S.;
- ZHAO, J.;
- SIVANANTHAN, S.
- Article
6
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1231, doi. 10.1007/s11664-008-0469-5
- BENSON, J. D.;
- JACOBS, R. N.;
- MARKUNAS, J. K.;
- JAIME-VASQUEZ, M.;
- SMITH, P. J.;
- ALMEIDA, L. A.;
- MARTINKA, M.;
- VILELA, M. F.;
- LEE, U.
- Article
7
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1212, doi. 10.1007/s11664-008-0479-3
- BELAS, E.;
- BUGÁR, M.;
- GRILL, R.;
- FRANC, J.;
- MORAVEC, P.;
- HLÍDEK, P.;
- HÖSCHL, P.
- Article
8
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1205, doi. 10.1007/s11664-008-0478-4
- Article
9
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1171, doi. 10.1007/s11664-008-0477-5
- YONG CHANG;
- BECKER, C. R.;
- GREIN, C. H.;
- ZHAO, J.;
- FULK, C.;
- CASSELMAN, T.;
- KIRAN, R.;
- WANG, X. J.;
- ROBINSON, E.;
- AN, S. Y.;
- MALLICK, S.;
- SIVANANTHAN, S.;
- AOKI, T.;
- WANG, C. Z.;
- SMITH, D. J.;
- VELICU, S.;
- CROCCO, J.;
- CHEN, Y.;
- BRILL, G.;
- WIJEWARNASURIYA, P. S.
- Article
10
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1219, doi. 10.1007/s11664-008-0471-y
- ELHADIDY, HASSAN;
- FRANC, JAN;
- BELAS, EDUARD;
- HLÍDEK, PAVEL;
- MORAVEC, PAVEL;
- GRILL, ROMAN;
- HOSCHL, PAVEL
- Article
11
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1200, doi. 10.1007/s11664-008-0480-x
- WANG, X. J.;
- FULK, C.;
- ZHAO, F. H.;
- LI, D. H.;
- MUKHERJEE, S.;
- CHANG, Y.;
- SPORKEN, R.;
- KLIE, R.;
- SHI, Z.;
- GREIN, C. H.;
- SIVANANTHAN, S.
- Article
12
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1166, doi. 10.1007/s11664-008-0468-6
- BENSON, J. D.;
- MARTINKA, M.
- Article
13
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1255, doi. 10.1007/s11664-008-0456-x
- BOMMENA, R.;
- SELDRUM, T.;
- SAMAIN, L.;
- SPORKEN, R.;
- SIVANANTHAN, S.;
- BRUECK, S. R. J.
- Article
14
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1241, doi. 10.1007/s11664-008-0465-9
- YANG, J. R.;
- CAO, X. L.;
- WEI, Y. F.;
- HE, L.
- Article
15
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1247, doi. 10.1007/s11664-008-0460-1
- JAIME-VASQUEZ, M.;
- MARTINKA, M.;
- STOLTZ, A. J.;
- JACOBS, R. N.;
- BENSON, J. D.;
- ALMEIDA, L. A.;
- MARKUNAS, J. K.
- Article
16
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1261, doi. 10.1007/s11664-008-0459-7
- PERRAIS, GWLADYS;
- ROTHMAN, JOHAN;
- DESTEFANIS, GERARD;
- CHAMONAL, JEAN-PAUL
- Article
17
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1237, doi. 10.1007/s11664-008-0457-9
- ZHU, J.;
- CHEN, H.;
- SARAF, G.;
- DUAN, Z.;
- LU, Y.;
- HSU, S. T.
- Article
18
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1225, doi. 10.1007/s11664-008-0467-7
- STOLTZ, A. J.;
- BENSON, J. D.;
- SMITH, P. J.
- Article
19
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1283, doi. 10.1007/s11664-008-0455-y
- WIJEWARNASURIYA, PRIYALAL S.;
- EMELIE, P. Y.;
- D'SOUZA, ARVIND;
- BRILL, GREGORY;
- STAPELBROEK, MARYN G.;
- VELICU, SILVIU;
- YUANPING CHEN;
- GREIN, CHRIS;
- SIVANANTHAN, SIVALINGAM;
- DHAR, NIBIR K.
- Article
20
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1291, doi. 10.1007/s11664-008-0452-1
- HAILS, JANET E.;
- IRVINE, STUART J. C.;
- COLE-HAMILTON, DAVID J.;
- GIESS, JEAN;
- HOULTON, MICHAEL R.;
- GRAHAM, ANDREW
- Article
21
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1303, doi. 10.1007/s11664-008-0449-9
- ROTHMAN, JOHAN;
- PERRAIS, GWLADYS;
- BALLET, PHILIPPE;
- MOLLARD, L.;
- GOUT, S.;
- CHAMONAL, J.-P.
- Article
22
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1438, doi. 10.1007/s11664-008-0448-x
- HAWKINS, SAMANTHA A.;
- VILLA-ALEMAN, ELIEL;
- DUFF, MARTINE C.;
- HUNTER, DOUG B.;
- BURGER, ARNOLD;
- GROZA, MICHAEL;
- BULIGA, VLADIMIR;
- BLACK, DAVID R.
- Article
23
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1444, doi. 10.1007/s11664-008-0447-y
- SELVIG, E.;
- TONHEIM, C. R.;
- LORENTZEN, T.;
- KONGSHAUG, K. O.;
- SKAULI, T.;
- HAAKENAASEN, R.
- Article
24
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1465, doi. 10.1007/s11664-008-0443-2
- VILELA, M. F.;
- LOFGREEN, D. D.;
- SMITH, E. P. G.;
- NEWTON, M. D.;
- VENZOR, G. M.;
- PETERSON, J. M.;
- FRANKLIN, J. J.;
- REDDY, M.;
- THAI, Y.;
- PATTEN, E. A.;
- JOHNSON, S. M.;
- TIDROW, M. Z.
- Article
25
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1460, doi. 10.1007/s11664-008-0442-3
- MULLINS, J. T.;
- CANTWELL, B. J.;
- BASU, A.;
- JIANG, Q.;
- CHOUBEY, A.;
- BRINKMAN, A. W.;
- TANNER, B. K.
- Article
26
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1189, doi. 10.1007/s11664-008-0441-4
- LI HE;
- XIANGLIANG FU;
- QINGZHU WEI;
- WEIQIANG WANG;
- LU CHEN;
- YAN WU;
- XIAONING HU;
- JIANRONG YANG;
- QINYAO ZHANG;
- RUIJUN DING;
- XIAOSHUANG CHEN;
- WEI LU
- Article
27
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1329, doi. 10.1007/s11664-008-0440-5
- CHANDRA, D.;
- SCHAAKE, H. F.;
- KINCH, M. A.
- Article
28
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1453, doi. 10.1007/s11664-008-0439-y
- Article
29
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1349, doi. 10.1007/s11664-008-0438-z
- D'ORSOGNA, DANILO;
- TOBIN, STEPHEN P.;
- BELLOTTI, ENRICO
- Article
30
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1344, doi. 10.1007/s11664-008-0437-0
- CHAN, S. K.;
- LOK, S. K.;
- WANG, G.;
- CAI, Y.;
- WANG, N.;
- SOU, I. K.
- Article
31
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1324, doi. 10.1007/s11664-008-0436-1
- LENNON, C.;
- KODAMA, R.;
- CHANG, Y.;
- SIVANANTHAN, S.;
- DESHPANDE, M.
- Article
32
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1184, doi. 10.1007/s11664-008-0434-3
- CARMODY, M.;
- PASKO, J. G.;
- EDWALL, D.;
- PIQUETTE, E.;
- KANGAS, M.;
- FREEMAN, S.;
- ARIAS, J.;
- JACOBS, R.;
- MASON, W.;
- STOLTZ, A.;
- CHEN, Y.;
- DHAR, N. K.
- Article
33
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1334, doi. 10.1007/s11664-008-0433-4
- BECK, JEFF;
- WOODALL, MILTON;
- SCRITCHFIELD, RICHARD;
- OHLSON, MARTHA;
- WOOD, LEWIS;
- MITRA, PRADIP;
- ROBINSON, JIM
- Article
34
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1318, doi. 10.1007/s11664-008-0432-5
- D'SOUZA, A. I.;
- STAPELBROEK, M. G.;
- ROBINSON, E. W.;
- YONEYAMA, C.;
- MILLS, H. A.;
- KINCH, M. A.;
- SKOKAN, M. R.;
- SHIH, H. D.
- Article
35
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1356, doi. 10.1007/s11664-008-0431-6
- HOSSAIN, A.;
- BOLOTNIKOV, A. E.;
- CAMARDA, G. S.;
- CUI, Y.;
- BABALOLA, S.;
- BURGER, A.;
- JAMES, R. B.
- Article
36
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1391, doi. 10.1007/s11664-008-0430-7
- YOKOTA, M.;
- YASUDA, K.;
- NIRAULA, M.;
- NAKAMURA, K.;
- OHASHI, H.;
- TANAKA, R.;
- OMURA, M.;
- MINOURA, S.;
- SHINGU, I.;
- AGATA, Y.
- Article
37
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1497, doi. 10.1007/s11664-008-0429-0
- ZOGG, H.;
- ARNOLD, M.;
- FELDER, F.;
- RAHIM, M.;
- EBNETER, C.;
- ZASAVITSKIY, I.;
- QUACK, N.;
- BLUNIER, S.;
- DUAL, J.
- Article
38
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1274, doi. 10.1007/s11664-008-0428-1
- REDDY, M.;
- PETERSON, J. M.;
- LOFGREEN, D. D.;
- FRANKLIN, J. A.;
- VANG, T.;
- SMITH, E. P. G.;
- WEHNER, J. G. A.;
- KASAI, I.;
- BANGS, J. W.;
- JOHNSON, S. M.
- Article
39
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1362, doi. 10.1007/s11664-008-0427-2
- EMELIE, P. Y.;
- VELICU, S.;
- GREIN, C. H.;
- PHILLIPS, J. D.;
- WIJEWARNASURIYA, P. S.;
- DHAR, N. K.
- Article
40
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1406, doi. 10.1007/s11664-008-0426-3
- TENNANT, W. E.;
- LEE, DONALD;
- ZANDIAN, MAJID;
- PIQUETTE, ERIC;
- CARMODY, MICHAEL
- Article
41
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1387, doi. 10.1007/s11664-008-0425-4
- SCHAAKE, H. F.;
- KINCH, M. A.;
- AQARIDEN, F.
- Article
42
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1369, doi. 10.1007/s11664-008-0424-5
- BADANO, GIACOMO;
- BAUDRY, XAVIER;
- BALLET, PHILIPPE;
- DUVAUT, PHILIPPE;
- MILLION, ALAIN;
- MICOUD, ERIC;
- KAISMOUNE, SABEUR;
- FOUGÈRES, PAUL;
- MIBORD, SOPHIE;
- TRAN-VAN, PIERRE;
- ETCHEBERRY, ARNAUD
- Article
43
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1401, doi. 10.1007/s11664-008-0423-6
- SCHAAKE, H. F.;
- KINCH, M. A.;
- CHANDRA, D.;
- AQARIDEN, F.;
- LIAO, P. K.;
- WEIRAUCH, D. F.;
- WAN, C.-F.;
- SCRITCHFIELD, R. E.;
- SULLIVAN, W. W.;
- TEHERANI, J. T.;
- SHIH, H. D.
- Article
44
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1396, doi. 10.1007/s11664-008-0421-8
- PIQUETTE, E. C.;
- EDWALL, D. D.;
- ARNOLD, H.;
- CHEN, A.;
- AUYEUNG, J.
- Article
45
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1376, doi. 10.1007/s11664-008-0420-9
- REINE, M. B.;
- MARCINIEC, J. W.;
- WONG, K. K.;
- PARODOS, T.;
- MULLARKEY, J. D.;
- LAMARRE, P. A.;
- TOBIN, S. P.;
- MINICH, R. W.;
- GUSTAVSEN, K. A.;
- COMPTON, M.;
- WILLIAMS, G. M.
- Article
46
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1420, doi. 10.1007/s11664-008-0419-2
- DE LYON, T. J.;
- RAJAVEL, R. D.;
- HUNTER, A. T.;
- JENSEN, J. E.;
- JACK, M. D.;
- BAILEY, S. L.;
- KVAAS, R. E.;
- RANDALL, V. K.;
- JOHNSON, S. M.
- Article
47
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1411, doi. 10.1007/s11664-008-0418-3
- ELIZONDO, S. L.;
- ZHAO, F.;
- KAR, J.;
- MA, J.;
- SMART, J.;
- LI, D.;
- MUKHERJEE, S.;
- SHI, Z.
- Article
48
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1415, doi. 10.1007/s11664-008-0417-4
- GREIN, C. H.;
- FLATTÉ, M. E.;
- YONG CHANG
- Article
49
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1426, doi. 10.1007/s11664-008-0416-5
- PEARTON, S. J.;
- LIM, W. T.;
- WRIGHT, J. S.;
- TIEN, L. C.;
- KIM, H. S.;
- NORTON, D. P.;
- WANG, H. T.;
- KANG, B. S.;
- REN, F.;
- JUN, J.;
- LIN, J.;
- OSINSKY, A.
- Article
50
- Journal of Electronic Materials, 2008, v. 37, n. 9, p. 1504, doi. 10.1007/s11664-008-0415-6
- VELICU, S.;
- GREIN, C. H.;
- ZHAO, J.;
- CHANG, Y.;
- AN, S.-Y.;
- YADAV, A.;
- PIPE, K.;
- CLARK, W.
- Article