Synthesis of Novel Micro- and Mesoporous Zeolite Nanostructures Using Electrospinning Techniques.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 504, doi. 10.1007/BF02690538
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 3
Results: 16
1
2
Influence of Ni Concentration and Ni<sub>3</sub>Sn<sub>4</sub> Nanoparticles on Morphology of Sn-Ag-Ni Solders by Mechanical Alloying.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 494, doi. 10.1007/BF02690537
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- Publication type:
- Article
3
Controlling Intermetallic Compound Growth in SnAgCu/Ni-P Solder Joints by Nanosized Cu<sub>6</sub>Sn<sub>5</sub> Addition.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 486, doi. 10.1007/BF02690536
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- Publication type:
- Article
4
Interfacial Reactions of Sn-Ag-Cu Solders Modified by Minor Zn Alloying Addition.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 479, doi. 10.1007/BF02690535
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- Publication type:
- Article
5
Intermetallic Reactions in Sn-3.5Ag Solder Ball Grid Array Packages with Ag/Cu and Au/Ni/Cu Pads.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 471, doi. 10.1007/BF02690534
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- Publication type:
- Article
6
A Carbon Nanotube Polymer-Based Composite with High Electromagnetic Shielding.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 462, doi. 10.1007/BF02690533
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- Publication type:
- Article
7
Investigation of Mid-Infrared Type-II "W" Diode Lasers.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 453, doi. 10.1007/BF02690532
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- Publication type:
- Article
8
Processability and Reliability of Nonconductive Adhesives (NCAs) in Fine-Pitch Chip-on-Flex Applications.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 443, doi. 10.1007/BF02690531
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- Publication type:
- Article
9
Footprint Study of Ultrasonic Wedge-Bonding with Aluminum Wire on Copper Substrate.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 433, doi. 10.1007/BF02690530
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- Publication type:
- Article
10
Application of Au-Sn Eutectic Bonding in Hermetic Radio-Frequency Microelectromechanical System Wafer Level Packaging.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 425, doi. 10.1007/BF02690529
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- Publication type:
- Article
11
Polyol-Based Phase-Change Thermal Interface Materials.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 416, doi. 10.1007/BF02690528
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- Publication type:
- Article
12
Influence of Pad Shape on Self-Alignment in Electronic Packaging.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 411, doi. 10.1007/BF02690527
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- Publication type:
- Article
13
Ohmic Contact Using the Si Nano-Interlayer for Undoped-AlGaN/GaN Heterostructures.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 406, doi. 10.1007/BF02690526
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- Publication type:
- Article
14
The Formation and Growth of Intermetallic Compounds in Sn-Zn and Sn-Zn-Al Solder with Ni/Au Surface Finish Bond Pad.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 399, doi. 10.1007/BF02690525
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- Publication type:
- Article
15
Microstructure and Shear Strength Evolution of Sn-Ag-Cu Solder Bumps during Aging at Different Temperatures.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 388, doi. 10.1007/BF02690524
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- Publication type:
- Article
16
Low-Temperature Nickel-Doped Indium Tin Oxide Anode for Flexible Organic Light-Emitting Devices.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 3, p. 383, doi. 10.1007/BF02690523
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- Publication type:
- Article