Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 5

Results: 45

Laser Forming of Silicon Films Using Nanoparticle Precursor.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 993, doi. 10.1007/BF02692559

By:

Bet, Sachin;
Kar, Aravinda

Publication type:

Article

Influence of Space Charge on Lux-Ampere Characteristics of High-Resistivity CdTe.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 988, doi. 10.1007/BF02692558

By:

Franc, J.;
Grill, R.;
Kubát, J.;
Hlídek, P.;
Belas, E.;
Moravec, P.;
Höschl, P.

Publication type:

Article

Dissolution Behavior of Cu and Ag Substrates in Molten Solders.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 978, doi. 10.1007/BF02692557

By:

Po-Yi Yeh;
Jenn-Ming Song;
Kwang-Lung Lin

Publication type:

Article

Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 972, doi. 10.1007/BF02692556

By:

Yi-Shao Lai;
Chin-Li Kao

Publication type:

Article

Reliability of Adhesion Strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during Isothermal Aging.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 966, doi. 10.1007/BF02692555

By:

Chih-Yao Liu;
Moo-Chin Wang;
Min-Hsiung Hon

Publication type:

Article

A Thermomechanical Study of the Electrical Resistance of Cu Lead Interconnections.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 958, doi. 10.1007/BF02692554

By:

Liu, D. S.;
Chen, C. Y.;
Chao, Y. C.

Publication type:

Article

Fabrication of Nylon-6/Carbon Nanotube Composites.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 954, doi. 10.1007/BF02692553

By:

Xu, C.;
Jia, Z.;
Wu, D.;
Han, Q.;
Meek, T.

Publication type:

Article

Temperature and Current-Density Distributions in Flip-Chip Solder Joints with Cu Traces.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 947, doi. 10.1007/BF02692552

By:

Hsu, C. Y.;
Yao, D. J.;
Liang, S. W.;
Chih Chen;
Yeh, Everett C. C.

Publication type:

Article

Synthesis of Low-Melting Metal Oxide and Sulfide Nanowires and Nanobelts.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 941, doi. 10.1007/BF02692551

By:

Rao, R.;
Chandrasekaran, H.;
Gubbala, S.;
Sunkara, M. K.;
Daraio, C.;
Jin, S.;
Rao, A. M.

Publication type:

Article

Arsenic Redistribution Induced by Low-Temperature Ni Silicidation at 450°C on Shallow Junctions.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 937, doi. 10.1007/BF02692550

By:

Yu-Long Jiang;
Guo-Ping Ru;
Xin-Ping Qu;
Bing-Zong Li;
Agarwal, Aditya;
Poate, John;
Hossain, Khalid;
Holland, Wayne

Publication type:

Article

Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 929, doi. 10.1007/BF02692549

By:

Jenn-Ming Song;
Truan-Sheng Lui;
Yea-Luen Chang;
Li-Hui Chen

Publication type:

Article

Interfacial Reactions in the Sn-(Ag)/(Ni,V) Couples and Phase Equilibria of the Sn-Ni-V System at the Sn-Rich Corner.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 922, doi. 10.1007/BF02692548

By:

Chih-Chi Chen;
Sinn-Wen Chen;
Ching-Ya Kao

Publication type:

Article

A Study of Electrically Conductive Adhesives as a Manufacturing Solder Alternative.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 912, doi. 10.1007/BF02692547

By:

Coughlan, F. M.;
Lewis, H. J.

Publication type:

Article

Microstructure and Mechanical Properties Evolution of Intermetallics between Cu and Sn-3.5Ag Solder Doped by Ni-Co Additives.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 905, doi. 10.1007/BF02692546

By:

Gao, F.;
Takemoto, T.;
Nishikawa, H.;
Komatsu, A.

Publication type:

Article

Interaction of Intermetallic Compound Formation in Cu/SnAgCu/NiAu Sandwich Solder Joints.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 897, doi. 10.1007/BF02692545

By:

Yanghua Xia;
Chuanyan Lu;
Junling Chang;
Xiaoming Xie

Publication type:

Article

Electromagnetic Characteristics of Nanometer Manganese Dioxide Composite Materials.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 892, doi. 10.1007/BF02692544

By:

Hongtao Guan;
Shunhua Liu;
Yanbo Zhao;
Yuping Duan

Publication type:

Article

Rapid Thermal Processing of Silicon Wafers with Emissivity Patterns.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 877, doi. 10.1007/BF02692543

By:

Rabus, M.;
Fiory, A. T.;
Ravindra, N. M.;
Frisella, P.;
Agarwal, A.;
Sorsch, T.;
Miner, J.;
Ferry, E.;
Klemens, F.;
Cirelli, R.;
Mansfield, W.

Publication type:

Article

Ion Beam Mixing for Processing of Nanostructure Materials.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 834, doi. 10.1007/BF02692536

By:

Abedrabbo, S.;
Arafah, D. E.;
Gokce, O.;
Wielunski, L. S.;
Gharaibeh, M.;
Celik, O.;
Ravindra, N. M.

Publication type:

Article

Structural and Optical Properties of Hexagonal Mg<sub>x</sub> Zn<sub>1-x</sub>O Thin Films.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 869, doi. 10.1007/BF02692542

By:

Chunming Jin;
Narayan, Roger J.

Publication type:

Article

Effects of Grain Size from Millimeters to Nanometers on the Flow Stress of Metals and Compounds.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 857, doi. 10.1007/BF02692540

By:

Conrad, Hans;
Kang Jung

Publication type:

Article

Co-Doped ZnO Dilute Magnetic Semiconductor.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 852, doi. 10.1007/BF02692539

By:

Prater, John T.;
Ramachandran, Shivaraman;
Tiwari, Ashutosh;
Narayan, Jagdish

Publication type:

Article

Designing Nanostructures for Sensor Applications.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 846, doi. 10.1007/BF02692538

By:

Zhao, Y.-P.;
Li, S.-H.;
Chaney, S. B.;
Shanmukh, S.;
Fan, J.-G.;
Dluhy, R. A.;
Kisaalita, W.

Publication type:

Article

Epitaxial ZnO/Pt Layered Structures and ZnO-Pt Nanodot Composites on Sapphire (0001).

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 840, doi. 10.1007/BF02692537

By:

Chugh, Amit;
Ramachandran, S.;
Tiwari, A.;
Narayan, J.

Publication type:

Article

ZnO Spintronics and Nanowire Devices.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 862, doi. 10.1007/BF02692541

By:

Pearton, S. J.;
Norton, D. P.;
Heo, Y. W.;
Tien, L. C.;
Ivill, M. P.;
Li, Y.;
Kang, B. S.;
Ren, F.;
Kelly, J.;
Hebard, A. F.

Publication type:

Article

Nano-Engineering Approaches to Self-Assembled InAs Quantum Dot Laser Medium.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 822, doi. 10.1007/BF02692535

By:

Oktyabrsky, S.;
Tokranov, V.;
Agnello, G.;
Van Eisden, J.;
Yakimov, M.

Publication type:

Article

Microstructural Evolution of Nickel Nanoparticle Catalysts Supported on Gadolinium-Doped Ceria during Autothermal Reforming of Iso-Octane.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 814, doi. 10.1007/BF02692534

By:

Palaniyandi, Velmurugan;
Shamsuzzoha, Mohammad;
Ada, Earl T.;
Zangari, Giovanni;
Reddy, Ramana G.

Publication type:

Article

Effect of Reducing Atmosphere on the Structure of Ceria-Supported Nano-Pt Catalysts.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 808, doi. 10.1007/BF02692533

By:

Shamsuzzoha, M.;
Ada, E. T.;
Reddy, R. G.

Publication type:

Article

Ultradense GaN Nanopillar and Nanopore Arrays by Self-Assembly Nanopatterning.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1133, doi. 10.1007/BF02692577

By:

Kouklin, N. A.;
Liang, J.

Publication type:

Article

Interfacial Reaction between Sn-0.7Cu (-Ni) Solder and Cu Substrate.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1127, doi. 10.1007/BF02692576

By:

Nishikawa, Hiroshi;
Jin Yu Piao;
Takemoto, Tadashi

Publication type:

Article

Analysis of Nonexponential Deep-Level Current Transients in Schottky Diodes Fabricated on [11¯00] 6H-SiC.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1122, doi. 10.1007/BF02692575

By:

Bolotnikov, A.;
Muzykov, P.;
Sudarshan, T. S.

Publication type:

Article

Electron-Beam Hardening of Thin Films of Functionalized Polynorbornene Copolymer.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1112, doi. 10.1007/BF02692574

By:

Seongho Park;
Krotine, Jeff;
Allen, Sue Ann Bidstrup;
Kohl, Paul A.

Publication type:

Article

Ammonothermal Synthesis of Aluminum Nitride Crystals on Group III-Nitride Templates.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1104, doi. 10.1007/BF02692573

By:

Adekore, B. T.;
Rakes, K.;
Wang, B.;
Callahan, M. J.;
Pendurti, S.;
Sitar, Z.

Publication type:

Article

Comparative Study of Microstructures and Properties of Three Valuable SnAgCuRE Lead-Free Solder Alloys.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1095, doi. 10.1007/BF02692572

By:

Weimin Xiao;
Yaowu Shi;
Yongping Lei;
Zhidong Xia;
Fu Guo

Publication type:

Article

Effect of the Polymer Matrices on the Dielectric Behavior of a Percolative High-k Polymer Composite for Embedded Capacitor Applications.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1087, doi. 10.1007/BF02692571

By:

Jianwen Xu;
Wong, C. P.

Publication type:

Article

Investigations of Strength of Copper-Bonded Wafers with Several Quantitative and Qualitative Tests.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1082, doi. 10.1007/BF02692570

By:

Chen, K. N.;
Chang, S. M.;
Shen, L. C.;
Reif, R.

Publication type:

Article

Direct Measurement of Local Surface Temperature of Eutectic Solder for Determining Electromigration Pattern.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1074, doi. 10.1007/BF02692569

By:

Hasegawa, T.;
Saka, M.;
Watanabe, Y.

Publication type:

Article

Characterization of Small-Sized Eutectic Sn-Bi Solder Bumps Fabricated using Electroplating.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1067, doi. 10.1007/BF02692568

By:

Hoe-Rok Jung;
Hyuk-Hwan Kim;
Won-Jong Lee

Publication type:

Article

Mechanical Properties of Intermetallic Compounds on Lead-Free Solder by Moiré Techniques.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1059, doi. 10.1007/BF02692567

By:

Iting Tsai;
Enboa Wu;
Yen, S. F.;
Chuang, T. H.

Publication type:

Article

Creep-Constitutive Behavior of Sn-3.8Ag-0.7Cu Solder Using an Internal Stress Approach.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1050, doi. 10.1007/BF02692566

By:

Rist, Martin A.;
Plumbridge, W. J.;
Cooper, S.

Publication type:

Article

Interfacial Reactions between Bi-Ag High-Temperature Solders and Metallic Substrates.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1041, doi. 10.1007/BF02692565

By:

Jenn-Ming Song;
Hsin-Yi Chuang;
Zong-Mou Wu

Publication type:

Article

Reliability Testing of WLCSP Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1032, doi. 10.1007/BF02692564

By:

Huann-Wu Chiang;
Jun-Yuan Chen;
Ming-Chuan Chen;
Lee, Jeffrey C. B.;
Shiau, Gary

Publication type:

Article

Mechanical Integrity Evaluation of Low-k Device with Bump Shear.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1025, doi. 10.1007/BF02692563

By:

Peng Su;
Jie-Hua Zhao;
Pozder, Scott;
Wontor, David

Publication type:

Article

Effects of Limited Cu Supply on Soldering Reactions Between SnAgCu and Ni.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1017, doi. 10.1007/BF02692562

By:

Ho, C. E.;
Lin, Y. W.;
Yang, S. C.;
Kao, C. R.;
Jiang, D. S.

Publication type:

Article

Electromigration-Induced UBM Consumption and the Resulting Failure Mechanisms in Flip-Chip Solder Joints.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1010, doi. 10.1007/BF02692561

By:

Lin, Y. L.;
Chang, C. W.;
Tsai, C. M.;
Lee, C. W.;
Kao, C. R.

Publication type:

Article

Local Melting Induced by Electromigration in Flip-Chip Solder Joints.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1005, doi. 10.1007/BF02692560

By:

Tsai, C. M.;
Lin, Y. L.;
Tsai, J. Y.;
Yi-Shao Lai;
Kao, C. R.

Publication type:

Article