Preparation and Characterization of CdTe for Solar Cells, Detectors, and Related Thin-Film Materials.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 145, doi. 10.1007/s11664-007-0338-7
- By:
- Publication type:
- Article
Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 2
Results: 15
1
2
Ir Diffusion Barriers in Ni/Au Ohmic Contacts to p-Type CuCrO<sub>2</sub>.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 161, doi. 10.1007/s11664-007-0334-y
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- Publication type:
- Article
3
Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 185, doi. 10.1007/s11664-007-0330-2
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- Publication type:
- Article
4
Fabrication and Properties of an Asymmetric Waveguide Containing Nanoparticles.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 135, doi. 10.1007/s11664-007-0324-0
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- Publication type:
- Article
5
Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 201, doi. 10.1007/s11664-007-0319-x
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- Publication type:
- Article
6
Electrical Switching in TlSbSe<sub>2</sub> Chalcogenide Semiconductors.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 157, doi. 10.1007/s11664-007-0318-y
- By:
- Publication type:
- Article
7
Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 189, doi. 10.1007/s11664-007-0316-0
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- Publication type:
- Article
8
Thermodynamic Assessments of the Ag-Ni Binary and Ag-Cu-Ni Ternary Systems.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 210, doi. 10.1007/s11664-007-0315-1
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- Publication type:
- Article
9
Density Functional Theory Modeling of (001)Si--Oxynitride Interfaces.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 172, doi. 10.1007/s11664-007-0312-4
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- Publication type:
- Article
10
Helium-Plasma-Prepared (111)A HgCdTe and (211)B InSb.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 152, doi. 10.1007/s11664-007-0309-z
- By:
- Publication type:
- Article
11
Synthesis of Silicon Nanoneedles.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 176, doi. 10.1007/s11664-007-0307-1
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- Publication type:
- Article
12
Investigation of Laser-Assisted Microcrystalline SiGe Films Deposited at Low Temperature.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 167, doi. 10.1007/s11664-007-0305-3
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- Publication type:
- Article
13
Improvement in Power Durability of Al Electrode Films Used in SAW Devices by Zr Additive and Ti Underlayer.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 180, doi. 10.1007/s11664-007-0291-5
- By:
- Publication type:
- Article
14
Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 224, doi. 10.1007/s11664-007-0290-6
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- Publication type:
- Article
15
Recent Observations on Tin Pest Formation in Solder Alloys.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 2, p. 218, doi. 10.1007/s11664-007-0165-x
- By:
- Publication type:
- Article