Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 7
Results: 18
Thermoelectric Properties of Na<sub>x</sub>CoO<sub>2</sub> and Prospects for Other Oxide Thermoelectrics.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 736, doi. 10.1007/s11664-007-0154-0
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Effects of Copper Doping on Microstructural Evolution in Eutectic SnBi Solder Stripes under Annealing and Current Stressing.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 760, doi. 10.1007/s11664-007-0150-4
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Development and Evolution of Nanostructure in Bulk Thermoelectric Pb-Te-Sb Alloys.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 716, doi. 10.1007/s11664-007-0175-8
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Thermoelectric Properties of Half-Heusler Bismuthides ZrCo<sub>1-x</sub>Ni<sub>x</sub>Bi (x = 0.0 to 0.1).
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 732, doi. 10.1007/s11664-007-0153-1
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Thermoelectric Properties of NaCo<sub>2-x</sub>Fe<sub>x</sub>O<sub>y</sub>.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 746, doi. 10.1007/s11664-007-0158-9
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Crystal Growth, Structure, and Stoichiometry of the Superconducting Pyrochlore Cd<sub>2</sub>Re<sub>2</sub>O<sub>7</sub>.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 740, doi. 10.1007/s11664-007-0087-7
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Foreword.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 703, doi. 10.1007/s11664-007-0179-4
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Solution-Chemical Syntheses of Nano-Structured Bi<sub>2</sub>Te<sub>3</sub> and PbTe Thermoelectric Materials.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 721, doi. 10.1007/s11664-007-0156-y
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Nanostructured Thermoelectric Materials and High-Efficiency Power-Generation Modules.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 704, doi. 10.1007/s11664-007-0174-9
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Improved Schottky Contacts on n-Type 4H-SiC Using ZrB<sub>2</sub> Deposited at High Temperatures.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 805, doi. 10.1007/s11664-007-0170-0
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Synthesis and Thermoelectric Properties of "Nano-Engineered" CoSb<sub>3</sub> Skutterudite Materials.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 711, doi. 10.1007/s11664-007-0160-2
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The Role of TiO<sub>2</sub> in Ceramic Bulk Interference Suppressing Resistor Integrated with Car Spark Plug.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 798, doi. 10.1007/s11664-007-0145-1
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Electroless Ni/Au Bump on a Copper Patterned Wafer for the CMOS Image Sensor Package in Mobile Phones.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 775, doi. 10.1007/s11664-007-0144-2
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Optical Characterization of Ag Nanoparticles Embedded in Aluminophosphate Glass.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 812, doi. 10.1007/s11664-007-0142-4
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- Article
Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 753, doi. 10.1007/s11664-007-0139-z
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Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 766, doi. 10.1007/s11664-007-0138-0
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- Article
Thermoelectric Properties of Mo<sub>3</sub>Sb<sub>5.4</sub>Te<sub>1.6</sub> and Ni<sub>0.06</sub>Mo<sub>3</sub>Sb<sub>5.4</sub>Te<sub>1.6</sub>.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 727, doi. 10.1007/s11664-006-0085-1
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Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects.
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- Journal of Electronic Materials, 2007, v. 36, n. 7, p. 783, doi. 10.1007/s11664-006-0062-8
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