Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 2
Results: 27
Effects of Strain Rates and Biaxial Stress Conditions on Plastic Yielding and Flow Stress of Solder Alloys.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 372, doi. 10.1007/BF02692459
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Cross-Interaction Between Au and Cu in Au/Sn/Cu Ternary Diffusion Couples.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 366, doi. 10.1007/BF02692458
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Effects of Annealing on the Thermoelectric and Microstructural Properties of Deformed n-Type Bi<sub>2</sub>Te<sub>3</sub>-Based Compounds.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 360, doi. 10.1007/BF02692457
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Study of Wetting Reaction Between Eutectic AuSn and Au Foil.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 353, doi. 10.1007/BF02692456
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Phase Distribution and Phase Analysis in Cu<sub>6</sub>Sn<sub>5</sub>, Ni<sub>3</sub>Sn<sub>4</sub>, and the Sn-Rich Corner in the Ternary Sn-Cu-Ni Isotherm at 240°C.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 343, doi. 10.1007/BF02692455
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Characterization Technique in Phase Distribution during Sample Preparation for Applications to Solder Joints and Wire-Bonding Chips.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 333, doi. 10.1007/BF02692454
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Solid-State Reaction in an Au Wire Connection with an Al-Cu Pad During Aging.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 323, doi. 10.1007/BF02692453
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Influence of Mn Incorporation on MBE Growth of (In,Mn)N.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 319, doi. 10.1007/BF02692452
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- Article
Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 310, doi. 10.1007/BF02692451
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Intermetallic Reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni Surface Finishes.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 302, doi. 10.1007/BF02692450
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Effects of Strain Ratio and Tensile Hold Time on Low-Cycle Fatigue of Lead-Free Sn-3.5Ag-0.5Cu Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 292, doi. 10.1007/BF02692449
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Lead Contamination of a Transient Liquid-Phase-Processed Sn-Bi Lead-Free Solder Paste.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 284, doi. 10.1007/BF02692448
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Innovative Wire Bonding Method Using a Chemically Reacted Thin Layer for Chips with Copper Interconnects.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 279, doi. 10.1007/BF02692447
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Electroless Nickel/Gold Bump in the Flip-Chip-Type CMOS Package for Mobile-Phone Camera Modules.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 273, doi. 10.1007/BF02692446
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A Comparative Study of Metamorphic InP/InGaAs Double Heterojunction Bipolar Transistors with InP and InAIP Buffer Layers Grown by Molecular Beam Epitaxy.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 266, doi. 10.1007/BF02692445
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Developing an Analytic Methodology to Accurately Predict Probing Depth in Integrated Circuit Structures.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 257, doi. 10.1007/BF02692444
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Reliability of Lead-Free Interconnections under Consecutive Thermal and Mechanical Loadings.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 250, doi. 10.1007/BF02692443
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- Article
Optimization of Active Region for 1.3-µm GaInAsP Compressive-Strain Multiple-Quantum-Well Ridge Waveguide Laser Diodes.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 243, doi. 10.1007/BF02692442
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- Article
A Diameter-Selective Chiral Separation of Single-Wall Carbon Nanotubes Using Nitronium Ions.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 235, doi. 10.1007/BF02692441
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- Article
Bonding Parameters of Blanket Copper Wafer Bonding.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 230, doi. 10.1007/BF02692440
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Chemical Vapor Deposition Synthesis of Self-Aligned Carbon Nanotube Arrays.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 192, doi. 10.1007/BF02692434
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Synthesis Optimization and Characterization of Multiwalled Carbon Nanotubes.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 211, doi. 10.1007/BF02692438
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Molecular Dynamics Study of Bamboo-Like Carbon Nanotube Nucleation.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 207, doi. 10.1007/BF02692437
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Indium and Tin Oxide Nanowires by Vapor-Liquid-Solid Growth Technique.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 200, doi. 10.1007/BF02692436
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A Rapid Growth of Aligned Carbon Nanotube Films and High-Aspect-Ratio Arrays.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 195, doi. 10.1007/BF02692435
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Effect of the Fabrication Method on the Electrical Properties of Poly(acrylonitrile-co-butadiene-co-styrene)/ Carbon Black Composites.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 224, doi. 10.1007/BF02692439
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Foreword.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 191, doi. 10.1007/BF02692433
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- Article