Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 11
Results: 19
Evaluation of DC-sputtered Glassy TaCoN Thin Film for Copper Metallization.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1462, doi. 10.1007/s11664-007-0268-4
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- Article
Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1536, doi. 10.1007/s11664-007-0256-8
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Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1524, doi. 10.1007/s11664-007-0255-9
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Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1501, doi. 10.1007/s11664-007-0254-x
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Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1448, doi. 10.1007/s11664-007-0270-x
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- Article
Inhibiting AuSn<sub>4</sub> Formation by Controlling the Interfacial Reaction in Solder Joints.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1476, doi. 10.1007/s11664-007-0282-6
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- Article
Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1442, doi. 10.1007/s11664-007-0280-8
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Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1469, doi. 10.1007/s11664-007-0253-y
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- Article
Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1429, doi. 10.1007/s11664-007-0247-9
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Foreword.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1407, doi. 10.1007/s11664-007-0236-z
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- Article
Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1408, doi. 10.1007/s11664-007-0223-4
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- Article
Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1455, doi. 10.1007/s11664-007-0235-0
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- Article
Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High- Temperature Soldering Applications.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1516, doi. 10.1007/s11664-007-0222-5
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- Article
Enhanced Wettability of Oxidized Copper with Lead-Free Solder by Ar-H<sub>2</sub> Plasmas for Flip-Chip Bumping.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1483, doi. 10.1007/s11664-007-0225-2
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Fabrication of Mg-Based Intermetallic Compounds by Liquid Electromigration.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1489, doi. 10.1007/s11664-007-0231-4
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- Article
Phase Equilibria in the Ag-Ni-Sn System: Isothermal Sections.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1415, doi. 10.1007/s11664-007-0205-6
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- Article
Electrochemical Properties of Joints Formed Between Sn-9Zn-1.5Ag-1Bi Alloys and Cu Substrates in a 3.5 wt.% NaCl Solution.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1531, doi. 10.1007/s11664-007-0221-6
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Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1510, doi. 10.1007/s11664-007-0211-8
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- Article
The Effect of Thermomigration on Phase Coarsening in a Eutectic SnPb Alloy.
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- Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1495, doi. 10.1007/s11664-007-0207-4
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- Article