Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 12
1
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1786, doi. 10.1007/s11664-008-0435-2
- Gehong Zeng;
- Je-Hyeong Bahk;
- Bowers, John E.;
- Hong Lu;
- Zide, Joshua M. O.;
- Gossard, Arthur C.;
- Singh, Rajeev;
- Zhixi Bian;
- Shakouri, Ali;
- Singer, Suzanne L.;
- Kim, Woochul;
- Majumdar, Arun
- Article
2
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1780, doi. 10.1007/s11664-008-0444-1
- Canedy, C. L.;
- Bewley, W. W.;
- Lindle, J. R.;
- Nolde, J. A.;
- Larrabee, D. C.;
- Kim, C. S.;
- Kim, M.;
- Vurgaftman, I.;
- Meyer, J. R.
- Article
3
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1774, doi. 10.1007/s11664-008-0472-x
- Kim, S. M.;
- Yuen, H. B.;
- Hatami, F.;
- Chin, A.;
- Harris, J. S.
- Article
4
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1770, doi. 10.1007/s11664-008-0495-3
- Donetsky, D.;
- Chen, J.;
- Shterengas, L.;
- Kipshidze, G.;
- Westerfeld, D.
- Article
5
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1832, doi. 10.1007/s11664-008-0498-0
- Ho-Young Son;
- Gi-Jo Jung;
- Byung-Jin Park;
- Kyung-Wook Paik
- Article
6
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1811, doi. 10.1007/s11664-008-0526-0
- Keating, A. J.;
- Antoszewski, J.;
- Silva, K. K. M. B. D.;
- Winchester, K. J.;
- Nguyen, T.;
- Dell, J. M.;
- Musca, C. A.;
- Faraone, L.;
- Mitra, P.;
- Beck, J. D.;
- Skokan, M. R.;
- Robinson, J. E.
- Article
7
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1851, doi. 10.1007/s11664-008-0531-3
- Choi, S.;
- Hwang, S. Y.;
- Oh, W. S.
- Article
8
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1758, doi. 10.1007/s11664-008-0534-0
- Tatebayashi, J.;
- Jallipalli, A.;
- Kutty, M. N.;
- Huang, S. H.;
- Rotter, T. J.;
- Balakrishnan, G.;
- Dawson, L. R.;
- Huffaker, D. L.
- Article
9
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1843, doi. 10.1007/s11664-008-0540-2
- Ngoh, S. L.;
- Zhou, W.;
- Pang, J. H. L.
- Article
10
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1764, doi. 10.1007/s11664-008-0542-0
- Ghosh, Siddhartha;
- Mallick, Shubhrangshu;
- Banerjee, Koushik;
- Grein, Christoph;
- Velicu, Silviu;
- Zhao, Jun;
- Silversmith, Don;
- Rodriguez, Jean;
- Plis, Elena;
- Krishna, Sanjay
- Article
11
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1828, doi. 10.1007/s11664-008-0546-9
- Araujo, Roy A.;
- Xinghang Zhang;
- Haiyan Wang
- Article
12
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1858, doi. 10.1007/s11664-008-0548-7
- Xia, Y. H.;
- Jee, Y. K.;
- Yu, J.;
- Lee, T. Y.
- Article
13
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1821, doi. 10.1007/s11664-008-0549-6
- Herng-Yih Ueng;
- Shu-Ying Yang;
- Jung-Chuan Chou
- Article
14
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1793, doi. 10.1007/s11664-008-0557-6
- Tinkham, B. P.;
- Romanyuk, O.;
- Braun, W.;
- Ploog, K. H.;
- Grosse, F.;
- Takahasi, M.;
- Kaizu, T.;
- Mizuki, J.
- Article
15
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1863, doi. 10.1007/s11664-008-0552-y
- Inyoung Kim;
- Young Song;
- Hyun Jung;
- Jea Joung;
- Sung-Soo Ryu;
- Jongryoul Kim
- Article
16
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1799, doi. 10.1007/s11664-008-0558-5
- Tran, T.;
- Hatami, Fariba;
- Masselink, W.;
- Kunets, Vas;
- Salamo, G.J.
- Article
17
- Journal of Electronic Materials, 2008, v. 37, n. 12, p. 1806, doi. 10.1007/s11664-008-0559-4
- Matsuda, Takashi;
- Yoh, Kanji
- Article
18
- 2008
- Holmes, Archie;
- Wang, Christine;
- Huffaker, Diana
- Editorial
