Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 17, doi. 10.1007/s11664-006-0008-1
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 1
Results: 13
1
2
Investigation of the Surface Removal Process of Silicon Carbide in Elastic Emission Machining.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 92, doi. 10.1007/s11664-006-0006-3
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- Publication type:
- Article
3
Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 26, doi. 10.1007/s11664-006-0005-4
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- Publication type:
- Article
4
Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 33, doi. 10.1007/s11664-006-0004-5
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- Publication type:
- Article
5
Strength of Soldered Joints Formed under Microgravity Conditions.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 1, doi. 10.1007/s11664-006-0033-0
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- Publication type:
- Article
6
Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 6, doi. 10.1007/s11664-006-0026-z
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- Publication type:
- Article
7
Phase-Change Memory Device Using Si-Sb-Te Film for Low Power Operation and Multibit Storage.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 88, doi. 10.1007/s11664-006-0024-1
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- Publication type:
- Article
8
Deposition Characteristics of AlN Thin Film Prepared by the Dual Ion Beam Sputtering System.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 81, doi. 10.1007/s11664-006-0023-2
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- Publication type:
- Article
9
Characteristics of the Interfacial Microstructure of Chip-on-Plastic Joints under Thermal Cycling and Aging Treatment.
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- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 45, doi. 10.1007/s11664-006-0022-3
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- Publication type:
- Article
10
Growth of Nanocrystalline ZnSe:N Films by Pulsed Laser Deposition.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 75, doi. 10.1007/s11664-006-0021-4
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- Publication type:
- Article
11
Thermodynamic Properties of Liquid Ag-Bi-Sn Alloys.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 40, doi. 10.1007/s11664-006-0002-7
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- Publication type:
- Article
12
Hygrothermal Stability of Electrical Contacts Made from Silver and Graphite Electrically Conductive Pastes.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 65, doi. 10.1007/s11664-006-0018-z
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- Publication type:
- Article
13
Study of the Formation of Bubbles in Rigid Substrate-Flexible Substrate Bonding Using Anisotropic Conductive Films and the Bubble Effects on Anisotropic Conductive Film Joint Reliability.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 1, p. 56, doi. 10.1007/s11664-006-0015-2
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- Publication type:
- Article