Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 3
Results: 17
Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 300, doi. 10.1007/s11664-007-0368-1
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Effect of Bi on the Interfacial Reaction between Sn-3.7Ag-xBi Solders and Cu.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 288, doi. 10.1007/s11664-007-0367-2
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Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 279, doi. 10.1007/s11664-007-0361-8
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Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 307, doi. 10.1007/s11664-007-0359-2
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Wet Etching Study of La<sub>0.67</sub> (Sr<sub>0.5</sub>Ca<sub>0.5</sub>)<sub>0.33</sub>MnO<sub>3</sub> Films on Silicon Substrates.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 361, doi. 10.1007/s11664-007-0343-x
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- Article
Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 339, doi. 10.1007/s11664-007-0356-5
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Stress-Induced Grain Boundary Migration in Polycrystalline Copper.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 249, doi. 10.1007/s11664-007-0354-7
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Space Charge and Carrier Trapping Effects on the Transient Photocurrents of Organic Materials Using the Time-of-Flight Technique.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 231, doi. 10.1007/s11664-007-0349-4
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- Article
Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 314, doi. 10.1007/s11664-007-0344-9
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Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 264, doi. 10.1007/s11664-007-0352-9
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- Article
The Effect of Hydrogen on the Fracture Properties of 0.8(Na<sub>1/2</sub>Bi<sub>1/2</sub>)TiO<sub>3</sub>-0.2 (K<sub>1/2</sub>Bi<sub>1/2</sub>)TiO<sub>3</sub> Ferroelectric Ceramics.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 368, doi. 10.1007/s11664-007-0342-y
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- Article
Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 347, doi. 10.1007/s11664-007-0340-0
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- Article
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 325, doi. 10.1007/s11664-007-0341-z
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- Article
Silicidation of Ni(Yb) Film on Si(001).
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 245, doi. 10.1007/s11664-007-0339-6
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Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 240, doi. 10.1007/s11664-007-0337-8
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- Article
Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 331, doi. 10.1007/s11664-007-0335-x
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- Article
Epitaxial Growth and Surface Roughness Control of Ferromagnetic Thin Films on Si by Sputter Deposition.
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- Journal of Electronic Materials, 2008, v. 37, n. 3, p. 355, doi. 10.1007/s11664-007-0333-z
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- Article