Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1121, doi. 10.1007/s11664-007-0200-y
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 9
Results: 18
1
2
Very Low Pressure Magnetron Reactive Ion Etching of GaN and Al<sub>x</sub>Ga<sub>1-x</sub>N Using Dichlorofluoromethane (Halocarbon 12).
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1448, doi. 10.1007/s11664-007-0199-0
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- Publication type:
- Article
3
Studies on Inkjet-Printed Conducting Lines for Electronic Devices.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1211, doi. 10.1007/s11664-007-0194-5
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- Publication type:
- Article
4
Cathodoluminescence Study of InGaN/GaN Quantum-Well LED Structures Grown on a Si Substrate.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1144, doi. 10.1007/s11664-007-0193-6
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- Publication type:
- Article
5
Behavior of Anisotropic Conductive Film Joints Bonded with Various Forces under Temperature Fluctuation.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1199, doi. 10.1007/s11664-007-0191-8
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- Publication type:
- Article
6
Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce, Ga) Filler.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1193, doi. 10.1007/s11664-007-0190-9
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- Publication type:
- Article
7
Passivation of Surface and Interface States in AlGaN/GaN HEMT Structures by Annealing.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1149, doi. 10.1007/s11664-007-0189-2
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- Publication type:
- Article
8
Carbon Nanotube Thermal Pastes for Improving Thermal Contacts.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1181, doi. 10.1007/s11664-007-0188-3
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- Publication type:
- Article
9
Silver Particle Carbon-Matrix Composites as Thick Films for Electrical Applications.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1188, doi. 10.1007/s11664-007-0187-4
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- Publication type:
- Article
10
Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1129, doi. 10.1007/s11664-007-0186-5
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- Publication type:
- Article
11
Super-Large Domain Metal-Induced Radially Crystallized Poly-Si Made Using Ni(NO<sub>3</sub>)2/NH<sub>4</sub>OH Mixed Solution.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1160, doi. 10.1007/s11664-007-0185-6
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- Publication type:
- Article
12
Characterization of Non-Alloyed Ohmic Contacts to Si-Implanted AlGaN/GaN Heterostructures for High-Electron Mobility Transistors.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1156, doi. 10.1007/s11664-007-0184-7
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- Publication type:
- Article
13
Growth and Characterization of Pulsed-Laser-Deposited Ilmenite--Hematite Thin Films.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1224, doi. 10.1007/s11664-007-0157-x
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- Publication type:
- Article
14
Nanoscratching of Metallic Thin Films on Silicon Substrate: a Molecular Dynamics Study.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1174, doi. 10.1007/s11664-007-0155-z
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- Publication type:
- Article
15
Morphology and Pull Strength of Sn-Ag(-Co) Solder Joint with Copper Pad.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1137, doi. 10.1007/s11664-007-0148-y
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- Publication type:
- Article
16
Properties of Indium-Doped ZnO Films Prepared in an Oxygen-Rich Plasma.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1219, doi. 10.1007/s11664-007-0136-2
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- Publication type:
- Article
17
Broadband Dielectric Characterization of a Silicone Elastomer.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1206, doi. 10.1007/s11664-007-0124-6
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- Publication type:
- Article
18
Damage Produced in Solder Alloys during Thermal Cycling.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1111, doi. 10.1007/s11664-007-0122-8
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- Publication type:
- Article