High-Pressure Preparation and Thermoelectric Properties of Bi<sub>0.85</sub>Sb<sub>0.15</sub>.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. L7, doi. 10.1007/s11664-006-0155-4
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 7
Results: 16
1
2
Microstructure, Creep Properties, and Failure Mechanism of SnAgCu Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1600, doi. 10.1007/s11664-006-0154-5
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- Publication type:
- Article
3
Investigation of Electroless Cobalt-Phosphorous Layer and Its Diffusion Barrier Properties of Pb-Sn Solder.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1593, doi. 10.1007/s11664-006-0153-6
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- Publication type:
- Article
4
Intermetallic Growth Kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu Lead-Free Solders on Cu, Ni, and Fe-42Ni Substrates.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1581, doi. 10.1007/s11664-006-0152-7
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- Publication type:
- Article
5
Durable Electrochromic Coatings Prepared from Electronically Conductive Poly(3HT-co-3TPP)-Silica Hybrid Materials.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1571, doi. 10.1007/s11664-006-0151-8
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- Publication type:
- Article
6
Intermetallic Compounds Formed During Diffusion Soldering of Au/Cu/Al<sub>2</sub>O<sub>3</sub> and Cu/Ti/Si with Sn/In Interlayer.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1566, doi. 10.1007/s11664-006-0150-9
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- Publication type:
- Article
7
Interfacial Adhesion of Spin-Coated Thin Adhesive Film on Silicon Substrate for the Fabrication of Polymer Optical Waveguide.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1558, doi. 10.1007/s11664-006-0149-2
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- Publication type:
- Article
8
Influence of Substrate Temperature on the Properties of Fluorinated Silicon-Nitride Thin Films Deposited by IC-RPECVD.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1552
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- Publication type:
- Article
9
Annealing Effect on the dc Transport Mechanism in Dysprosium Oxide Films Grown on Si Substrates.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1547, doi. 10.1007/s11664-006-0147-4
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- Publication type:
- Article
10
Structural Defects in Si-Doped III-V Nitrides.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1543, doi. 10.1007/s11664-006-0146-5
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- Publication type:
- Article
11
Three-Dimensional Analysis of the Interface Between an Sn-8wt.%Zn-3wt.%Bi Solder and a Substrate by Using an Angle-Lapping Method.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1537, doi. 10.1007/s11664-006-0145-6
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- Publication type:
- Article
12
Effect of Flux on the Wetting Characteristics of SnAg, SnCu, SnAgBi, and SnAgCu Lead-Free Solders on Copper Substrates.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1530, doi. 10.1007/s11664-006-0144-7
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- Publication type:
- Article
13
Influence of Bias-Temperature Stressing on the Electrical Characteristics of SiOC:H Film with Cu/TaN/Ta-Gated Capacitor.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1523, doi. 10.1007/s11664-006-0143-8
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- Publication type:
- Article
14
Lead-Free Solder Reinforced with Multiwalled Carbon Nanotubes.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1518, doi. 10.1007/s11664-006-0142-9
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- Publication type:
- Article
15
Seeded Growth of AIN Crystals on Nonpolar Seeds via Physical Vapor Transport.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1513, doi. 10.1007/s11664-006-0141-x
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- Publication type:
- Article
16
p-n Junctions in Silicon Nanowires.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 7, p. 1509, doi. 10.1007/s11664-006-0140-y
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- Publication type:
- Article