Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 12

Results: 13

Diffusion Behavior of Cu in Cu/Electroless Ni and Cu/Electroless Ni/Sn-37Pb Solder Joints in Flip Chip Technology.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2164, doi. 10.1007/s11664-006-0327-2

By:

Yu-Ching Hsu;
Jenq-Gong Duh

Publication type:

Article

Thickness Determination of Ultrathin Oxide Films and Its Application in Magnetic Tunnel Junctions.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2142, doi. 10.1007/s11664-006-0324-5

By:

Yang, J. Joshua;
Chengxiang Ji;
Ying Yang;
Chang, Y. Austin;
Liu, Feng X.;
Pant, Bharat B.;
Schultz, Allan E.

Publication type:

Article

Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2147, doi. 10.1007/s11664-006-0325-4

By:

Lin, Y. L.;
Lai, Y. S.;
Tsai, C. M.;
Kao, C. R.

Publication type:

Article

Microstructural Characteristics and Vibration Fracture Properties of Sn-Ag-Cu-TM (TM 5 Co, Ni, and Zn) alloys.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2154, doi. 10.1007/s11664-006-0326-3

By:

Jenn-Ming Song;
Chi-Feng Huang;
Hsin-Yi Chuang

Publication type:

Article

Morphology of Intermetallic Compounds Formed between Lead-Free Sn-Zn Based Solders and Cu Substrates.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2135, doi. 10.1007/s11664-006-0323-6

By:

Chia-Wei Huang;
Kwang-Lung Lin

Publication type:

Article

Cathodoluminescence Study of Micro-crack-induced Stress Relief for AIN Films on Si(111).

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. L15, doi. 10.1007/s11664-006-0328-1

By:

Sarusi, G.;
Moshe, O.;
Khatsevich, S.;
Rich, D. H.;
Salzman, J.;
Meyler, B.;
Shandalov, M.;
Golan, Y.

Publication type:

Article

Nanoindentation on SnAgCu Lead-Free Solder Joints and Analysis.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2107, doi. 10.1007/s11664-006-0320-9

By:

Luhua Xu;
Pang, John H. L.

Publication type:

Article

Electromigration Effect on Intermetallic Growth and Young's Modulus in SAC Solder Joint.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2116, doi. 10.1007/s11664-006-0321-8

By:

Luhua Xu;
Pang, John H. L.;
Fei Ren;
Tu, K. N.

Publication type:

Article

Effect of Phosphorus Content on Cu/Ni-P/Sn-3.5Ag Solder Joint Strength after Multiple Reflows.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2126, doi. 10.1007/s11664-006-0322-7

By:

Zhong Chen;
Kumar, Aditya;
Mona, M.

Publication type:

Article

Morphology and Growth Pattern Transition of Intermetallic Compounds between Cu and Sn-3.5Ag Containing a Small Amount of Additives.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2081, doi. 10.1007/s11664-006-0317-4

By:

Feng Gao;
Takemoto, Tadashi;
Nishikawa, Hiroshi

Publication type:

Article

Microstructure and Mechanical Behavior of Novel Rare Earth--Containing Pb-Free Solders.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2088, doi. 10.1007/s11664-006-0318-3

By:

Dudek, M. A.;
Sidhu, R. S.;
Chawla, N.;
Renavikar, M.

Publication type:

Article

Effect of Reflow and Thermal Aging on the Microstructure and Microhardness of Sn-3.7Ag-xBi Solder Alloys.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2098, doi. 10.1007/s11664-006-0319-2

By:

He, M.;
Acoff, V. L.

Publication type:

Article

The Effect of Ag Content on the Formation of Ag<sub>3</sub>Sn Plates in Sn-Ag-Cu Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2074, doi. 10.1007/s11664-006-0316-5

By:

Huann-Wu Chiang;
Chang, Kennedy;
Jun-Yuan Chen

Publication type:

Article