Works matching IS 03615235 AND DT 2008 AND VI 37 AND IP 1
Results: 18
Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 125, doi. 10.1007/s11664-007-0304-4
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Foreword.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 1, doi. 10.1007/s11664-007-0302-6
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Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 118, doi. 10.1007/s11664-007-0301-7
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Demonstration and Characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 110, doi. 10.1007/s11664-007-0296-0
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Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 96, doi. 10.1007/s11664-007-0293-3
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Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 61, doi. 10.1007/s11664-007-0283-5
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The Influence of 0-0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 32, doi. 10.1007/s11664-007-0281-7
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Mechanical Size Effects in Miniaturized Lead-Free Solder Joints.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 102, doi. 10.1007/s11664-007-0278-2
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Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 73, doi. 10.1007/s11664-007-0266-6
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Interfacial Reactions in the Sn-Bi/Te Couples.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 40, doi. 10.1007/s11664-007-0264-8
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Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 2, doi. 10.1007/s11664-007-0263-9
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Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 84, doi. 10.1007/s11664-007-0262-x
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Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 9, doi. 10.1007/s11664-007-0252-z
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The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 51, doi. 10.1007/s11664-007-0248-8
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Can Whiskers Grow on Bulk Lead-Free Solder?
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 90, doi. 10.1007/s11664-007-0237-y
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Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 45, doi. 10.1007/s11664-007-0234-1
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Tin Whisker Growth Induced by High Electron Current Density.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 17, doi. 10.1007/s11664-007-0219-0
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Modeling Material Properties of Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 23, doi. 10.1007/s11664-007-0218-1
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