Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 11

Results: 19

Fabrication of Mg-Based Intermetallic Compounds by Liquid Electromigration.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1489, doi. 10.1007/s11664-007-0231-4

By:

Li, C. H.;
Chuang, Y. C.;
Liu, C. Y.

Publication type:

Article

Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1455, doi. 10.1007/s11664-007-0235-0

By:

Chien Wei Chang;
Su Chun Yang;
Chun-Te Tu;
Kao, C. Robert

Publication type:

Article

Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1429, doi. 10.1007/s11664-007-0247-9

By:

Liu, X. J.;
Wang, C. P.;
Gao, F.;
Ohnuma, I.;
Ishida, K.

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1407, doi. 10.1007/s11664-007-0236-z

By:

Sinn-wen Chen;
Chada, Srinivas;
Chih-ming Chen;
Greer, A. Lindsay;
Young-chang Joo;
Hyuck Mo Lee;
Lewis, Daniel J.;
Suganuma, Katsuaki

Publication type:

Article

Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1448, doi. 10.1007/s11664-007-0270-x

By:

Min-Hsien Lu;
Ker-Chang Hsieh

Publication type:

Article

Inhibiting AuSn<sub>4</sub> Formation by Controlling the Interfacial Reaction in Solder Joints.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1476, doi. 10.1007/s11664-007-0282-6

By:

Li-Yin Hsiao;
Guh-Yaw Jang;
Kai-Jheng Wang;
Jenq-Gong Duh

Publication type:

Article

Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1442, doi. 10.1007/s11664-007-0280-8

By:

Sung-Ki Lee;
Jae-Ho Lee;
Young-Ho Kim

Publication type:

Article

Evaluation of DC-sputtered Glassy TaCoN Thin Film for Copper Metallization.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1462, doi. 10.1007/s11664-007-0268-4

By:

Jau-Shiung Fang;
Min-Li Ke;
Hui-Chien Chen

Publication type:

Article

Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1536, doi. 10.1007/s11664-007-0256-8

By:

Sun-Kyoung Seo;
Moon Gi Cho;
Hyuck Mo Lee

Publication type:

Article

Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1524, doi. 10.1007/s11664-007-0255-9

By:

Ching-Feng Yang;
Sinn-Wen Chen;
Kuan-Hsien Wu;
Tsung-Shune Chin

Publication type:

Article

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1501, doi. 10.1007/s11664-007-0254-x

By:

Moon Gi Cho;
Kang, Sung K.;
Da-Yuan Shih;
Hyuck Mo Lee

Publication type:

Article

Morphological and Microstructural Evolution of Phosphorous-Rich Layer in SnAgCu/Ni-P UBM Solder Joint.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1469, doi. 10.1007/s11664-007-0253-y

By:

Yung-Chi Lin;
Toung-Yi Shih;
Shih-Kang Tien;
Jenq-Gong Duh

Publication type:

Article

Enhanced Wettability of Oxidized Copper with Lead-Free Solder by Ar-H<sub>2</sub> Plasmas for Flip-Chip Bumping.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1483, doi. 10.1007/s11664-007-0225-2

By:

Yung-Sen Lin;
Chun-Hao Chang;
Wei-Jhih Lin

Publication type:

Article

Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1408, doi. 10.1007/s11664-007-0223-4

By:

Tsai, T. K.;
Wu, S. S.;
Liu, W. L.;
Hsieh, S. H.;
Chen, W. J.

Publication type:

Article

Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High- Temperature Soldering Applications.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1516, doi. 10.1007/s11664-007-0222-5

By:

Jenn-Ming Song;
Hsin-Yi Chuang;
Zong-Mou Wu

Publication type:

Article

Electrochemical Properties of Joints Formed Between Sn-9Zn-1.5Ag-1Bi Alloys and Cu Substrates in a 3.5 wt.% NaCl Solution.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1531, doi. 10.1007/s11664-007-0221-6

By:

Chih-Yao Liu;
Ying-Ru Chen;
Wang-Long Li;
Min-Hsiung Hon;
Moo-Chin Wang

Publication type:

Article

Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1510, doi. 10.1007/s11664-007-0211-8

By:

Jun Hyung Lim;
Eui Cheol Park;
Seung Yi Lee;
Jeong-Won Yoon;
Sang-Su Ha;
Jinho Joo;
Hoo-Jeong Lee;
Seung-Boo Jung;
Keun Song

Publication type:

Article

The Effect of Thermomigration on Phase Coarsening in a Eutectic SnPb Alloy.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1495, doi. 10.1007/s11664-007-0207-4

By:

Chuang, Y. C.;
Liu, C. Y.

Publication type:

Article

Phase Equilibria in the Ag-Ni-Sn System: Isothermal Sections.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 11, p. 1415, doi. 10.1007/s11664-007-0205-6

By:

Schmetterer, Clemens;
Flandorfer, Hans;
Richter, Klaus W.;
Ipser, Herbert

Publication type:

Article