Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 8
1
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 822, doi. 10.1007/s11664-007-0096-6
- Zhao, W.;
- Golding, T. D.;
- Littler, C. L.;
- Dinan, J. H.;
- Dura, J. A.;
- Lindstrom, R. M.
- Article
2
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1106, doi. 10.1007/s11664-007-0183-8
- Price, Steve;
- Wang, Larry;
- Wang, Alice;
- Ginwalla, Arwa;
- Mowat, Ian
- Article
3
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1098, doi. 10.1007/s11664-007-0182-9
- Carmody, M.;
- Edwall, D.;
- Ellsworth, J.;
- Arias, J.;
- Groenert, M.;
- Jacobs, R.;
- Almeida, L. A.;
- Dinan, J. H.;
- Chen, Y.;
- Brill, G;
- Dhar, N. K.
- Article
4
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1092, doi. 10.1007/s11664-007-0181-x
- Duff, Martine C.;
- Hunter, Douglas B.;
- Nuessle, Patterson;
- Black, David R.;
- Burdette, Harold;
- Woicik, Joseph;
- Burger, Arnold;
- Groza, Michael
- Article
5
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 821, doi. 10.1007/s11664-007-0180-y
- Sivananthan, S.;
- Anter, Y.;
- Dhar, N. K.
- Article
6
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1085, doi. 10.1007/s11664-007-0177-6
- Bornfreund, Richard;
- Rosbeck, Joe P.;
- Thai, Yen N.;
- Smith, Edward P.;
- Lofgreen, Daniel D.;
- Vilela, Mauro F.;
- Buell, Aimee A.;
- Newton, Michael D.;
- Kosai, Kenneth;
- Johnson, Scott M.;
- Delyon, Terry J.;
- Jensen, John E.;
- Tidrow, Meimei Z.
- Article
7
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1077, doi. 10.1007/s11664-007-0176-7
- Badano, G.;
- Million, A.;
- Canava, B.;
- Tran-Van, P.;
- Etcheberry, A.
- Article
8
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1068, doi. 10.1007/s11664-007-0173-x
- Parodos, T.;
- Fitzgerald, E. A.;
- Caster, A.;
- Tobin, S.;
- Marciniec, J.;
- Welsch, J.;
- Hairston, A.;
- Lamarre, P.;
- Riendeau, J.;
- Woodward, B.;
- Hu, S.;
- Reine, M.;
- Lovecchio, P.
- Article
9
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1021, doi. 10.1007/s11664-007-0166-9
- Ivanits'ka, V. G.;
- Moravec, P.;
- Franc, J.;
- Tomashik, Z. F.;
- Feychuk, P. I.;
- Tomashik, V. M.;
- Shcherbak, L. P.;
- Mašek, K.;
- Höschl, P.
- Article
10
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1052, doi. 10.1007/s11664-007-0171-z
- Piotrowski, Adam;
- Kłos, Krzystof
- Article
11
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1045, doi. 10.1007/s11664-007-0169-6
- Smith, E. P. G.;
- Venzor, G. M.;
- Petraitis, Y.;
- Liguori, M. V.;
- Levy, A. R.;
- Rabkin, C. K.;
- Peterson, J. M.;
- Reddy, M.;
- Johnson, S. M.;
- Bangs, J. W.
- Article
12
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1031, doi. 10.1007/s11664-007-0168-7
- Destefanis, G.;
- Baylet, J.;
- Ballet, P.;
- Castelein, P.;
- Rothan, F.;
- Gravrand, O.;
- Rothman, J.;
- Chamonal, J. P.;
- Million, A.
- Article
13
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1025, doi. 10.1007/s11664-007-0167-8
- Belas, E.;
- Bugár, M.;
- Grill, R.;
- Horodyský, P.;
- Feš, R.;
- Franc, J.;
- Moravec, P.;
- Matej, Z.;
- Höschl, P.
- Article
14
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1059, doi. 10.1007/s11664-007-0172-y
- Reine, M. B.;
- Marciniec, J. W.;
- Wong, K. K.;
- Parodos, T.;
- Mullarkey, J. D.;
- Lamarre, P. A.;
- Tobin, S. P.;
- Gustavsen, K. A.;
- Williams, G. M.
- Article
15
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1013, doi. 10.1007/s11664-007-0164-y
- Mandal, Krishna C.;
- Sung Hoon Kang;
- Choi, Michael;
- Jiuan Wei;
- Lili Zheng;
- Hui Zhang;
- Jellison, Gerald E.;
- Groza, Michael;
- Burger, Arnold
- Article
16
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1007, doi. 10.1007/s11664-007-0163-z
- Stoltz, A. J.;
- Varesi, J. B.;
- Benson, J. D.
- Article
17
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 1000, doi. 10.1007/s11664-007-0162-0
- Yong Chang;
- Guha, S.;
- Grein, C. H.;
- Velicu, S.;
- Flatté, M. E.;
- Nathan, V.;
- Sivananthan, S.
- Article
18
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 993, doi. 10.1007/s11664-007-0159-8
- Mallick, Shubhrangshu;
- Kiran, Rajni;
- Ghosh, Siddhartha;
- Velicu, Silviu;
- Sivananthan, Sivalingam
- Article
19
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 988, doi. 10.1007/s11664-007-0152-2
- Lindle, J. R.;
- Bewley, W. W.;
- Vurgaftman, I.;
- Meyer, J. R.;
- Thomas, M. L.;
- Tennant, W. E.;
- Edwall, D. D.;
- Piquette, E.
- Article
20
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 981, doi. 10.1007/s11664-007-0151-3
- Gravrand, O.;
- De Borniol, E.;
- Bisotto, S.;
- Mollard, L.;
- Destefanis, G.
- Article
21
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 971, doi. 10.1007/s11664-007-0149-x
- Juncheng Liu;
- Jiao Li;
- Guodong Zhang;
- Changxing Li;
- Lennon, Craig;
- Sivananthan, Siva
- Article
22
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 963, doi. 10.1007/s11664-007-0147-z
- Perrais, Gwladys;
- Gravrand, Olivier;
- Baylet, Jacques;
- Destefanis, Gerard;
- Rothman, Johan
- Article
23
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 958, doi. 10.1007/s11664-007-0146-0
- Lofgreen, D. D.;
- Vilela, M. F.;
- Smith, E. P.;
- Newton, M. D.;
- Beard, D.;
- Johnson, S. M.
- Article
24
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 949, doi. 10.1007/s11664-007-0143-3
- Benson, J. D.;
- Almeida, L. A.;
- Carmody, M. W.;
- Edwall, D. D.;
- Markunas, J. K.;
- Jacobs, R. N.;
- Martinka, M.;
- Lee, U.
- Article
25
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 937, doi. 10.1007/s11664-007-0141-5
- Garwood, G.;
- Olshove, R.;
- Pettijohn, E.;
- Bangs, J.;
- Liguori, M.;
- Olson, E.;
- Lua, F.
- Article
26
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 931, doi. 10.1007/s11664-007-0135-3
- Gordon, N. T.;
- Abbott, P.;
- Giess, J.;
- Graham, A.;
- Hails, J. E.;
- Hall, D. J.;
- Hipwood, L.;
- Jones, C. L.;
- Maxey, C. D.;
- Price, J.
- Article
27
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 925, doi. 10.1007/s11664-007-0134-4
- Huang, Y.;
- Chen, X. S.;
- Duan, H.;
- Lu, W.
- Article
28
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 919, doi. 10.1007/s11664-007-0133-5
- Plissard, S.;
- Giusti, G.;
- Polge, B.;
- Ballet, P.;
- Million, A.;
- Biquard, X.;
- Molva, E.;
- Barnes, J. P.;
- Holliger, P.
- Article
29
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 913, doi. 10.1007/s11664-007-0132-6
- Park, B. A.;
- Musca, C. A.;
- Antoszewski, J.;
- Dell, J. M.;
- Faraone, L.
- Article
30
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 910, doi. 10.1007/s11664-007-0131-7
- Wang, Larry;
- Wang, Alice;
- Price, Steve
- Article
31
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 905, doi. 10.1007/s11664-007-0128-2
- Jaime-Vasquez, M.;
- Martinka, M.;
- Jacobs, R. N.;
- Benson, J. D.
- Article
32
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 900, doi. 10.1007/s11664-007-0127-3
- Aqariden, F.;
- Dreiske, P. D.;
- Kinch, M. A.;
- Liao, P. K.;
- Murphy, T.;
- Schaake, H. F.;
- Shafer, T. A.;
- Shih, H. D.;
- Teherani, T. H.
- Article
33
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 895, doi. 10.1007/s11664-007-0126-4
- Zhang, Z.;
- Chen, H.;
- Zhong, J.;
- Saraf, G.;
- Lu, Y.
- Article
34
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 890, doi. 10.1007/s11664-007-0123-7
- He Duan;
- Xiaoshuang Chen;
- Yan Huang;
- Wei Lu
- Article
35
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 884, doi. 10.1007/s11664-007-0120-x
- Westerhout, R. J.;
- Musca, C. A.;
- Antoszewski, J.;
- Dell, J. M.;
- Faraone, L.
- Article
36
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 877, doi. 10.1007/s11664-007-0115-7
- Wehner, J. G. A.;
- Sewell, R. H.;
- Musca, C. A.;
- Dell, J. M.;
- Faraone, L.
- Article
37
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 871, doi. 10.1007/s11664-007-0114-8
- Kubát, J.;
- Franc, J.;
- Grill, R.;
- Horodyský, P.;
- Hlídek, P.;
- Belas, E.
- Article
38
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 864, doi. 10.1007/s11664-007-0113-9
- Hails, Janet E.;
- Keir, Andrew M.;
- Graham, Andrew;
- Williams, Gerald M.;
- Giess, Jean
- Article
39
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 857, doi. 10.1007/s11664-007-0111-y
- Bertazzi, Francesco;
- Goano, Michele;
- Bellotti, Enrico
- Article
40
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 852, doi. 10.1007/s11664-007-0109-5
- Cadeny, C. L.;
- Aifer, E. H.;
- Vurgaftman, I.;
- Tischler, J. G.;
- Meyer, J. R.;
- Warner, J. H.;
- Jackson, E. M.
- Article
41
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 846, doi. 10.1007/s11664-007-0107-7
- Emelie, P. Y.;
- Phillips, J. D.;
- Velicu, S.;
- Grein, C. H.
- Article
42
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 841, doi. 10.1007/s11664-007-0106-8
- Emelie, P. Y.;
- Cagin, E.;
- Siddiqui, J.;
- Phillips, J. D.;
- Fulk, C.;
- Garland, J.;
- Sivananthan, S.
- Article
43
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 837, doi. 10.1007/s11664-007-0105-9
- Yasuda, K.;
- Niraula, M.;
- Nakamura, K.;
- Yokota, M.;
- Shingu, I.;
- Noda, K.;
- Agata, Y.;
- Abe, K.;
- Eryu, O.
- Article
44
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 832, doi. 10.1007/s11664-007-0104-x
- Johnstone, D.;
- Golding, T. D.;
- Hellmer, R.;
- Dinan, J. H.;
- Carmody, M.
- Article
45
- Journal of Electronic Materials, 2007, v. 36, n. 8, p. 826, doi. 10.1007/s11664-007-0103-y
- Tsen, G. K. O.;
- Musca, C. A.;
- Dell, J. M.;
- Antoszewski, J.;
- Faraone, L.
- Article