Effects of Substrate Materials on Self-Formation of Ti-Rich Interface Layers in Cu(Ti) Alloy Films.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 606, doi. 10.1007/s11664-007-0097-5
- By:
- Publication type:
- Article
Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 5
Results: 12
1
2
Barrier Properties of Amorphous Binary Ta-Ni Thin Films for Cu Interconnection.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 614, doi. 10.1007/s11664-007-0098-4
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- Publication type:
- Article
3
Migration, Formation, and Growth of Pure Cd Whiskers in Cd-Based Compounds.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 555, doi. 10.1007/s11664-007-0092-x
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- Publication type:
- Article
4
Measurement of Small Specific Contact Resistance of Metals with Resistive Semiconductors.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 598, doi. 10.1007/s11664-007-0091-y
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- Publication type:
- Article
5
Thermodynamic Modeling of the Au-Bi-Sb Ternary System.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 568, doi. 10.1007/s11664-007-0090-z
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- Publication type:
- Article
6
Characteristics of Dislocation Half-Loop Arrays in 4H-SiC Homo-Epilayer.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 539, doi. 10.1007/s11664-007-0129-1
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- Publication type:
- Article
7
Strategies to Improve Field Emission Performance of Nanostructural ZnO.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 543, doi. 10.1007/s11664-007-0118-4
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- Publication type:
- Article
8
Magnetic Nanocomposite for Potential Ultrahigh Frequency Microelectronic Application.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 593, doi. 10.1007/s11664-007-0112-x
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- Publication type:
- Article
9
A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 587, doi. 10.1007/s11664-007-0108-6
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- Publication type:
- Article
10
In-Situ Observation of Electromigration in Eutectic SnPb Solder Lines: Atomic Migration and Hillock Formation.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 562, doi. 10.1007/s11664-007-0102-z
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- Publication type:
- Article
11
High Performance Nonconductive Film with π-Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 549, doi. 10.1007/s11664-007-0101-0
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- Publication type:
- Article
12
Interfacial Reactions between Cu<sub>x</sub>Ni<sub>y</sub> Alloy Underbump Metallurgy and Sn-Ag-zCu Solders.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 5, p. 578, doi. 10.1007/s11664-006-0049-5
- By:
- Publication type:
- Article