Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 8

Results: 19

Characterization of Mg-Doped AlInN Annealed in Nitrogen and Oxygen Ambients.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1070, doi. 10.1007/s11664-008-0496-2

By:

CHENG, A. T.;
SU, Y. K.;
LAI, W. C.;
CHEN, Y. Z.;
KUO, S. Y.

Publication type:

Article

Cleaved Mirrors for Nitride Semiconductor Lasers.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1064, doi. 10.1007/s11664-008-0493-5

By:

WEI-LI CHEN;
YI-CHENG CHANG

Publication type:

Article

Optical Properties of Nanocrystalline GaN Films Prepared by Annealing Amorphous GaN in Ammonia.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1049, doi. 10.1007/s11664-008-0492-6

By:

ZHANG, Z. X.;
PAN, X. J.;
WANG, T.;
JIA, L.;
LIU, L. X.;
WANG, W. B.;
XIE, E. Q.

Publication type:

Article

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na<sub>2</sub>SO<sub>4</sub> Solutions.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1111, doi. 10.1007/s11664-008-0491-7

By:

JA-YOUNG JUNG;
SHIN-BOK LEE;
HO-YOUNG LEE;
YOUNG-CHANG JOO;
YOUNG-BAE PARK

Publication type:

Article

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1119, doi. 10.1007/s11664-008-0490-8

By:

ZOU, H. F.;
ZHANG, Z. F.

Publication type:

Article

Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag.

Published in:

2008

By:

JUNG-MO KIM;
JAE-PIL JUNG;
ZHOU, Y. NORMAN;
JONG-HYEONG KIM

Publication type:

Correction Notice

Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1095, doi. 10.1007/s11664-008-0487-3

By:

ZHANG, W.;
RUYTHOOREN, W.

Publication type:

Article

Combined Use of Magnetic and Electrically Conductive Fillers in a Polymer Matrix for Electromagnetic Interference Shielding.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1088, doi. 10.1007/s11664-008-0486-4

By:

JUNHUA WU;
CHUNG, D. D. L.

Publication type:

Article

Polarity Analysis of Self-Seeded Aluminum Nitride Crystals Grown by Sublimation.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1058, doi. 10.1007/s11664-008-0485-5

By:

QIFENG HAN;
CHENGHONG DUAN;
CHANGJIAN JI;
KAI QIU;
FEI ZHONG;
XINHUA LI;
ZHIJUN YIN;
XIANCUN CAO;
XIUJU ZHOU;
YUQI WANG

Publication type:

Article

Electrical Characteristics and Photoresponse of ZnO/ZnTe Heterojunction Diodes.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1044, doi. 10.1007/s11664-008-0484-6

By:

WANG, W.;
LIN, A.;
PHILLIPS, J. D.

Publication type:

Article

Growth of GaN Nanowires on Epitaxial GaN.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1076, doi. 10.1007/s11664-008-0483-7

By:

AURONGZEB, D.;
SONG, D. Y.;
KIPSHIDZE, G.;
YAVICH, B.;
NYAKITI, L.;
LEE, R.;
CHAUDHURI, J.;
TEMKIN, H.;
HOLTZ, M.

Publication type:

Article

Characterization of Self-Formed Ti-Rich Interface Layers in Cu(Ti)/Low-k Samples.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1148, doi. 10.1007/s11664-008-0482-8

By:

KOHAMA, KAZUYUKI;
ITO, KAZUHIRO;
TSUKIMOTO, SUSUMU;
MORI, KENICHI;
MAEKAWA, KAZUYOSHI;
MURAKAMI, MASANORI

Publication type:

Article

Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1139, doi. 10.1007/s11664-008-0481-9

By:

SEUNGBAE PARK;
DHAKAL, RAMJI;
JIA GAO

Publication type:

Article

Overshoot Graded Layers for Mismatched Heteroepitaxial Devices.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1035, doi. 10.1007/s11664-008-0476-6

By:

OCAMPO, J. F.;
SUAREZ, E.;
JAIN, F. C.;
AYERS, J. E.

Publication type:

Article

MOCVD Growth of InN on Si(111) with Various Buffer Layers.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1054, doi. 10.1007/s11664-008-0475-7

By:

HUANG, C. C.;
CHUANG, R. W.;
CHANG, S. J.;
LIN, J. C.;
CHENG, Y. C.;
LIN, W. J.

Publication type:

Article

Field-Emission Performance of Wormhole-Like Mesoporous Tungsten Oxide Nanowires.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1082, doi. 10.1007/s11664-008-0474-8

By:

WEI HAO LAI;
MIN HSIUNG HON;
LAY GAIK TEOH;
YEN HSUN SU;
JIANN SHIEH;
CHU KUN CHEN

Publication type:

Article

Evaluation of Mn Uniformity in CdMnTe Crystal Grown by the Vertical Bridgman Method.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1158, doi. 10.1007/s11664-008-0473-9

By:

JIJUN ZHANG;
WANQI JIE;
LIJUN LUAN;
TAO WANG;
DONGMEI ZENG

Publication type:

Article

Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1130, doi. 10.1007/s11664-008-0466-8

By:

CHOUBEY, ANUPAM;
HAO YU;
OSTERMAN, MICHAEL;
PECHT, MICHAEL;
FU YUN;
LI YONGHONG;
XU MING

Publication type:

Article

Study on the Effects of Copper Oxide Growth on the Peel Strength of Copper/Polyimide.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 8, p. 1102, doi. 10.1007/s11664-007-0317-z

By:

LEE, H. J.;
JIN YU

Publication type:

Article