Reliability Issues in Pb-Free Solder Joint Miniaturization.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1761, doi. 10.1007/s11664-006-0231-9
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 9
Results: 13
1
2
Revealing the Nucleation and Growth Mechanism of a Novel Solder Developed from Sn-3.5Ag-0.5Cu Nanoparticles by a Chemical Reduction Method.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1755, doi. 10.1007/s11664-006-0230-x
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- Article
3
Influence of Cu Content on Compound Formation near the Chip Side for the Flip-Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump during Aging.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1745, doi. 10.1007/s11664-006-0229-3
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- Article
4
Effect of Al Trace Dimension on Electromigration Failure Time of Flip-Chip Solder Joints.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1740, doi. 10.1007/s11664-006-0228-4
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- Publication type:
- Article
5
Effect of Small Additions of Alloying Elements on the Properties of Sn-Zn Eutectic Alloy.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1734, doi. 10.1007/s11664-006-0227-5
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- Article
6
Studies of the Optoelectronic Properties of ZnO Thin Films.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1728, doi. 10.1007/s11664-006-0226-6
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- Publication type:
- Article
7
Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1722, doi. 10.1007/s11664-006-0225-7
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- Publication type:
- Article
8
Nonlinear Optical Dynamics of Glass-Embedded Silver Nanoparticles.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1715, doi. 10.1007/s11664-006-0224-8
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- Article
9
InAs-Based p-n Homojunction Diodes: Doping Effects and Impact of Doping on Device Parameters.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1712, doi. 10.1007/s11664-006-0223-9
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- Publication type:
- Article
10
Effects of Oxygen in Ni Films on Ni-Induced Lateral Crystallization of Amorphous Silicon Films at Various Temperatures.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1708, doi. 10.1007/s11664-006-0222-x
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- Publication type:
- Article
11
The Sn/Ni-7Wt.%V Interfacial Reactions.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1701, doi. 10.1007/s11664-006-0221-y
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- Publication type:
- Article
12
Thermosonic Bonding of Gold Wire onto Silver Bonding Layer on the Bond Pads of Chips with Copper Interconnects.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1693, doi. 10.1007/s11664-006-0220-z
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- Publication type:
- Article
13
Stable Optical Emission from Annealed Poly (p-Phenylene Vinylene) Derivative Films Containing Oxadiazole.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1728, doi. 10.1007/s11664-006-0219-5
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- Publication type:
- Article