Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 3
Results: 12
Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 258, doi. 10.1007/s11664-007-0094-8
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- Article
Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 197, doi. 10.1007/s11664-007-0093-9
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- Article
Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 207, doi. 10.1007/s11664-007-0089-5
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- Article
Hygrothermal Delaminations in Lead-Free Solder Reflow of Electronic Packages.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 226, doi. 10.1007/s11664-007-0088-6
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- Article
Interfacial Chemistry of InP/GaAs Bonded Pairs.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 179, doi. 10.1007/s11664-006-0077-1
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- Article
Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 214, doi. 10.1007/s11664-006-0071-7
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- Article
Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 232, doi. 10.1007/s11664-006-0066-4
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- Article
A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 242, doi. 10.1007/s11664-006-0058-4
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Microstructure of External Stress Whiskers and Mechanical Indentation Test Method.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 220, doi. 10.1007/s11664-006-0030-3
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- Article
Memory Effect of Metal-Insulator-Silicon Capacitor with HfO<sub>2</sub>-Al<sub>2</sub>O<sub>3</sub> Multilayer and Hafnium Nitride Gate.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 253, doi. 10.1007/s11664-006-0003-6
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- Article
Synthesis of Nanometric-Sized Barium Titanate Powders Using Acetylacetone as the Chelating Agent in a Sol-Precipitation Process.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 245, doi. 10.1007/s11664-006-0027-y
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- Article
Understanding the Effects of Stress on the Crystallization of Amorphous Silicon.
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- Journal of Electronic Materials, 2007, v. 36, n. 3, p. 191, doi. 10.1007/s11664-006-0012-5
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- Article