Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 6
Results: 21
Diffusion-Reaction in the Au-Rich Ternary Au-Pt-Sn System as a Basis for Ternary Diffusion Soldering.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 815, doi. 10.1007/s11664-008-0407-6
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- Article
Structural and Chemical Comparison of Graphite and BN/AlN Caps Used for Annealing Ion Implanted SiC.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 917, doi. 10.1007/s11664-008-0405-8
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- Publication type:
- Article
a-Si:C:H and a-Si:N:H Thin Films Obtained by PECVD for Applications in Silicon Solar Cells.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 905, doi. 10.1007/s11664-008-0422-7
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- Article
Preparation and Characterization of Polyimide/Zirconia Composite Films.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 925, doi. 10.1007/s11664-008-0410-y
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- Publication type:
- Article
Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 777, doi. 10.1007/s11664-008-0409-4
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- Publication type:
- Article
Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 806, doi. 10.1007/s11664-008-0408-5
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- Publication type:
- Article
Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 894, doi. 10.1007/s11664-008-0412-9
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- Publication type:
- Article
Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi<sub>x</sub> Metallizations.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 792, doi. 10.1007/s11664-008-0411-x
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- Publication type:
- Article
Electrical Conductivity, Thermoelectric Power, and Optical Properties of Organo-Soluble Polyaniline Organic Semiconductor.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 930, doi. 10.1007/s11664-008-0404-9
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- Publication type:
- Article
Stress--Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 829, doi. 10.1007/s11664-008-0403-x
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- Publication type:
- Article
Electromigration of Sn-9wt.%Zn Solder.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 887, doi. 10.1007/s11664-008-0402-y
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- Publication type:
- Article
Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 837, doi. 10.1007/s11664-008-0401-z
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- Publication type:
- Article
Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 880, doi. 10.1007/s11664-008-0400-0
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- Publication type:
- Article
Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis.
- Published in:
- 2008
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- Publication type:
- Letter
Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 860, doi. 10.1007/s11664-008-0399-2
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- Publication type:
- Article
The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 867, doi. 10.1007/s11664-008-0396-5
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- Publication type:
- Article
Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 852, doi. 10.1007/s11664-008-0394-7
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- Publication type:
- Article
Magneto-transport Properties of a GaMnAs-Based Ferromagnetic Semiconductor Trilayer Structure Grown on a ZnMnSe Buffer.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 912, doi. 10.1007/s11664-008-0391-x
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- Publication type:
- Article
Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6
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- Publication type:
- Article
Novel Cu/Cr/Ge/Pd Ohmic Contacts on Highly Doped n-GaAs.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 901, doi. 10.1007/s11664-008-0398-3
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- Publication type:
- Article
Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 574, doi. 10.1007/s11664-007-0366-3
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- Publication type:
- Article