Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 5
Results: 45
Laser Forming of Silicon Films Using Nanoparticle Precursor.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 993, doi. 10.1007/BF02692559
- By:
- Publication type:
- Article
Influence of Space Charge on Lux-Ampere Characteristics of High-Resistivity CdTe.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 988, doi. 10.1007/BF02692558
- By:
- Publication type:
- Article
Dissolution Behavior of Cu and Ag Substrates in Molten Solders.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 978, doi. 10.1007/BF02692557
- By:
- Publication type:
- Article
Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 972, doi. 10.1007/BF02692556
- By:
- Publication type:
- Article
Reliability of Adhesion Strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during Isothermal Aging.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 966, doi. 10.1007/BF02692555
- By:
- Publication type:
- Article
A Thermomechanical Study of the Electrical Resistance of Cu Lead Interconnections.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 958, doi. 10.1007/BF02692554
- By:
- Publication type:
- Article
Fabrication of Nylon-6/Carbon Nanotube Composites.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 954, doi. 10.1007/BF02692553
- By:
- Publication type:
- Article
Temperature and Current-Density Distributions in Flip-Chip Solder Joints with Cu Traces.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 947, doi. 10.1007/BF02692552
- By:
- Publication type:
- Article
Synthesis of Low-Melting Metal Oxide and Sulfide Nanowires and Nanobelts.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 941, doi. 10.1007/BF02692551
- By:
- Publication type:
- Article
Arsenic Redistribution Induced by Low-Temperature Ni Silicidation at 450°C on Shallow Junctions.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 937, doi. 10.1007/BF02692550
- By:
- Publication type:
- Article
Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 929, doi. 10.1007/BF02692549
- By:
- Publication type:
- Article
Interfacial Reactions in the Sn-(Ag)/(Ni,V) Couples and Phase Equilibria of the Sn-Ni-V System at the Sn-Rich Corner.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 922, doi. 10.1007/BF02692548
- By:
- Publication type:
- Article
A Study of Electrically Conductive Adhesives as a Manufacturing Solder Alternative.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 912, doi. 10.1007/BF02692547
- By:
- Publication type:
- Article
Microstructure and Mechanical Properties Evolution of Intermetallics between Cu and Sn-3.5Ag Solder Doped by Ni-Co Additives.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 905, doi. 10.1007/BF02692546
- By:
- Publication type:
- Article
Interaction of Intermetallic Compound Formation in Cu/SnAgCu/NiAu Sandwich Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 897, doi. 10.1007/BF02692545
- By:
- Publication type:
- Article
Electromagnetic Characteristics of Nanometer Manganese Dioxide Composite Materials.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 892, doi. 10.1007/BF02692544
- By:
- Publication type:
- Article
Rapid Thermal Processing of Silicon Wafers with Emissivity Patterns.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 877, doi. 10.1007/BF02692543
- By:
- Publication type:
- Article
Structural and Optical Properties of Hexagonal Mg<sub>x</sub> Zn<sub>1-x</sub>O Thin Films.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 869, doi. 10.1007/BF02692542
- By:
- Publication type:
- Article
ZnO Spintronics and Nanowire Devices.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 862, doi. 10.1007/BF02692541
- By:
- Publication type:
- Article
Effects of Grain Size from Millimeters to Nanometers on the Flow Stress of Metals and Compounds.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 857, doi. 10.1007/BF02692540
- By:
- Publication type:
- Article
Co-Doped ZnO Dilute Magnetic Semiconductor.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 852, doi. 10.1007/BF02692539
- By:
- Publication type:
- Article
Designing Nanostructures for Sensor Applications.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 846, doi. 10.1007/BF02692538
- By:
- Publication type:
- Article
Epitaxial ZnO/Pt Layered Structures and ZnO-Pt Nanodot Composites on Sapphire (0001).
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 840, doi. 10.1007/BF02692537
- By:
- Publication type:
- Article
Ion Beam Mixing for Processing of Nanostructure Materials.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 834, doi. 10.1007/BF02692536
- By:
- Publication type:
- Article
Nano-Engineering Approaches to Self-Assembled InAs Quantum Dot Laser Medium.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 822, doi. 10.1007/BF02692535
- By:
- Publication type:
- Article
Microstructural Evolution of Nickel Nanoparticle Catalysts Supported on Gadolinium-Doped Ceria during Autothermal Reforming of Iso-Octane.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 814, doi. 10.1007/BF02692534
- By:
- Publication type:
- Article
Effect of Reducing Atmosphere on the Structure of Ceria-Supported Nano-Pt Catalysts.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 808, doi. 10.1007/BF02692533
- By:
- Publication type:
- Article
Ultradense GaN Nanopillar and Nanopore Arrays by Self-Assembly Nanopatterning.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1133, doi. 10.1007/BF02692577
- By:
- Publication type:
- Article
Interfacial Reaction between Sn-0.7Cu (-Ni) Solder and Cu Substrate.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1127, doi. 10.1007/BF02692576
- By:
- Publication type:
- Article
Analysis of Nonexponential Deep-Level Current Transients in Schottky Diodes Fabricated on [11¯00] 6H-SiC.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1122, doi. 10.1007/BF02692575
- By:
- Publication type:
- Article
Electron-Beam Hardening of Thin Films of Functionalized Polynorbornene Copolymer.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1112, doi. 10.1007/BF02692574
- By:
- Publication type:
- Article
Ammonothermal Synthesis of Aluminum Nitride Crystals on Group III-Nitride Templates.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1104, doi. 10.1007/BF02692573
- By:
- Publication type:
- Article
Comparative Study of Microstructures and Properties of Three Valuable SnAgCuRE Lead-Free Solder Alloys.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1095, doi. 10.1007/BF02692572
- By:
- Publication type:
- Article
Effect of the Polymer Matrices on the Dielectric Behavior of a Percolative High-k Polymer Composite for Embedded Capacitor Applications.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1087, doi. 10.1007/BF02692571
- By:
- Publication type:
- Article
Investigations of Strength of Copper-Bonded Wafers with Several Quantitative and Qualitative Tests.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1082, doi. 10.1007/BF02692570
- By:
- Publication type:
- Article
Direct Measurement of Local Surface Temperature of Eutectic Solder for Determining Electromigration Pattern.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1074, doi. 10.1007/BF02692569
- By:
- Publication type:
- Article
Characterization of Small-Sized Eutectic Sn-Bi Solder Bumps Fabricated using Electroplating.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1067, doi. 10.1007/BF02692568
- By:
- Publication type:
- Article
Mechanical Properties of Intermetallic Compounds on Lead-Free Solder by Moiré Techniques.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1059, doi. 10.1007/BF02692567
- By:
- Publication type:
- Article
Creep-Constitutive Behavior of Sn-3.8Ag-0.7Cu Solder Using an Internal Stress Approach.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1050, doi. 10.1007/BF02692566
- By:
- Publication type:
- Article
Interfacial Reactions between Bi-Ag High-Temperature Solders and Metallic Substrates.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1041, doi. 10.1007/BF02692565
- By:
- Publication type:
- Article
Reliability Testing of WLCSP Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1032, doi. 10.1007/BF02692564
- By:
- Publication type:
- Article
Mechanical Integrity Evaluation of Low-k Device with Bump Shear.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1025, doi. 10.1007/BF02692563
- By:
- Publication type:
- Article
Effects of Limited Cu Supply on Soldering Reactions Between SnAgCu and Ni.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1017, doi. 10.1007/BF02692562
- By:
- Publication type:
- Article
Electromigration-Induced UBM Consumption and the Resulting Failure Mechanisms in Flip-Chip Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1010, doi. 10.1007/BF02692561
- By:
- Publication type:
- Article
Local Melting Induced by Electromigration in Flip-Chip Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1005, doi. 10.1007/BF02692560
- By:
- Publication type:
- Article