Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 12
Results: 13
Diffusion Behavior of Cu in Cu/Electroless Ni and Cu/Electroless Ni/Sn-37Pb Solder Joints in Flip Chip Technology.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2164, doi. 10.1007/s11664-006-0327-2
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Thickness Determination of Ultrathin Oxide Films and Its Application in Magnetic Tunnel Junctions.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2142, doi. 10.1007/s11664-006-0324-5
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Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2147, doi. 10.1007/s11664-006-0325-4
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Microstructural Characteristics and Vibration Fracture Properties of Sn-Ag-Cu-TM (TM 5 Co, Ni, and Zn) alloys.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2154, doi. 10.1007/s11664-006-0326-3
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Morphology of Intermetallic Compounds Formed between Lead-Free Sn-Zn Based Solders and Cu Substrates.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2135, doi. 10.1007/s11664-006-0323-6
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Cathodoluminescence Study of Micro-crack-induced Stress Relief for AIN Films on Si(111).
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. L15, doi. 10.1007/s11664-006-0328-1
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Nanoindentation on SnAgCu Lead-Free Solder Joints and Analysis.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2107, doi. 10.1007/s11664-006-0320-9
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Electromigration Effect on Intermetallic Growth and Young's Modulus in SAC Solder Joint.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2116, doi. 10.1007/s11664-006-0321-8
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Effect of Phosphorus Content on Cu/Ni-P/Sn-3.5Ag Solder Joint Strength after Multiple Reflows.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2126, doi. 10.1007/s11664-006-0322-7
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Morphology and Growth Pattern Transition of Intermetallic Compounds between Cu and Sn-3.5Ag Containing a Small Amount of Additives.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2081, doi. 10.1007/s11664-006-0317-4
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Microstructure and Mechanical Behavior of Novel Rare Earth--Containing Pb-Free Solders.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2088, doi. 10.1007/s11664-006-0318-3
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- Article
Effect of Reflow and Thermal Aging on the Microstructure and Microhardness of Sn-3.7Ag-xBi Solder Alloys.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2098, doi. 10.1007/s11664-006-0319-2
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- Article
The Effect of Ag Content on the Formation of Ag<sub>3</sub>Sn Plates in Sn-Ag-Cu Lead-Free Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2074, doi. 10.1007/s11664-006-0316-5
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- Article