Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 300, doi. 10.1007/s11664-007-0368-1
- By:
- Publication type:
- Article
Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 3
Results: 17
1
2
Effect of Bi on the Interfacial Reaction between Sn-3.7Ag-xBi Solders and Cu.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 288, doi. 10.1007/s11664-007-0367-2
- By:
- Publication type:
- Article
3
Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 279, doi. 10.1007/s11664-007-0361-8
- By:
- Publication type:
- Article
4
Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 307, doi. 10.1007/s11664-007-0359-2
- By:
- Publication type:
- Article
5
Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 339, doi. 10.1007/s11664-007-0356-5
- By:
- Publication type:
- Article
6
Stress-Induced Grain Boundary Migration in Polycrystalline Copper.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 249, doi. 10.1007/s11664-007-0354-7
- By:
- Publication type:
- Article
7
Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 264, doi. 10.1007/s11664-007-0352-9
- By:
- Publication type:
- Article
8
Space Charge and Carrier Trapping Effects on the Transient Photocurrents of Organic Materials Using the Time-of-Flight Technique.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 231, doi. 10.1007/s11664-007-0349-4
- By:
- Publication type:
- Article
9
Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 314, doi. 10.1007/s11664-007-0344-9
- By:
- Publication type:
- Article
10
Wet Etching Study of La<sub>0.67</sub> (Sr<sub>0.5</sub>Ca<sub>0.5</sub>)<sub>0.33</sub>MnO<sub>3</sub> Films on Silicon Substrates.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 361, doi. 10.1007/s11664-007-0343-x
- By:
- Publication type:
- Article
11
The Effect of Hydrogen on the Fracture Properties of 0.8(Na<sub>1/2</sub>Bi<sub>1/2</sub>)TiO<sub>3</sub>-0.2 (K<sub>1/2</sub>Bi<sub>1/2</sub>)TiO<sub>3</sub> Ferroelectric Ceramics.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 368, doi. 10.1007/s11664-007-0342-y
- By:
- Publication type:
- Article
12
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 325, doi. 10.1007/s11664-007-0341-z
- By:
- Publication type:
- Article
13
Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 347, doi. 10.1007/s11664-007-0340-0
- By:
- Publication type:
- Article
14
Silicidation of Ni(Yb) Film on Si(001).
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 245, doi. 10.1007/s11664-007-0339-6
- By:
- Publication type:
- Article
15
Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 240, doi. 10.1007/s11664-007-0337-8
- By:
- Publication type:
- Article
16
Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 331, doi. 10.1007/s11664-007-0335-x
- By:
- Publication type:
- Article
17
Epitaxial Growth and Surface Roughness Control of Ferromagnetic Thin Films on Si by Sputter Deposition.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 355, doi. 10.1007/s11664-007-0333-z
- By:
- Publication type:
- Article