Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 5
1
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 730, doi. 10.1007/s11664-008-0406-7
- Liu, Kendrick X.;
- Stahlbush, Robert E.;
- Kok-Keong Lew;
- Myers-Ward, Rachael L.;
- Vanmil, Brenda L.;
- Gaskill, Kurt D.;
- Eddy, Charles R.
- Article
2
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 641, doi. 10.1007/s11664-008-0392-9
- Zhu, M.;
- Xia, Y.;
- Zhao, W.;
- Li, Y.;
- Senawiratne, J.;
- Detchprohm, T.;
- Wetzel, C.
- Article
3
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 635, doi. 10.1007/s11664-008-0390-y
- Hui-Chan Seo;
- Seung Jae Hong;
- Chapman, Patrick;
- Kyekyoon (Kevin) Kim
- Article
4
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 545, doi. 10.1007/s11664-008-0388-5
- Phillips, Jamie;
- Stahlbush, Robert;
- Xing, Grace
- Article
5
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 628, doi. 10.1007/s11664-008-0386-7
- Takizawa, Toshiyuki;
- Nakazawa, Satoshi;
- Ueda, Tetsuzo
- Article
6
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 611, doi. 10.1007/s11664-008-0385-8
- Hofmann, T.;
- Darakchieva, V.;
- Monemar, B.;
- Lu, H.;
- Schaff, W. J.;
- Schubert, M.
- Article
7
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 624, doi. 10.1007/s11664-008-0384-9
- Chung-Yu Lu;
- Yi Chang, Edward;
- Jui-Chien Huang;
- Chia-Ta Chang;
- Mei-Hsuan Lin;
- Ching-Tung Lee
- Article
8
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 616, doi. 10.1007/s11664-008-0382-y
- Pietzka, C.;
- Denisenko, A.;
- Alomari, M.;
- Medjdoub, F.;
- Carlin, J.-F.;
- Feltin, E.;
- Grandjean, N.;
- Kohn, E.
- Article
9
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 603, doi. 10.1007/s11664-007-0373-4
- Akagi, T.;
- Kosaka, K.;
- Harui, S.;
- Muto, D.;
- Naoi, H.;
- Araki, T.;
- Nanishi, Y.
- Article
10
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 726, doi. 10.1007/s11664-007-0371-6
- Xuan, G.;
- Lv, P.-C.;
- Zhang, X.;
- Kolodzey, J.;
- Desalvo, G.;
- Powell, A.
- Article
11
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 607, doi. 10.1007/s11664-007-0370-7
- Senawiratne, J.;
- Li, Y.;
- Zhu, M.;
- Xia, Y.;
- Zhao, W.;
- Detchprohm, T.;
- Chatterjee, A.;
- Plawsky, J. L.;
- Wetzel, C.
- Article
12
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 770, doi. 10.1007/s11664-007-0365-4
- Ajimsha, R. S.;
- Jayaraj, M. K.;
- Kukreja, L. M.
- Article
13
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 597, doi. 10.1007/s11664-007-0363-6
- Hwang, E. S.;
- Che, S. B.;
- Saito, H.;
- Wang, X.;
- Ishitani, Y.;
- Yoshikawa, A.
- Article
14
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 755, doi. 10.1007/s11664-007-0362-7
- Jie Sun;
- Mourey, Devin A.;
- Dalong Zhao;
- Jackson, Thomas N.
- Article
15
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 764, doi. 10.1007/s11664-007-0357-4
- Tingfang Yen;
- Strome, Dave;
- Sung Jin Kim;
- Cartwright, Alexander N.;
- Anderson, Wayne A.
- Article
16
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 558, doi. 10.1007/s11664-007-0355-6
- Liu, J. P.;
- Limb, J. B.;
- Ryou, J.-H.;
- Lee, W.;
- Yoo, D.;
- Horne, C. A.;
- Dupuis, R. D.
- Article
17
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 585, doi. 10.1007/s11664-007-0353-8
- Cai, Z.;
- Garzon, S.;
- Chandrashekhar, M. V. S.;
- Webb, R. A.;
- Koley, G.
- Article
18
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 736, doi. 10.1007/s11664-007-0350-y
- Park, J. S.;
- Chang, J. H.;
- Minegishi, T.;
- Lee, H. J.;
- Park, S. H.;
- Im, I. H.;
- Hanada, T.;
- Hong, S. K.;
- Cho, M. W.;
- Yao, T.
- Article
19
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 721, doi. 10.1007/s11664-007-0347-6
- Jikuan Cheng;
- Jiqiang Gao;
- Junlin Liu;
- Jianfeng Yang;
- Xian Jiang;
- Rui Guo
- Article
20
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 593, doi. 10.1007/s11664-007-0345-8
- Fehlberg, Tamara B.;
- Gallinat, Chad S.;
- Umana-Membreno, Gilberto A.;
- Koblmüller, Gregor;
- Nener, Brett D.;
- Speck, James S.;
- Parish, Giacinta
- Article
21
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 554, doi. 10.1007/s11664-007-0336-9
- Kocan, M.;
- Umana-Membreno, G. A.;
- Kilburn, M. R.;
- Fletcher, I. R.;
- Recht, F.;
- McCarthy, L.;
- Mishra, U. K.;
- Nener, B. D.;
- Parish, G.
- Article
22
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 546, doi. 10.1007/s11664-007-0332-0
- Chen, Z.;
- Fichtenbaum, N.;
- Brown, D.;
- Keller, S.;
- Mishra, U. K.;
- Denbaars, S. P.;
- Nakamura, S.
- Article
23
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 662, doi. 10.1007/s11664-007-0331-1
- Jonas, Charlotte;
- Capell, Craig;
- Burk, Al;
- Qingchun Zhang;
- Callanan, Robert;
- Agarwal, Anant;
- Geil, Bruce;
- Scozzie, Charles
- Article
24
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 760, doi. 10.1007/s11664-007-0329-8
- Zhen Bi;
- Jingwen Zhang;
- Xuming Bian;
- Dong Wang;
- Xin'an Zhang;
- Weifeng Zhang;
- Xun Hou
- Article
25
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 706, doi. 10.1007/s11664-007-0328-9
- Yi Chen;
- Ning Zhang;
- Dudley, Michael;
- Caldwell, Joshua D.;
- Liu, Kendrick X.;
- Stahlbush, Robert E.;
- Xianrong Huang;
- Macrander, Albert T.;
- Black, David R.
- Article
26
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 655, doi. 10.1007/s11664-007-0327-x
- Picard, Y. N.;
- Liu, K. X.;
- Stahlbush, R. E.;
- Twigg, M. E.
- Article
27
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 573, doi. 10.1007/s11664-007-0322-2
- Article
28
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 646, doi. 10.1007/s11664-007-0321-3
- Agarwal, Anant;
- Haney, Sarah
- Article
29
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 578, doi. 10.1007/s11664-007-0320-4
- Yuh-Renn Wu;
- Hinckley, John M.;
- Singh, Jasprit
- Article
30
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 713, doi. 10.1007/s11664-007-0314-2
- Yi Chen;
- Dudley, Michael;
- Sanchez, Edward K.;
- Macmillan, Michael F.
- Article
31
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 569, doi. 10.1007/s11664-007-0313-3
- Umana-Membreno, G. A.;
- Parish, G.;
- Fichtenbaum, N.;
- Keller, S.;
- Mishra, U. K.;
- Nener, B. D.
- Article
32
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 699, doi. 10.1007/s11664-007-0311-5
- Caldwell, Joshua D.;
- Glembocki, Orest J.;
- Stahlbush, Robert E.;
- Hobart, Karl D.
- Article
33
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 666, doi. 10.1007/s11664-007-0310-6
- Haney, Sarah;
- Agarwal, Anant
- Article
34
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 691, doi. 10.1007/s11664-007-0308-0
- Picard, Yoosuf N.;
- Twigg, Mark E.;
- Caldwell, Joshua D.;
- Eddy Jr., Charles R.;
- Neudeck, Philip G.;
- Trunek, Andrew J.;
- Powell, J. Anthony
- Article
35
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 685, doi. 10.1007/s11664-007-0306-2
- Vanmil, B. L.;
- Lew, K. K.;
- Myers-Ward, R. L.;
- Eddy Jr., C. R.;
- Gaskill, D. K.
- Article
36
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 564, doi. 10.1007/s11664-007-0300-8
- Miller, M. A.;
- Koo, B. H.;
- Bogart, K. H. A.;
- Mohney, S. E.
- Article
37
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 749, doi. 10.1007/s11664-007-0299-x
- Bowen, W. E.;
- Wang, W.;
- Cagin, E.;
- Phillips, J. D.
- Article
38
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 550, doi. 10.1007/s11664-007-0298-y
- Kang, B. S.;
- Wang, H. T.;
- Ren, F.;
- Hlad, M.;
- Gila, B. P.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Li, C.;
- Low, Z. N.;
- Lin, J.;
- Johnson, J. W.;
- Rajagopal, P.;
- Roberts, J. C.;
- Piner, E. L.;
- Linthicum, K. J.
- Article
39
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 672, doi. 10.1007/s11664-007-0297-z
- Speer, Kevin M.;
- Neudeck, Philip G.;
- Spry, David J.;
- Trunek, Andrew J.;
- Pirouz, Pirouz
- Article
40
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 743, doi. 10.1007/s11664-007-0295-1
- Yufeng Dong;
- Brillson, L. J.
- Article
41
- Journal of Electronic Materials, 2008, v. 37, n. 5, p. 681, doi. 10.1007/s11664-007-0294-2
- Kim, Byeung C.;
- Capano, Michael A.
- Article