Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 7
Results: 14
Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 982, doi. 10.1007/s11664-008-0458-8
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- Publication type:
- Article
Phase Equilibria of the Sn-Sb Binary System.
- Published in:
- 2008
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- Publication type:
- Book Chapter
Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 962, doi. 10.1007/s11664-008-0463-y
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- Article
Granular Films for Use as Thin-Film Resistors.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 1020, doi. 10.1007/s11664-008-0462-z
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- Publication type:
- Article
Interface-Charge-Coupled Polarization Response of Pt-BaTiO<sub>3</sub>-ZnO-Pt Heterojunctions: A Physical Model Approach.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 1029, doi. 10.1007/s11664-008-0461-0
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- Publication type:
- Article
The Effects of Heat Treatment on the Crystallinity and Luminescence Properties of YInGe<sub>2</sub>O<sub>7</sub> Doped with Eu<sup>3+</sup> Ions.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 1024, doi. 10.1007/s11664-008-0470-z
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- Publication type:
- Article
Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 975, doi. 10.1007/s11664-008-0454-z
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- Publication type:
- Article
Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 1003, doi. 10.1007/s11664-008-0397-4
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- Publication type:
- Article
Electrically Conductive Metal Polymer Nanocomposites for Electronics Applications.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 951, doi. 10.1007/s11664-008-0451-2
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- Publication type:
- Article
Properties and Microstructures of Low-Temperature- Processable Ultralow-Dielectric Porous Polyimide Films.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 955, doi. 10.1007/s11664-008-0446-z
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- Publication type:
- Article
Effect of Strain Rate and Temperature on the Tensile Properties of Tin-Based Lead-Free Solder Alloys.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 1012, doi. 10.1007/s11664-008-0445-0
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- Publication type:
- Article
Fabrication of Thick Germanium-on-Insulator (GeOI) Substrates.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 944, doi. 10.1007/s11664-008-0413-8
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- Publication type:
- Article
Determination of the Elastic Properties of Au<sub>5</sub>Sn and AuSn from Ab Initio Calculations.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 968, doi. 10.1007/s11664-008-0453-0
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- Publication type:
- Article
InGaAs/AlGaAs Quantum Dot Nanostructures for 980 nm Operation.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 937, doi. 10.1007/s11664-008-0383-x
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- Publication type:
- Article