Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 7
1
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 740, doi. 10.1007/s11664-007-0087-7
- He, J.;
- Jin, R.;
- Chakoumakos, B. C.;
- Gardner, J. S.;
- Mandrus, D.;
- Tritt, Terry M.
- Article
2
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 703, doi. 10.1007/s11664-007-0179-4
- Article
3
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 716, doi. 10.1007/s11664-007-0175-8
- Ikeda, Teruyuki;
- Ravi, Vilupanur A.;
- Collins, Lauren A.;
- Haile, Sossina M.;
- Snyder, G. Jeffrey
- Article
4
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 704, doi. 10.1007/s11664-007-0174-9
- Hogan, Timothy P.;
- Downey, Adam;
- Short, Jarrod;
- D'angelo, Jonathan;
- Chun-I Wu;
- Quarez, Eric;
- Androulakis, John;
- Poudeu, Pierre F. P.;
- Sootsman, Joseph R.;
- Duck-Young Chung;
- Kanatzidis, Mercouri G.;
- Mahanti, S. D.;
- Timm, Edward J.;
- Schock, Harold;
- Ren, Fei;
- Johnson, Jason;
- Case, Eldon D.
- Article
5
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 805, doi. 10.1007/s11664-007-0170-0
- Oder, T. N.;
- Martin, P.;
- Adedeji, A. V.;
- Isaacs-Smith, T.;
- Williams, J. R.
- Article
6
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 711, doi. 10.1007/s11664-007-0160-2
- Alboni, P. N.;
- Ji, X.;
- He, J.;
- Gothard, N.;
- Hubbard, J.;
- Tritt, Terry M.
- Article
7
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 746, doi. 10.1007/s11664-007-0158-9
- Dutta, Biprodas;
- Battogtokh, Jugdersuren;
- Mckewon, David;
- Vidensky, Igor;
- Dutta, Neilanjan;
- Pegg, Ian L.
- Article
8
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 721, doi. 10.1007/s11664-007-0156-y
- Ji, X.;
- Zhang, B.;
- Tritt, T. M.;
- Kolis, J. W.;
- Kumbhar, A.
- Article
9
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 736, doi. 10.1007/s11664-007-0154-0
- Singh, D. J.;
- Kasinathan, D.
- Article
10
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 732, doi. 10.1007/s11664-007-0153-1
- Ponnambalam, V.;
- Bo Zhang;
- Tritt, Terry M.;
- Poon, S. Joseph
- Article
11
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 760, doi. 10.1007/s11664-007-0150-4
- Chih-Ming Chen;
- Chih-Chieh Huang;
- Chien-Neng Liao;
- Kuen-Ming Liou
- Article
12
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 798, doi. 10.1007/s11664-007-0145-1
- Klimiec, Ewa;
- Nowak, Stanisław;
- Zaraska, Wiesław;
- Stoch, Jerzy
- Article
13
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 775, doi. 10.1007/s11664-007-0144-2
- Article
14
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 812, doi. 10.1007/s11664-007-0142-4
- Jiménez, J. A.;
- Lysenko, S.;
- Zhang, G.;
- Liu, H.
- Article
15
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 753, doi. 10.1007/s11664-007-0139-z
- Lin, W. H.;
- Wu, Albert T.;
- Lin, S. Z.;
- Chuang, T. H.;
- Tu, K. N.
- Article
16
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 766, doi. 10.1007/s11664-007-0138-0
- Hao, H.;
- Tian, J.;
- Shi, Y. W.;
- Lei, Y. P.;
- Xia, Z. D.
- Article
17
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 727, doi. 10.1007/s11664-006-0085-1
- Huqin Zhang;
- Jian He;
- Bo Zhang;
- Zhe Su;
- Tritt, Terry M.;
- Soheilnia, Navid;
- Kleinke, Holger
- Article
18
- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 783, doi. 10.1007/s11664-006-0062-8
- De Monlevade, Eduardo Franco;
- Weiqun Peng
- Article
