Foreword.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1545, doi. 10.1007/s11664-007-0303-5
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Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 12
Results: 32
1
2
Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1594, doi. 10.1007/s11664-007-0292-4
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3
Influence of Ta-based Diffusion Barriers on the Microstructure of Copper Thin Films.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1625, doi. 10.1007/s11664-007-0289-z
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- Article
4
Oxidation Behavior of Molten Tin Doped with Phosphorus.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1669, doi. 10.1007/s11664-007-0288-0
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- Article
5
Superconducting and Transport Properties of (Bi-Pb)-Sr-Ca-Cu-O with Nano-Cr<sub>2</sub>O<sub>3</sub> Additions.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1648, doi. 10.1007/s11664-007-0287-1
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6
Predicting and Understanding Order of Heteroepitaxial Quantum Dots.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1546, doi. 10.1007/s11664-007-0246-x
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7
Influence of Bonding Temperature and Applied Load on the Bonding Integrity and Optical Performance of Face- Down Bonded Ridge-Waveguide Lasers.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1635, doi. 10.1007/s11664-007-0286-2
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8
Electrical Characterization of Defects Introduced During Sputter Deposition of Schottky Contacts on n-type Ge.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1604, doi. 10.1007/s11664-007-0245-y
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9
Creep Life Assessment of Tin-Based Lead-Free Solders Based on Imaginary Initial Strain Rate.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1691, doi. 10.1007/s11664-007-0285-3
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10
Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1630, doi. 10.1007/s11664-007-0243-0
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11
Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1732, doi. 10.1007/s11664-007-0284-4
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12
Thermal Stability of Nitride-Based Diffusion Barriers for Ohmic Contacts to n-GaN.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1662, doi. 10.1007/s11664-007-0277-3
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13
Thermo-optical Responses of Nanoparticles: Melting of Ice and Nanocalorimetry Approach.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1587, doi. 10.1007/s11664-007-0279-1
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14
Ordered CdTe/CdS Arrays for High-Performance Solar Cells.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1599, doi. 10.1007/s11664-007-0276-4
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15
Fabrication of Cu(Ti) Alloy Interconnects with Self-Formation of Thin Barrier Metal Layers Using a High- Pressure Annealing Process.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1658, doi. 10.1007/s11664-007-0274-6
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16
Effect of Homogenization on the Indentation Creep of Cast Lead-Free Sn-5%Sb Solder Alloy.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1703, doi. 10.1007/s11664-007-0275-5
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17
Biomolecule-Assisted Synthetic Route to Nanostructured Crystals: Synthesis of CdS Hierarchical Dendrites.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1567, doi. 10.1007/s11664-007-0273-7
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18
Ultraviolet Photodetection Properties of a Pt Contact on a Mg<sub>0.1</sub>Zn<sub>0.9</sub>O/ZnO Composite Film.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1643, doi. 10.1007/s11664-007-0272-8
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19
Cavity Quantum Electrodynamics, Nanophotonics, and Quantum Communication with Atomically Doped Carbon Nanotubes.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1579, doi. 10.1007/s11664-007-0269-3
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20
Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1711, doi. 10.1007/s11664-007-0267-5
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21
Wet Oxidation in a Square Sandwich Composite of GaAs/AlAs/GaAs.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1652, doi. 10.1007/s11664-007-0265-7
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22
Optical Properties and Microstructure of Silver-Copper Nanoparticles Synthesized by Pulsed Laser Deposition.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1574, doi. 10.1007/s11664-007-0261-y
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23
Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1679, doi. 10.1007/s11664-007-0260-z
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24
Photothermal Activation of Shallow Dopants Implanted in Silicon.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1735, doi. 10.1007/s11664-007-0259-5
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25
Microstructural Aspects of Nucleation and Growth of (In,Ga)As-GaAs(001) Islands with Low Indium Content.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1555, doi. 10.1007/s11664-007-0258-6
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26
He Ion Implantation and the Refractive Index Depth Profile in Relaxor Ferroelectric Optical Waveguides.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1724, doi. 10.1007/s11664-007-0240-3
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27
Evolution of Contact Resistance during the Bonding Process of NCA Flip-Chip Interconnections.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1719, doi. 10.1007/s11664-007-0257-7
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28
Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1697, doi. 10.1007/s11664-007-0249-7
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29
On the Nature of the Interface between Ag<sub>3</sub>Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1615, doi. 10.1007/s11664-007-0239-9
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30
The Effect of Low-Temperature Solute Elements on Nonequilibrium Eutectic Solidification of Sn-Ag Eutectic Solders.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1608, doi. 10.1007/s11664-007-0238-x
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31
Effect of Electron--Electron Interaction on Nonlinear Near-Resonance Electromagnetic Response of Quantum Dot Systems.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1562, doi. 10.1007/s11664-007-0217-2
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32
Electron and Hole Capture Cross-Sections of Fe Acceptors in GaN:Fe Epitaxially Grown on Sapphire.
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- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1621, doi. 10.1007/s11664-007-0202-9
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