Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 6
1
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 697, doi. 10.1007/s11664-007-0095-7
- Wang, X.;
- Yu, G.;
- Lei, B.;
- Lin, C.;
- Sui, Y.;
- Meng, S.;
- Qi, M.;
- Li, A.
- Article
2
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 648, doi. 10.1007/s11664-006-0007-2
- Hullavarad, S. S.;
- Pugel, D. E.;
- Jones, E. B.;
- Vispute, R. D.;
- Venkatesan, T.
- Article
3
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 641, doi. 10.1007/s11664-007-0137-1
- Joshi, Sachin;
- Dey, Sagnik;
- Chaumont, Michelle;
- Campion, Alan;
- Banerjee, Sanjay K.
- Article
4
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 623, doi. 10.1007/s11664-007-0100-1
- Article
5
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 629, doi. 10.1007/s11664-006-0009-0
- Alptekin, Emre;
- Hongbo Yu;
- Ozbay, Ekmel;
- Aktas, Ozgur
- Article
6
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 690, doi. 10.1007/s11664-007-0140-6
- Jong-Woong Kim;
- Seung-Boo Jung
- Article
7
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 654, doi. 10.1007/s11664-007-0130-8
- Zhong, J.;
- Saraf, G.;
- Chen, H.;
- Lu, Y.;
- Ng, Hock M.;
- Siegrist, T.;
- Parekh, A.;
- Lee, D.;
- Armour, E. A.
- Article
8
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 669, doi. 10.1007/s11664-007-0125-5
- Inoue, Masahiro;
- Suganuma, Katsuaki
- Article
9
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 634, doi. 10.1007/s11664-007-0119-3
- Article
10
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 682, doi. 10.1007/s11664-007-0121-9
- Lee, J.;
- Mayer, M.;
- Zhou, Y.
- Article
11
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 659, doi. 10.1007/s11664-007-0116-6
- Chuangang Lin;
- Howe, Timothy A.;
- Chung, D. D. L.
- Article
12
- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 676, doi. 10.1007/s11664-007-0117-5
- Kil-Won Moon;
- Kattner, Ursula R.;
- Handwerker, Carol A.
- Article