Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 1

Results: 18

Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 125, doi. 10.1007/s11664-007-0304-4

By:

Dong-Xia Xu;
Yong-Ping Lei;
Zhi-Dong Xia;
Fu Guo;
Yao-Wu Shi

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 1, doi. 10.1007/s11664-007-0302-6

By:

Fu Guo;
Subramanian, K. N.;
Sung Kang;
Chada, Srinivas;
Turbini, Laura;
Jin Yu

Publication type:

Article

Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 118, doi. 10.1007/s11664-007-0301-7

By:

Ja-Myeong Koo;
Bui Quoc Vu;
Yu-Na Kim;
Jong-Bum Lee;
Jong-Woong Kim;
Dae-Up Kim;
Jeong-Hoon Moon;
Seung-Boo Jung

Publication type:

Article

Demonstration and Characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 110, doi. 10.1007/s11664-007-0296-0

By:

Yun-Hwan Jo;
Joo Won Lee;
Sun-Kyoung Seo;
Hyuck Mo Lee;
Hun Han;
Dong Chun Lee

Publication type:

Article

Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 96, doi. 10.1007/s11664-007-0293-3

By:

Lin, Y. L.;
Lai, Y. S.;
Lin, Y. W.;
Kao, C. R.

Publication type:

Article

Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 61, doi. 10.1007/s11664-007-0283-5

By:

Hong, K. K.;
Ryu, J. B.;
Park, C. Y.;
Huh, J. Y.

Publication type:

Article

The Influence of 0-0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 32, doi. 10.1007/s11664-007-0281-7

By:

Ventura, Tina;
Gourlay, Christopher M.;
Nogita, Kazuhiro;
Nishimura, Tetsuro;
Rappaz, Michel;
Dahle, Arne K.

Publication type:

Article

Mechanical Size Effects in Miniaturized Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 102, doi. 10.1007/s11664-007-0278-2

By:

Zimprich, Peter;
Saeed, Usman;
Betzwar-Kotas, Agnieszka;
Weiss, Brigitte;
Ipser, Herbert

Publication type:

Article

Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 73, doi. 10.1007/s11664-007-0266-6

By:

Yee-Wen Yen;
Weng-Ting Chou;
Yu Tseng;
Chiapyng Lee;
Chun-Lei Hsu

Publication type:

Article

Interfacial Reactions in the Sn-Bi/Te Couples.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 40, doi. 10.1007/s11664-007-0264-8

By:

Chen-Nan Chiu;
Chao-Hong Wang;
Sinn-Wen Chen

Publication type:

Article

Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 2, doi. 10.1007/s11664-007-0263-9

By:

Hu Hao;
Yaowu Shi;
Zhidong Xia;
Yongping Lei;
Fu Guo

Publication type:

Article

Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 84, doi. 10.1007/s11664-007-0262-x

By:

Han-Byul Kang;
Jee-Hwan Bae;
Jae-Wook Lee;
Park, Min-Ho;
Jeong-Won Yoon;
Seung-Boo Jung;
Cheol-Woong Yang

Publication type:

Article

Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 9, doi. 10.1007/s11664-007-0252-z

By:

Jong-Woong Kim;
Young-Chul Lee;
Seung-Boo Jung

Publication type:

Article

The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 51, doi. 10.1007/s11664-007-0248-8

By:

Gourlay, C. M.;
Read, J.;
Nogita, K.;
Dahle, A. K.

Publication type:

Article

Can Whiskers Grow on Bulk Lead-Free Solder?

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 90, doi. 10.1007/s11664-007-0237-y

By:

Nychka, John A.;
Yan Li;
Fuqian Yang;
Rong Chen

Publication type:

Article

Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 45, doi. 10.1007/s11664-007-0234-1

By:

Feng Gao;
Nishikawa, Hiroshi;
Takemoto, Tadashi

Publication type:

Article

Tin Whisker Growth Induced by High Electron Current Density.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 17, doi. 10.1007/s11664-007-0219-0

By:

Lin, Y. W.;
Yi-Shao Lai;
Lin, Y. L.;
Chun-Te Tu;
Kao, C. R.

Publication type:

Article

Modeling Material Properties of Lead-Free Solder Alloys.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 23, doi. 10.1007/s11664-007-0218-1

By:

Zhanli Guo;
Saunders, Nigel;
Miodownik, Peter;
Schillé, Jean-Philippe

Publication type:

Article