Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 6

Results: 21

a-Si:C:H and a-Si:N:H Thin Films Obtained by PECVD for Applications in Silicon Solar Cells.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 905, doi. 10.1007/s11664-008-0422-7

By:

Stapinski, T.;
Swatowska, B.

Publication type:

Article

Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 894, doi. 10.1007/s11664-008-0412-9

By:

Min-Na Chen;
Shi-Jin ding;
Qing-Qing Sun;
Zhang, David Wei;
Li-Kang Wang

Publication type:

Article

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi<sub>x</sub> Metallizations.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 792, doi. 10.1007/s11664-008-0411-x

By:

Vuorinen, V.;
Yu, H.;
Laurila, T.;
Kivilahti, J. K.

Publication type:

Article

Preparation and Characterization of Polyimide/Zirconia Composite Films.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 925, doi. 10.1007/s11664-008-0410-y

By:

Sea-Fue Wang;
Yuh-Ruey Wang;
Kuo-Chung Cheng;
Jyh-Herng Chen;
Yu-Ping hsaio

Publication type:

Article

Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 777, doi. 10.1007/s11664-008-0409-4

By:

Park, T. -S.;
Dao, M.;
Suresh, S.;
Rosakis, A. J.;
Pantuso, D.;
Shankar, S.

Publication type:

Article

Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 806, doi. 10.1007/s11664-008-0408-5

By:

Kumamoto, Seishi;
Sakural, Hitoshi;
Kukimoto, Youichi;
Suganuma, Katsuaki

Publication type:

Article

Diffusion-Reaction in the Au-Rich Ternary Au-Pt-Sn System as a Basis for Ternary Diffusion Soldering.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 815, doi. 10.1007/s11664-008-0407-6

By:

Grolier, Vincent;
Schmid-Fetzer, Rainer

Publication type:

Article

Structural and Chemical Comparison of Graphite and BN/AlN Caps Used for Annealing Ion Implanted SiC.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 917, doi. 10.1007/s11664-008-0405-8

By:

Jones, K. A.;
Wood, M. C.;
Zheleva, T. S.;
Kirchner, K. W.;
Derenge, M. A.;
Bolonokov, A.;
Sudarshan, T. S.;
Vispute, R. D.;
Hullavarad, S. S.;
Dhar, S.

Publication type:

Article

Electrical Conductivity, Thermoelectric Power, and Optical Properties of Organo-Soluble Polyaniline Organic Semiconductor.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 930, doi. 10.1007/s11664-008-0404-9

By:

Yakuphanoglu, Fahrettin;
Şenkal, Bahıre Fılᐱz;;
Saraç, Ayfer

Publication type:

Article

Stress--Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 829, doi. 10.1007/s11664-008-0403-x

By:

Wong, E. H.;
Selvanayaham, C. s.;
Seah, S. K. W.;
Van Driel, W. D.;
Caers, J. F. J. M.;
Zhao, X. J.;
Owens, N.;
Tan, L. C.;
Frear, D. R.;
Leoni, M.;
Lai, Y. -S.;
Yeh, C. -L.

Publication type:

Article

Electromigration of Sn-9wt.%Zn Solder.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 887, doi. 10.1007/s11664-008-0402-y

By:

Yu-Min Hung;
Chih-Ming Chen

Publication type:

Article

Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 837, doi. 10.1007/s11664-008-0401-z

By:

Tang, Wenming;
He, Anqiang;
Liu, Qi;
Ivey, Douglas G.

Publication type:

Article

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 880, doi. 10.1007/s11664-008-0400-0

By:

Xu, Luhua;
Pang, John H. L.;
Che, Faxing

Publication type:

Article

Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 860, doi. 10.1007/s11664-008-0399-2

By:

Babaghorbani, P.;
Gupta, M.

Publication type:

Article

Novel Cu/Cr/Ge/Pd Ohmic Contacts on Highly Doped n-GaAs.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 901, doi. 10.1007/s11664-008-0398-3

By:

Kartika Chandra Sahoo;
Chun-Wei Chang;
Yuen-Yee Wong;
Tung-Ling Hsieh;
Chang, Edward Yi;
Ching-Ting Lee

Publication type:

Article

The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 867, doi. 10.1007/s11664-008-0396-5

By:

Hwa-Teng Lee;
Shuen-Yuan Hu;
Ting-Fu Hong;
Yin-Fa Chen

Publication type:

Article

Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 852, doi. 10.1007/s11664-008-0394-7

By:

Hsu, C. S.;
Hsieh, H. Y.;
Fang, J. S.

Publication type:

Article

Magneto-transport Properties of a GaMnAs-Based Ferromagnetic Semiconductor Trilayer Structure Grown on a ZnMnSe Buffer.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 912, doi. 10.1007/s11664-008-0391-x

By:

Chung, S. J.;
Shin, D. Y.;
Kim, Hyungchan;
Lee, Sanghoon;
Liu, X.;
Furdyna, J. K.

Publication type:

Article

Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6

By:

Shih, T. I.;
Duh, J. G.

Publication type:

Article

Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis.

Published in:

2008

By:

Yi-Shao Lai;
Chin-Li Kao

Publication type:

Letter

Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 574, doi. 10.1007/s11664-007-0366-3

By:

Ping Liu;
Pei Yao;
Jim Liu

Publication type:

Article